1. Field of the Invention
The present invention provides a voltage clamper, and more particularly, to a voltage clamper capable of providing a corresponding voltage drop according to an external input voltage.
2. Description of the Prior Art
With the progressive development of semiconductor processes, many different circuits are integrated into integrated circuits to drive the development of electronic products. For example, one memory chip may comprise a plurality of memory cells for storing data. Owing to the development of semiconductor processes, more memory cells are accommodated in a same area on a memory chip. Typically, the operation voltages of internal devices are limited in a voltage range according to the spec of integrated circuits. For example, the operation voltage of the above-mentioned memory chip must be limited in a voltage range to allow the memory chip to function normally. When the operation voltage supplied to the memory chip is too high, structural damage to the memory cells in the memory chip may cause reliability issues in data storage of memory cells. Oppositely, the operation voltage may not be able to successfully drive the memory cells to store data in a predetermined period of time when the operation voltage supplied to the memory chip is too low. Therefore, the memory chip must operate under a low clock. In other words, an operation voltage that is too low will affect the performance of the memory chip greatly.
Generally speaking, the same memory chip can be applied to different devices and used for storing data temporarily. However, different devices may be supplied with different external voltages. For example, the power supply module of one device provides a voltage level of 3.6V, but the power supply module of another device provides a voltage level of 1.6V. Therefore, the prior art memory chip utilizes a voltage drop circuit to transform the external voltage to the internal operation voltage that is applicable to the memory chip. For example, the voltage drop circuit may generate a fixed voltage drop of 1V. Under the circumstances, the range of the operation voltage of the memory chip to function normally is 2.6V-1.6V, based on the spec of the voltage drop circuit. In other words, the memory chip having such a voltage drop circuit can be only applied to devices supplied with an external voltage ranging from 3.6V to 2.6V. When the memory chip having such a voltage drop circuit is applied to a device supplied with an external voltage of 4V, the operation voltage of the memory chip will exceed the normally functional range of the operation voltage of the memory chip (2.6V-1.6V), since the operation voltage of the memory chip, used for driving the internal memory cells, is 3V after the voltage drop circuit applies a voltage drop of 1V to the external voltage. As a result, reliability issues arise when the memory chip is storing data. Similarly, the operation voltage of the memory chip, used for driving the internal memory cells, is 1V after the voltage drop circuit applies a voltage drop of 1V to the external voltage when the memory chip having such a voltage drop circuit is applied to a device supplied with an external voltage of 2V. Since 1V is not within the normally functional range of the operation voltage of the memory chip (2.6V-1.6V), the performance of the memory chip is greatly affected due to this operation voltage that is too low, as mentioned previously.
Since a fixed voltage drop is generated by the voltage drop circuit utilized in the prior art memory chip, the application range of the memory chip is limited by the fixed voltage drop. As mentioned previously, the memory chip can be only applied to devices supplied with an external voltage ranging from 3.6V to 2.6V because a 1V voltage drop is generated by the voltage drop circuit and the normally functional range of the operation voltage of the memory chip is 2.6V-1.6V. When the memory chip is applied to a device supplied with an external voltage of 4V, the voltage drop circuit on the memory chip needs to be re-designed to lift the voltage drop generated by itself. Similarly, when the memory chip is applied to a device supplied with an external voltage of 2V, the voltage drop circuit on the memory chip also needs to be re-designed to reduce the voltage drop generated by itself. Therefore, the production cost of the memory chip is greatly raised to make the memory chip not competitive.
It is therefore a primary objective of the present invention to provide a voltage clamper to determine a corresponding voltage drop according to an external input voltage to resolve the above-mentioned problems.
According to the claimed invention, a voltage clamper for generating an output voltage by adjusting an input voltage age is disclosed. The voltage clamper comprises a bias circuit for generating at least a bias voltage according to the input voltage, a voltage drop circuit for applying a voltage drop to the input voltage, and a voltage detection circuit electrically connected to the voltage drop circuit and the bias circuit for generating the output voltage through adjusting the voltage drop generated from the voltage drop circuit according to the bias voltage.
