The present invention relates generally to a vehicle vision system for a vehicle and, more particularly, to a vehicle vision system that utilizes one or more cameras at a vehicle.
Use of imaging sensors in vehicle imaging systems is common and known. Examples of such known systems are described in U.S. Pat. Nos. 5,949,331; 5,670,935 and/or 5,550,677, which are hereby incorporated herein by reference in their entireties.
A driving assistance system or vision system or imaging system for a vehicle utilizes one or more cameras (preferably one or more CMOS cameras) disposed at a vehicle and having a field of view exterior of the vehicle. An electronic control unit (ECU) comprises an image processor that is operable to process image data captured by the camera. The ECU, responsive to image processing of image data captured by the camera, is operable to provide driver assistance or driving assistance, such as for assisting a driver in driving the vehicle or for providing autonomous or semi-autonomous control of the vehicle, or such as for providing a display of video images for viewing by the driver, such as during a reversing or parking maneuver.
The vehicular camera includes a printed circuit board (PCB) having a first side and a second side separated by a thickness of the PCB. An imager is disposed at the first side of the PCB. The camera includes a lens barrel accommodating a lens. The lens barrel includes a first end and a second end. The camera includes a front camera housing that includes a first portion comprising a first material with a first coefficient of thermal expansion (CTE) and a second portion comprising a second material with a second CTE, wherein the first CTE is higher than the second CTE. The first portion of the front camera housing includes an annular surface, and an annular surface of the lens barrel is bonded to the annular surface of the first portion of the front camera housing via an adhesive. The camera includes a rear camera housing, and the front camera housing and the rear camera housing are joined together to encase and/or seal the PCB within a cavity formed by the front camera housing and the rear camera housing.
These and other objects, advantages, purposes and features of the present invention will become apparent upon review of the following specification in conjunction with the drawings.
A vehicle vision system and/or driver or driving assist system and/or object detection system and/or alert system operates to capture images exterior of the vehicle and may process the captured image data to display images and to detect objects at or near the vehicle and in the predicted path of the vehicle, such as to assist a driver of the vehicle in maneuvering the vehicle in a rearward direction. The vision system includes an image processor or image processing system that is operable to receive image data from one or more cameras and provide an output to a display device for displaying images representative of the captured image data. Optionally, the vision system may provide display, such as a rearview display or a top down or bird's eye or surround view display or the like.
Referring now to the drawings and the illustrative embodiments depicted therein, a vehicle 10 includes an imaging system or vision system 12 that includes at least one exterior viewing imaging sensor or camera, such as a rearward viewing imaging sensor or camera 14a (and the system may optionally include multiple exterior viewing imaging sensors or cameras, such as a forward viewing camera 14b at the front (or at the windshield) of the vehicle, and a sideward/rearward viewing camera 14c, 14d at respective sides of the vehicle), which captures images exterior of the vehicle, with the camera having a lens for focusing images at or onto an imaging array or imaging plane or imager of the camera (
Vehicular cameras are often exposed to harsh conditions that include extreme temperature changes. These temperature changes can lead to warping of a printed circuit board (PCB) disposed within a camera housing of the camera. Warping of the PCB can lead to focus shift of the camera, as the position of the PCB, imager, and lens change relative to each other. Implementations herein include a camera that includes combining elements having low coefficient of thermal expansion (CTE) materials with elements having high CTE materials to prevent or reduce PCB bending and warping while maximizing potential PCB size. The CTE of a material is based on an amount the material expands and contracts as a result of the temperature of the material. A material with a high CTE will expand and contract a greater amount due to temperature variations than a material with a low CTE. When not properly compensated for, such expansion/contraction can result in bending and warping of components of the camera and shift alignment/focus of the lens and imager.
The camera (such as front, side, or rear cameras 14 of
Referring now to
The high CTE material portion 30 may include a lens barrel support structure or other means of fixing the lens barrel in place. For example, the high CTE material portion includes overmolded plastic material that at least partially encapsulates the lens barrel 22. In
Thus, the high CTE material portion 30 (e.g., overmolded plastic) compensates for movement of the lens barrel 22 and/or lens elements along a Z axis (i.e., along an axis perpendicular to the plane of the imager disposed at the PCB 24), but the low CTE thin wall portion 27 limits movement in the X axis and the Y axis (i.e., along the plane of the imager disposed at the PCB 24) so that a bond between the low CTE portion 27 and the high CTE portion 30 does not break. Moreover, the high CTE portion 30 (e.g., plastic) may bond more easily to the lens barrel 22 than more traditional low CTE material (e.g., metal).
