The present invention relates to a copper alloy that can be used as a substitute for copper-beryllium (Cu—Be) alloys.
The Cu—Be alloys are widely used in many applications where they are particularly appreciated for the combination of their high electrical conductivity and very good mechanical properties. They combine a temper (solution-annealed (SA) temper) with a very high ductility allowing extreme formability (elongation superior to 40%) and another temper (age-hardened (AH) temper) with an extremely high mechanical resistance (over 1 GPa). Nevertheless, they are doomed to disappear as Be is highly toxic and the alloys using this element are progressively forbidden.
Copper-titanium (Cu—Ti) alloys represent good alternative alloys to Cu—Be. Like Cu—Be alloys, the Cu—Ti alloys are age-hardenable alloys, i.e., it is possible, under some specific conditions, to dissolve the alloying element Ti in the solid copper phase which has a face-centered cubic lattice. At this temper, often referred to as the solution-annealed temper (SA), the material provides usually the maximum formability. When the Cu—Ti alloys are aged at an intermediate temperature, usually between 300° C. and 550° C., the Ti precipitates into a finely and uniformly dispersed a-Cu4Ti tetragonal nano-metastable phase (from 20 to 200 nm large), which considerably increases the strength of the alloy. If the alloy is maintained longer in temperature, larger orthogonal stable phases, referred to as B—Cu4Ti or Cu3Ti in the literature, form as cells on the grain boundaries and are detrimental for the mechanical properties of the alloy. This phenomenon is called “over-ageing”.
Most of current developments aim at hindering the formation of Cu3Ti and/or increasing the electrical conductivity of Cu—Ti alloys for electric applications. To solve any of these challenges, the content of Ti is often kept under 4 wt. %.
US patent application No. 2004/0136861 discloses a copper alloy for use in connector materials and intended to have excellent bendability and to be preserved from the precipitation of Cu3Ti. This copper alloy contains from 2 to 4 wt. % of Ti and from 0.01 to 0.5 wt. % of at least one element selected from Fe, Co, Ni, Cr, V, Zr, B and P as a third element group, wherein not less than 50% of the total content of the third element group exists as a second-phase particle.
The present invention focuses on all the applications of Cu—Be that do not require good electrical conductivity but only high mechanical resistance. This allows adding a larger amount of Ti, usually detrimental to electrical conductivity. It is known that when Ti is added in the alloy in high amount (over 4% by weight), the Cu—Ti alloys exhibit a yield strength comparable with Cu—Be but suffer from a low ductility in the solution-annealed temper due to the difficulty of keeping the Ti in solid solution during the water quench which ends the solution annealing. For example, in a study on the effect of increasing the amount of Ti, S. Nagarjuna et al. obtained an elongation of only 23% with a Cu—Ti alloy containing 5.4 wt. % of Ti (see the article “On the variation of mechanical properties with solute content in Cu—Ti alloys”, by S. Nagarjuna et al., Materials Science and Engineering A259 (1999) 34-42).
U.S. Pat. No. 4,599,119 discloses an age-hardened copper-titanium alloy containing from 2 to 6%, preferably from 3 to 5%, by weight of titanium and having an average crystal grain size not greater than 25 microns, preferably between 3 and 15 microns. Besides copper and titanium, this alloy may contain at least one element among iron, zirconium, chromium, boron and silicon, not exceeding 2% by weight in a total amount. In this document, the small crystal grain size is considered to improve mechanical properties of Cu—Ti such as isotropy, formability, fatigue strength, elongation and yield strength. The small crystal grain size is achieved through appropriate heat treatments, including a pre-annealing at intermediate temperatures to form spherical precipitates mentioned as a secondary phase. No particular effect is mentioned with regard to the possible use of iron, zirconium, chromium, boron or silicon. This patent does not address the problem caused by high amounts of titanium (over 4%) to the ductility of the alloy.
U.S. Pat. No. 2,783,143 discloses an age-hardenable copper-base alloy having improved strength and ductility in the age-hardened temper. This alloy contains from 1 to 10% titanium, from 0.1 to 1.6% cobalt, from 0.05 to 0.8% chromium, from 0.04 to 0.62% nickel, from 0.04 to 0.60% iron, from 0.02 to 0.28% molybdenum and from 0.005 to 0.08% manganese. Preferably, this alloy contains from 2 to 6% titanium, from 0.2 to 0.8% cobalt, from 0.1 to 0.4% chromium, from 0.08 to 0.31% nickel, from 0.075 to 0.3% iron, from 0.035 to 0.14% molybdenum and from 0.01 to 0.04% manganese. Although not mentioned, the indicated percentages seem to be atomic percentages. In the examples shown, the content of titanium is 4%, which corresponds to about 3 wt. %. This patent focuses on the ductility in the age-hardened temper and does not mention the ductility before the age hardening, i.e., in the solution-annealed temper aiming at providing the maximum formability. Moreover, this patent does not address the problem caused by high amounts of titanium (over 4 wt. %) to the ductility of the alloy.