According to the claimed invention, a voltage adjusting method for generating an output voltage by adjusting an input voltage is disclosed. The voltage adjusting method comprises setting a plurality of voltage segments corresponding to a plurality of different voltage drop setting values, and utilizing one of the voltage drop setting values to trigger a voltage difference between the output voltage and the input voltage corresponding to the voltage drop setting value when the input voltage is within one of the voltage segments.
It is an advantage of the claimed invention that the present invention voltage clamper dynamically determines the voltage drop applied in the voltage drop operation according to the voltage level of the external input voltage, rather than applying a fixed voltage drop. Therefore, the present invention voltage clamper can maintain the output voltage within the corresponding range of the operation voltage of the device utilizing the present invention voltage clamper, no matter if the external input voltage has a high voltage level or a low voltage level. As a result, the phenomena of insufficient voltage drop and over high voltage drop, which usually occur when utilizing the prior art voltage clamper, do not occur when utilizing the present invention voltage clamper.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after having read the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
Please refer to FIG. 1.
The voltage detection unit 20a receives the bias voltage V1 to generate a control signal D1 according to the bias voltage V1, the voltage detection unit 20b receives the bias voltage V2 to generate a control signal D2 according to the bias voltage V2, and the voltage detection unit 20n receives the bias voltage Vn to generate a control signal Dn according to the bias voltage Vn. In this preferred embodiment, each voltage detection unit 20a, 20b, 20n in the voltage detection circuit 14 is used for detecting a same predetermined voltage level. That means, each voltage detection unit 20a, 20b, 20n sieves the bias voltages V1, V2, Vn according to the predetermined voltage level and decides whether to output the control signal D1, D2, Dn to activate the voltage drop unit 22a, 22b, 22n or not. Each voltage drop unit 22a, 22b, 22n is used to apply a different voltage drop to the input voltage Vin to adjust the voltage level of the output voltage Vout. For example, the voltage drop unit 22a may make the input voltage Vin generate a voltage drop of dV1. That means, the output voltage Vout will be approximately equal to Vin−dV1 when the voltage drop unit 22a is activated. Similarly, the voltage drop unit 22b may make the input voltage Vin generate a voltage drop of dV2. That means, the output voltage Vout will be approximately equal to Vin−dV2 when the voltage drop unit 22b is activated. The voltage drop unit 22n may make the input voltage Vin generate a voltage drop of dVn. That means, the output voltage Vout will be approximately equal to Vin dVn when the voltage drop unit 22n is activated. Therefore, the voltage drops between the output voltage Vout and the input voltage Vin are controlled by the voltage drop units 22a, 22b, 22n. Furthermore, a predetermined voltage drop unit 23 is installed in the voltage drop circuit 16 to apply an initial voltage drop to the input voltage Vin to affect the output voltage Vout when the voltage age clamper 10 is activated.
Please refer to FIG. 2.
In the voltage detection unit 20a, the operation of inverters 32a, 32b, 32c is similar to that of a prior art Schmitt trigger, and an inverter 32d functions as a buffer. In addition, a substrate, a source, and a drain of a transistor 28f are connected to ground. Therefore, the transistor 28f functions as a capacitor module to stabilize the control signal D1. When the transistor 28b is turned on, the loop formed by the inverters 32b, 32c will maintain an input terminal of the inverter 32d at the low logic level “0”, and the transistor 28e is turned on. When the transistor 28b is not turned on, the loop formed by the inverters 32b, 32c will maintain the input terminal of the inverter 32d at the high logic level “1”, and the transistor 28e is not turned on. For the voltage detection unit 20b, the operation of inverters 34a, 34b, 34c is similar to that of the prior art Schmitt trigger, and inverters 34d, 34e function as buffers. In addition, a substrate, a source, and a drain of a transistor 30f are connected to ground. Therefore, the transistor 30f functions as a capacitor module to stabilize the control signal D2. When the transistor 30b is turned on, the loop formed by the inverters 34b, 34c will maintain an input terminal of the inverter 34d at the low logic level “0”, and a transistor 30e is turned on. When the transistor 30b is not turned on, the loop formed by the inverters 34b, 34c will maintain the input terminal of the inverter 34d at the high logic level “1”, and the transistor 30e is not turned on.