The PCB 24 may bond to the thin wall portion 27 (i.e., the low CTE material) via the adhesive 34. The thin wall portion 27 and the rear wall 29 may be connected at a mating interface 32 via, for example, laser or friction stir welding. The PCB includes a connector 36 (e.g., a multi-pin header connector or coaxial connector) that communicates electrical signals to and from the PCB 24. The connector 36 may be grounded or electrically connected to the rear wall 29 and/or the thin wall portion 27 via an electrically conductive contact 38 (e.g., a metal stamping that is overmolded or heat staked to the rear wall or cover, or that is vacuum metallization (VM) coated to make electrical contact at the rear cover. Portions of the connector 36 and or rear housing 28 may be received in or overmolded by a connector portion 40 that is configured to electrically connect to a connector of a vehicle wire harness or cable. The rear housing 28 and/or connector 36 may include sealing to seal the interior of the camera 14 from the environment.
Referring now to
Referring now to
Referring now to
The lens barrel 122 is bonded or adhered to the high CTE portion 130 after focus and alignment of the lens of the lens barrel with the imager 150 of the PCB 124, such as via, for example, an adhesive 134 between a flange of the lens barrel 122 and an upper or outer surface of the high CTE portion 130. Thus, the high CTE portion 130 separates the lens barrel 122 from the low CTE portion 127 of the front housing 126. That is, the lens barrel (which may have a similar CTE to the CTE of the high CTE portion) maintains contact with the high CTE portion 130 and is at least partially isolated from direct contact with the low CTE portion 127 of the front housing 126 and/or rear housing 128. When the adhesive 134, lens barrel 122, and/or other components of the camera 114 expand or contract (e.g., due to temperature changes), the high CTE portion 130 expands or contracts in a corresponding manner to maintain focus and alignment of the lens and imager 150.
As shown in
With the lens barrel 122 received at the lens attachment portion 130 of the front housing 126 and the PCB 124 received within the front housing 126 and/or rear housing 128, and with the imager 150 at a first side of the PCB 124 facing the lens barrel 122, a connector 136 electrically connects at and extends from a second side of the PCB opposite the first side and toward the rear housing 128. As shown in
To locate the rear housing 128 relative to the front housing 126, the rear housing may be press-fit to the front housing 126 and the rear housing may include pins 156 (
The front housing 126 may be directly mated or joined with the rear housing 128, such as via a welding joint between respective side walls of the front housing 126 and rear housing 128. For example,
Referring now to
The rear housing 228 may be a plastic rear housing having peripheral flanges and edges 226a of the front housing 226 may be crimped or clamped over the peripheral flanges of the rear housing 228 to mate or join the front and rear housings together. For example, the edge portions 226a of the front housing 226 may bend over and around the peripheral flanges of the rear housing 228. Further, the plastic rear housing 228 may include a metallic wall or shield or stamping 229 at an inner surface of the rear housing 228 facing the second surface of the PCB 224 to reduce electromagnetic interference with the imager 250 (
A connector 236 electrically connects to and extends from a side of the PCB 224 opposite the imager 250 toward and through an aperture in the rear housing 228 and is received in or overmolded by a connector portion 240 configured to electrically connect to a connector of a vehicle wire harness or cable. An electrical contact 238 may be disposed at the aperture in the rear housing 228 to electrically connect or ground the connector 236 to the metallic stamping 229. A first O-ring or seal or gasket 254 may be disposed along a passageway of the connector portion 240 and circumscribing the connector 236 and a second O-ring or seal or gasket 258 may be disposed circumscribing the rear housing 228 and at the interface between the rear and front housings to preclude moisture or contaminants from entering the housing. The plastic connector portion 240 may be directly attached, such as via a plastic laser weld, to the rear surface of the rear housing 228.
Optionally, and such as shown in
As shown in
Thus, the vehicular camera provides a housing accommodating an imager PCB and having low CTE portions that (i) maximize space available for the PCB and one or more high CTE portions and/or (ii) prevent shifting of the imager relative to the lens of the camera along a plane of the imager (i.e., X and Y axes) during temperature changes, and having high CTE portions that offset or account for movement of the lens relative to the imager along a longitudinal or viewing axis of the imager and lens (i.e., Z axis).