International patent application No. WO 2021/143257 discloses a titanium bronze alloy for explosion-proof tools. The alloy comprises, by weight, from 5 to 7% titanium, from 0.8 to 1.5% aluminum, from 0.1 to 0.3% silver, from 0.2 to 0.4% iron, from 0.03 to 0.08% rare earth, the balance being copper. This document does not mention the ductility in the solution-annealed temper. Moreover, the alloy proposed is expensive due to the presence of silver.
Japanese patent application No. JP 2021/050393 discloses a titanium copper alloy plate for a vapor chamber. According to one example, the alloy comprises, by weight, 4.8% of titanium and 0.2% of iron. A comparative example is mentioned which comprises, by weight, 5.2% of titanium and 0.2% of iron. The alloy in this document does not have an optimum ductility in the solution-annealed temper.
An object of the present invention is to provide a copper-titanium alloy which can have both an excellent ductility in the solution-annealed temper and a high yield strength after an ageing treatment.
To this end, there is provided a copper-titanium alloy comprising, by weight, at least 90% copper, from 5 to 7% titanium and from 0.25 to 0.5% iron.
The content of titanium, by weight, is preferably at least 5.2%, preferably at least 5.5%, preferably at least 6%, and is preferably at most 6.5%.
The content of iron, by weight, is preferably at most 0.4% and preferably at most 0.35%.
The copper-titanium alloy may further comprise aluminum at a content of not more than 1.4% by weight, preferably at a content of from 0.1 to 1.4% by weight, preferably at a content of from 0.1 to 0.7% by weight, preferably at a content of from 0.1 to 0.6% by weight.
Preferably, the copper-titanium alloy comprises no or little silver, i.e., the content of silver in the alloy is at most 0.08%, preferably at most 0.07%, preferably at most 0.06% by weight.
The present invention further provides a method for manufacturing the copper-titanium alloy as defined above, with improved formability, comprising a solution annealing step comprising a heat treatment performed at a temperature of at least 840° C. followed by a quench (fast cooling).
Other features and advantages of the present invention will be apparent upon reading the following detailed description made with reference to the appended drawings in which:
Copper-titanium alloys have been studied in the last century. They are conventionally manufactured by implementing the following sequence:
At the end of the solution annealing, the alloy is soft and can thus be easily deformed to take its final shape. At the end of the ageing step, the alloy has a higher yield strength, but the latter depends on the content of Ti. It has been shown that increasing the content of Ti up to 7 wt. % increases the strength of the alloy in the age-hardened temper. However, it was then observed that with more than 4 wt. % Ti in the alloy, it is impossible to keep the Ti in solid solution after the water quench.
This results in a wave-like microstructure observed in TEM (transmission electron microscopy). The mechanism behind this observation is controversial but always relates to an early-stage precipitation, resulting in a large increase in strength and a decrease in the ductility. This behavior is problematic, as it makes it impossible to produce a binary Cu—Ti alloy with high strength at the age-hardened temper (more than 850 MPa) and with high formability (elongation superior to 30%) at the solution-annealed temper.
The present invention is based on the observation that small additions of Fe (0.25 to 0.5 wt. %, preferably 0.25 to 0.4 wt. %, preferably 0.25 to 0.35 wt. %) combined with a high content of Ti (5 to 7 wt. %, preferably 5.2 to 7 wt. %, preferably 5.5 to 7 wt. %, preferably 5.5 to 6.5 wt. %) results in suppressing this early-stage precipitation and keeping the titanium in solid solution. This allows doubling the elongation of the alloy in the solution-annealed temper, reaching then more than 40% and even more than 50% plastic deformation (elongation), while keeping, or even increasing, the yield strength of the alloy in the age-hardened temper (more than 900-1000 MPa). For reaching higher and more isotropic mechanical properties, the grain size is preferred to be inferior to 30 μm.