The voltage drop unit 22a comprises a transistor 36, and the voltage drop unit 22b comprises a transistor 38. In this preferred embodiment, the transistor 36 is a P-type metal-oxide-semiconductor (PMOS) transistor, and the transistor 38 is an N-type metal-oxide-semiconductor (NMOS) transistor. As well known by those skilled in the art, a P-type metal-oxide-semiconductor transistor is a good switch device, and an N-type metal-oxide-semiconductor transistor is a bad switch device, when transferring a high logic level “1”. In other words, the voltage level at a drain of the transistor 36 is approximately equal to that at a source of the transistor 36 (that means the input voltage Vin) when the transistor 36 is turned on. However, the voltage level at a drain of the transistor 38 is greater than that at a source of the transistor 38 when the transistor 38 is turned on. In other words, the voltage level at the source of the transistor 38 is approximately equal to Vin−Vt, rather than the input voltage Vin. It is worth noting that Vt is the threshold voltage corresponding to a channel of the transistor 38. In addition, the predetermined voltage drop unit 23 comprises two transistors 40a, 40b in this preferred embodiment, and transistors 40a, 40b are both N-type metal-oxide-semiconductor transistors. As shown in
Please refer to FIG. 2 and FIG. 3.
As shown in
It is worth noting that gates of the transistors 28c, 28d of the voltage detection unit 20a are all triggered by a control signal CEB in the voltage clamper 10 in FIG. 2. Similarly, gates of the transistors 30c, 30d of the voltage detection unit 20b are all triggered by the same control signal CEB. The present invention voltage clamper 10 supports chip enable control to achieve the objective of low current consumption. The voltage clamper 10 can switch to a standby mode or a normal mode according to the external control signal CEB. For example, the voltage clamper 10 will enter the standby mode when the control signal CEB is at the high voltage level. At this time, the transistors 28c, 30c are not turned on, and the control signal CEB will turn on the transistors 28d, 30d. In other words, only the predetermined voltage drop unit 23 is activated when the voltage clamper 10 enters the standby mode, and the voltage drop units 22a, 22b cannot be turned on to adjust the output voltage Vout. Therefore, a greater voltage difference (that is 2*Vt) exists between the output voltage Vout and the input voltage Vin. For a device utilizing the voltage clamper 10, the device will output the control signal CEB to the voltage clamper 10 when entering the standby mode. Since the output voltage Vout of the voltage clamper 10 in the standby mode is lower, the current consumed by the device in the standby mode is smaller to reduce power consumption. Oppositely, the control signal CEB will be at the low voltage level to trigger the voltage clamper 10 to enter the normal mode when the device wants to exit the standby mode and enter the normal mode. As shown in
If the present invention voltage clamper 10 is applied to a memory chip, and the normally functional range of the operation voltage of the memory chip is between the voltage level of Vtop and the voltage level of Vbot, the memory chip can operate smoothly when the input voltage Vin is between the voltage level of Vtop and the voltage level of VH(VH>Vbot), as shown from the relationship between the output voltage Vout and the input voltage Vin in FIG. 3. Therefore, the greater the input voltage Vin is, the greater voltage drop between the input voltage Vin and the output voltage Vout is triggered by the voltage clamper 10. Oppositely, the smaller the input voltage Vin is, the smaller voltage drop between the input voltage Vin and the output voltage Vout is triggered by the voltage clamper 10. For example, the normally functional range of the operation voltage of the memory chip is 2.6V-1.6V. When the power supply module of a device supplies a high driving voltage of (2.6+2*Vt), the voltage clamper 10 will help to transform the input voltage (2.6+2*Vt) into an output voltage of 2.6V and transfer the output voltage (2.6V) to the memory chip to trigger the memory chip. The memory chip thus operates smoothly under such a high driving voltage. However, when the power supply module of a device supplies a low driving voltage of 1.6V, the voltage clamper 10 will not adjust the output voltage. That means, the output voltage is equal to the input voltage 1.6V, and the voltage clamper 10 will transfer the output voltage (1.6V) to the memory chip to trigger the memory chip. As a result, the memory chip can function normally under a low external voltage.