The camera may otherwise utilize suitable construction for controlling or accommodating changes in the camera when the camera is exposed to extreme temperatures, such as below −20 degrees C. or below −40 degrees C. and/or above 60 degrees C. or above 80 degrees C., and may utilize aspects of cameras described in U.S. Pat. Nos. 10,750,064; 10,855,890; 10,678,018; 10,645,795; 10,899,275; 10,676,041 and/or 10,911,647, and/or U.S. Publication Nos. US-2020-0033549; US-2020-0137926; US-2020-0412925 and/or US-2021-0103119, which are hereby incorporated herein by reference in their entireties.
The camera or sensor may comprise any suitable camera or sensor. Optionally, the camera may comprise a “smart camera” that includes the imaging sensor array and associated circuitry and image processing circuitry and electrical connectors and the like as part of a camera module, such as by utilizing aspects of the vision systems described in U.S. Pat. No. 10,099,614 and/or 10,071,687, which are hereby incorporated herein by reference in their entireties.
The system includes an image processor operable to process image data captured by the camera or cameras, such as for detecting objects or other vehicles or pedestrians or the like in the field of view of one or more of the cameras. For example, the image processor may comprise an image processing chip selected from the EYEQ family of image processing chips available from Mobileye Vision Technologies Ltd. of Jerusalem, Israel, and may include object detection software (such as the types described in U.S. Pat. Nos. 7,855,755; 7,720,580 and/or 7,038,577, which are hereby incorporated herein by reference in their entireties), and may analyze image data to detect vehicles and/or other objects. Responsive to such image processing, and when an object or other vehicle is detected, the system may generate an alert to the driver of the vehicle and/or may generate an overlay at the displayed image to highlight or enhance display of the detected object or vehicle, in order to enhance the driver's awareness of the detected object or vehicle or hazardous condition during a driving maneuver of the equipped vehicle.
The vehicle may include any type of sensor or sensors, such as imaging sensors or radar sensors or lidar sensors or ultrasonic sensors or the like. The imaging sensor or camera may capture image data for image processing and may comprise any suitable camera or sensing device, such as, for example, a two dimensional array of a plurality of photosensor elements arranged in at least 640 columns and 480 rows (at least a 640×480 imaging array, such as a megapixel imaging array or the like), with a respective lens focusing images onto respective portions of the array. The photosensor array may comprise a plurality of photosensor elements arranged in a photosensor array having rows and columns. The imaging array may comprise a CMOS imaging array having at least 300,000 photosensor elements or pixels, preferably at least 500,000 photosensor elements or pixels and more preferably at least one million photosensor elements or pixels arranged in rows and columns. The imaging array may capture color image data, such as via spectral filtering at the array, such as via an RGB (red, green and blue) filter or via a red/red complement filter or such as via an RCC (red, clear, clear) filter or the like. The logic and control circuit of the imaging sensor may function in any known manner, and the image processing and algorithmic processing may comprise any suitable means for processing the images and/or image data.
For example, the vision system and/or processing and/or camera and/or circuitry may utilize aspects described in U.S. Pat. Nos. 9,233,641; 9,146,898; 9,174,574; 9,090,234; 9,077,098; 8,818,042; 8,886,401; 9,077,962; 9,068,390; 9,140,789; 9,092,986; 9,205,776; 8,917,169; 8,694,224; 7,005,974; 5,760,962; 5,877,897; 5,796,094; 5,949,331; 6,222,447; 6,302,545; 6,396,397; 6,498,620; 6,523,964; 6,611,202; 6,201,642; 6,690,268; 6,717,610; 6,757,109; 6,802,617; 6,806,452; 6,822,563; 6,891,563; 6,946,978; 7,859,565; 5,550,677; 5,670,935; 6,636,258; 7,145,519; 7,161,616; 7,230,640; 7,248,283; 7,295,229; 7,301,466; 7,592,928; 7,881,496; 7,720,580; 7,038,577; 6,882,287; 5,929,786 and/or 5,786,772, and/or U.S. Publication Nos. US-2014-0340510; US-2014-0313339; US-2014-0347486; US-2014-0320658; US-2014-0336876; US-2014-0307095; US-2014-0327774; US-2014-0327772; US-2014-0320636; US-2014-0293057; US-2014-0309884; US-2014-0226012; US-2014-0293042; US-2014-0218535; US-2014-0218535; US-2014-0247354; US-2014-0247355; US-2014-0247352; US-2014-0232869; US-2014-0211009; US-2014-0160276; US-2014-0168437; US-2014-0168415; US-2014-0160291; US-2014-0152825; US-2014-0139676; US-2014-0138140; US-2014-0104426; US-2014-0098229; US-2014-0085472; US-2014-0067206; US-2014-0049646; US-2014-0052340; US-2014-0025240; US-2014-0028852; US-2014-005907; US-2013-0314503; US-2013-0298866; US-2013-0222593; US-2013-0300869; US-2013-0278769; US-2013-0258077; US-2013-0258077; US-2013-0242099; US-2013-0215271; US-2013-0141578 and/or US-2013-0002873, which are all hereby incorporated herein by reference in their entireties. The system may communicate with other communication systems via any suitable means, such as by utilizing aspects of the systems described in U.S. Pat. Nos. 10,071,687; 9,900,490; 9,126,525 and/or 9,036,026, which are hereby incorporated herein by reference in their entireties.