The content of Cu in the alloy of the invention is at least 90 wt. %. Excellent results are obtained when only Cu, Ti and Fe (and unavoidable impurities) are present in the alloy. Addition of one or more other elements such as Co, Zr, Si, P, Ni, Sn, Zn, Pb, Mn, Mg, As, Sb and Cr is not excluded in the invention but no improvement in terms of ductility in the solution-annealed temper and yield strength in the age-hardened temper has been observed with such added elements. A deterioration of the results with respect to Cu—Ti—Fe may even occur if the added element, e.g. Co, reacts with Fe. The technical effect in the invention indeed relies on the action of Fe combined with a high content (5-7 wt. %) of Ti. Specifically in this high range of Ti, small additions of Fe increase considerably the ductility of the alloy. Unlike the aforementioned other elements, Fe has a special effect on Ti precipitation and ductility. Its role is expected to be in solid solution or through the formation of new nano-precipitates but not through the formation of secondary phases as described in US 2004/0136861.
Given the high content of titanium in the invention, the solution heat treatment of the solution annealing (step d) above) is performed at a temperature of at least 840° C., preferably of at least 850° C., preferably of at least 880° C.
Detailed test results will now be set out with reference to the appended figures. The Cu—Ti—Fe alloys on which these results are based were manufactured as follows. Different model alloys T1, T2, T3, T4, T6 and T7 were casted from high purity copper metal, iron and titanium sponges. About 500 g of metal were weighted and melted in a sealed induction furnace under argon gas. After holding the temperature during 5 min at 1250° C. the alloys were poured in a graphite crucible to form 150×50×11 mm ingots. The resulting chemical compositions were analyzed in the middle of each ingot by Inductively Coupled Plasma-Atomic Emission Spectrometry (ICP-AES) and are shown in the table below, in weight percentages:
The indications “<0.01” mean that the presence of the corresponding element in the alloy is not measurable. The Si in the alloys T1 to T7 is an impurity. Likewise, the P in the alloy T2 is an impurity. The thermomechanical treatments were adapted to the amount of Ti for each alloy. The ingots were homogenized to get rid of the solidification chemical segregations, and then were hot rolled (HR) at 850° C. under air, reducing the plates from 11 mm to 3.6 mm thick in three successive passes, in order to ensure a good dynamic recrystallization and small equiaxed grains. The alloys were successively cold rolled (CR), solution annealed with a flux of argon and water quenched (SA). These processes were repeated a large number of times to reach a thickness of 0.5 mm. The SA temperature and CR were tailored to reach a grain size under 60 μm. A grain size under 30 μm is preferred to reach better and more isotropic mechanical properties. These samples are referred to as the SA tempers in the following. Some of the specimens were then aged at 450° C., under Ar gas during 2 h to produce the temper referred to as AH (age-hardened) temper.
More particularly,
The Cu-6Ti-0.3Fe also exhibits a very profitable balance between yield strength and elongation at the age-hardened temper. This balance between strength and formability is superior to the one in the commercial Cu—Be alloys and the standard commercial Cu-15Ni-8Sn alternative. Unlike comparable commercial alloys on the market, the Cu-6Ti-0.3Fe in the age-hardened state can reach a yield stress superior to 1 GPa with an elongation superior to 15%.
The physical mechanism in which micro-additions of Fe are effective is illustrated in
To avoid spinodal decomposition, it is required that the content of Fe be sufficiently high.
The content of Fe must however not be too high since otherwise large undesired TiFe intermetallics are formed which have a negative impact on the ductility and mechanical properties of the alloy. Such large intermetallics are visible in
As already mentioned, the addition of one or more elements in the alloy according to the invention is not excluded.
The alloy according to the invention can replace the Cu—Be alloys in any very high strength alloy application requiring good mechanical properties and where a good electrical conductivity is not needed, for example the Bourdon tubes in high-pressure manometers, parts of timepieces (e.g., watch cases, gears, escapements, balances, springs, shafts, oscillating weights, plates, bridges, hands, dials, discs, etc.), ball-roller bearings and bushings, in particular for the aircraft and airspace industry, and dies for plastic extrusion.
Number | Date | Country | Kind |
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2119630.9 | Aug 2021 | EP | regional |
This application is the US national stage of PCT/IB2022/057654, filed Aug. 16, 2022 and designating the United States, which claims the priority of EP 21191630.9, filed Aug. 17, 2021. The entire contents of each foregoing application are incorporated herein by reference.
Filing Document | Filing Date | Country | Kind |
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PCT/IB2022/057654 | 8/16/2022 | WO |