The inventions generally relate to vertical electronic packaging.
Current packaging solutions for attaching a device on a board such as a printed circuit board (PCB) and/or a motherboard in a manner that the device is vertically positioned away from the board include a package with leads crimped into female contacts that are placed in a two position housing. The assembly is covered with heat shrink to help protect and support the delicate device. This assembly is then inserted vertically onto a two pin header. However, two pin headers and mating assemblies typically have been very unstable with intermittents. Additionally, this type of arrangement requires three interconnect levels including a device (for example, a transistor) to crimped contacts level, contacts to pin header level, and header to motherboard level.
The inventions will be understood more fully from the detailed description given below and from the accompanying drawings of some embodiments of the inventions which, however, should not be taken to limit the inventions to the specific embodiments described, but are for explanation and understanding only.
Some embodiments of the inventions relate to vertical electronic packaging.
In some embodiments a holder holds an electronic device at a distance from a board and couples the electronic device to the board. One or more legs stabilize and provide 360 degree support for the electronic device in a z-axis height away from the board.
In some embodiments a system includes an electronic device, a board, and a holder. The holder holds the electronic device at a distance from the board and couples the electronic device to the board. The holder also stabilizes and provides 360 degree support for the electronic device in a z-axis height away from the board.
In some embodiments apparatus 400 includes device 402 and vertical holder 404. In some embodiments vertical holder 404 is a plastic holder (for example, using thermoplastic polycarbonate, General Electrical Corp. material LEXAN 940, and/or having a minimum UL94 flammability rating of V-2). In some embodiments vertical holder 404 provides stabilization and/or 360 degree support in z-axis height. In some embodiments holder 404 includes a positive seating retention feature to hold device 402 in the holder 404. For example, in some embodiments holder 404 includes a device retention tab 406 to provide a positive seating retention to hold device 402 in the holder 404. In some embodiments holder 404 includes a window 408 in holder 404 to allow air flow to make contact with the device 402. In some embodiments holder 404 includes a stabilizing support on the board 410 to which the device 402 and the holder 404 are attached. In some embodiments, board 410 is a printed circuit board such as a motherboard, for example. In some embodiments holder 404 includes legs 414 (including outer legs and/or middle legs as illustrated in
In some embodiments, apparatus 400 consists of a plastic holder for a vertical packaging solution to provide height, support, and/or stability to an electronic device (for example, an industry standard device). In some embodiments apparatus 400 allows for a vertical packaging solution to allow a package (for example, an industry standard package) to stand off the board (for example, motherboard) in a manner that it is arranged in system airflow in order to provide feedback to system monitoring circuitry (for example, to determine temperature within the system to get a good temperature reading without being too close to the board). In some embodiments, for example, the device 402 may act as a thermal diode in circuitry for control of system fan monitoring. In some embodiments, electronic device 402 acts as a portion of a thermal detection circuit to provide feedback relating to system thermal and/or other variables (for example, to a system monitoring circuit of a computer system in which the apparatus 400 is included).
In some embodiments a vertical plastic package contains an industry standard package. In some embodiments, for example, a package includes a retention feature to hold a device (for example, an industry standard device) in a plastic holder before being wave soldered. In some embodiments the optimized retention includes a user feedback feature to ensure positive seating (for example, a device retention tab). In some embodiments a window allows unrestricted system air flow to a device. In some embodiments support legs of a holder allow a device to be stabilized in a 360 degree area.
In some embodiments, a single interconnect is used for a vertical electronic package (for example, as illustrated in
Although some embodiments have been described in reference to particular implementations, other implementations are possible according to some embodiments. Additionally, the arrangement and/or order of circuit elements or other features illustrated in the drawings and/or described herein need not be arranged in the particular way illustrated and described. Many other arrangements are possible according to some embodiments.
In each system shown in a figure, the elements in some cases may each have a same reference number or a different reference number to suggest that the elements represented could be different and/or similar. However, an element may be flexible enough to have different implementations and work with some or all of the systems shown or described herein. The various elements shown in the figures may be the same or different. Which one is referred to as a first element and which is called a second element is arbitrary.
In the description and claims, the terms “coupled” and “connected,” along with their derivatives, may be used. It should be understood that these terms are not intended as synonyms for each other. Rather, in particular embodiments, “connected” may be used to indicate that two or more elements are in direct physical or electrical contact with each other. “Coupled” may mean that two or more elements are in direct physical or electrical contact. However, “coupled” may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other.
An embodiment is an implementation or example of the inventions. Reference in the specification to “an embodiment,” “one embodiment,” “some embodiments,” or “other embodiments” means that a particular feature, structure, or characteristic described in connection with the embodiments is included in at least some embodiments, but not necessarily all embodiments, of the inventions. The various appearances “an embodiment,” “one embodiment,” or “some embodiments” are not necessarily all referring to the same embodiments.
Not all components, features, structures, characteristics, etc. described and illustrated herein need be included in a particular embodiment or embodiments. If the specification states a component, feature, structure, or characteristic “may”, “might”, “can” or “could” be included, for example, that particular component, feature, structure, or characteristic is not required to be included. If the specification or claim refers to “a” or “an” element, that does not mean there is only one of the element. If the specification or claims refer to “an additional” element, that does not preclude there being more than one of the additional element.
Although flow diagrams and/or state diagrams may have been used herein to describe embodiments, the inventions are not limited to those diagrams or to corresponding descriptions herein. For example, flow need not move through each illustrated box or state or in exactly the same order as illustrated and described herein.
The inventions are not restricted to the particular details listed herein. Indeed, those skilled in the art having the benefit of this disclosure will appreciate that many other variations from the foregoing description and drawings may be made within the scope of the present inventions. Accordingly, it is the following claims including any amendments thereto that define the scope of the inventions.