The imaging device and control and image processor and any associated illumination source, if applicable, may comprise any suitable components, and may utilize aspects of the cameras (such as various imaging sensors or imaging array sensors or cameras or the like, such as a CMOS imaging array sensor, a CCD sensor or other sensors or the like) and vision systems described in U.S. Pat. Nos. 5,760,962; 5,715,093; 6,922,292; 6,757,109; 6,717,610; 6,590,719; 6,201,642; 5,796,094; 6,559,435; 6,831,261; 6,822,563; 6,946,978; 7,720,580; 8,542,451; 7,965,336; 7,480,149; 5,877,897; 6,498,620; 5,670,935; 5,796,094; 6,396,397; 6,806,452; 6,690,268; 7,005,974; 7,937,667; 7,123,168; 7,004,606; 6,946,978; 7,038,577; 6,353,392; 6,320,176; 6,313,454 and/or 6,824,281, and/or International Publication Nos. WO 2009/036176; WO 2009/046268; WO 2010/099416; WO 2011/028686 and/or WO 2013/016409, and/or U.S. Publication Nos. US 2010-0020170 and/or US-2009-0244361, which are all hereby incorporated herein by reference in their entireties.
The camera assembly or module may utilize aspects of the cameras and connectors described in U.S. Pat. Nos. 10,272,857; 10,250,004; 10,230,875; 10,142,532; 9,621,769; 9,277,104; 9,077,098; 8,994,878; 8,542,451 and/or 7,965,336, and/or U.S. Publication Nos. US-2009-0244361; US-2013-0242099; US-2014-0373345; US-2015-0124098; US-2015-0222795; US-2015-0327398; US-2016-0243987; US-2016-0268716; US-2016-0286103; US-2016-0037028; US-2017-0129419; US-2017-0133811; US-2017-0201661; US-2017-0280034; US-2017-0295306 and/or US-2018-0098033, which are hereby incorporated herein by reference in their entireties.
The camera may include electrical connecting elements that accommodate tolerances in the housing and/or PCB mounting and/or connector portion. The electrical connecting elements may utilize aspects of the cameras and electrical connectors described in U.S. Pat. No. 9,233,641 and/or U.S. Publication Nos. US-2013-0242099; US-2014-0373345; US-2015-0222795; US-2015-0266430; US-2015-0365569; US-2016-0268716; US-2017-0133811; US-2017-0295306 and/or US-2017-0302829, which are hereby incorporated herein by reference in their entireties. Optionally, the electrical connections may be established via molded interconnect device (MID) technology, such as by utilizing aspects of the cameras described in U.S. Publication Nos. US-2018-0072239; US-2017-0295306 and/or US-2016-0037028, which are hereby incorporated herein by reference in their entireties.
Changes and modifications in the specifically described embodiments can be carried out without departing from the principles of the invention, which is intended to be limited only by the scope of the appended claims, as interpreted according to the principles of patent law including the doctrine of equivalents.
The present application claims priority of U.S. provisional application Ser. No. 63/366,269, filed Jun. 13, 2022, U.S. provisional application Ser. No. 63/262,148, filed Oct. 6, 2021, and U.S. provisional application Ser. No. 63/203,293, filed Jul. 16, 2021, which are hereby incorporated herein by reference in their entireties.
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