When the driving voltage supplied by the power supply module in a device is between the voltage level of VH and the voltage level of (Vs)2, the memory chip utilizing the voltage damper 10 can function normally in the device. Similarly, the memory chip utilizing the voltage damper 10 can function normally in the device when the driving voltage supplied by the power supply module is between the voltage level of (Vs)1 and the voltage level of (Vs)2, and between the voltage level of Vbot and the voltage level of (Vs)1. However, there is a problem when the driving voltage supplied by the power supply module approaches (Vs)1 or (Vs)2. It is known that the predetermined voltage level originally set by the voltage detection units 20a, 20b will control the voltage damper 10 to trigger the output voltage Vout to generate changes of the voltage levels, when the voltage levels of Vout the input voltage Vin are (VS)1 and (VS)2. In other words, the output voltage Vout will hop between two voltage levels if vibration of the driving voltage supplied by the power supply module occurs in the neighborhood of the voltage level of (Vs)1 or (Vs)2. As a result, the memory chip generates unexpected errors. In order to resolve the problem, the voltage detection unit 20a further comprises an adjusting module 44 and the voltage detection unit 20b further comprises an adjusting module 46. The adjusting modules 44, 46 are used for adjusting the predetermined voltage levels detected by the voltage detection units 20a, 20b. Please refer to FIG. 4.
As mentioned previously, the operation of the voltage clamper 10 is to set the voltage detection units 20a, 20b, 20n to detect the same predetermined voltage level, and each of the bias unit 18a, 18b, 18n generates each of the different bias voltages V1, V2, Vn according to the input voltage Vin. Therefore, the magnitude of the input voltage Vin is determined according to the bias voltages V1, V2 , Vn and the predetermined voltage level to control the activation of the voltage drop units 22a, 22b, 22n. As a result, the voltage drop between the input voltage Vin and the output voltage Vout is adjusted. However, the objective of dynamically determining the voltage drop applied in the voltage drop operation according to the voltage level of the input voltage can be achieved by setting the voltage detection units 20a, 20b, 20n to detect different predetermined voltage levels and each of the bias units 18a, 18b, 18n to generate a same bias voltage according to the input voltage Vin. For example, each of the bias units 18a, 18b is set to generate a same bias voltage Vb according to the input voltage Vin. That means, the high input voltage Vin is transformed into the low bias voltage Vb. In addition, each of the voltage detection units 20a, 20b is set to detect different predetermined voltage levels of Vd1, Vd2, and the predetermined voltage level of Vd1 is smaller than the predetermined voltage level of Vd2. It is very obvious that the greater the input voltage Vin is, the greater the bias voltage Vb is. Oppositely, the smaller the input voltage Vin is, the smaller the bias voltage Vb is. Therefore, the bias voltage Vb can be used to represent the magnitude of the input voltage Vin. When the bias voltage Vb is greater than the predetermined voltage level of Vd2, only the predetermined voltage drop unit 23 is activated. When the bias voltage Vb is between the predetermined voltage level of Vd1 and the predetermined voltage level of Vd2, both the predetermined voltage drop unit 23 and the voltage drop unit 22b are activated. When the bias voltage Vb is smaller than the predetermined voltage level of Vd1, the predetermined voltage drop unit 23 and the voltage drop units 22a, 22b are activated. Consequently, the above-mentioned relationship between the input voltage Vin and the output voltage Vout is shown in FIG. 3. Therefore, the bias circuit 12 and the voltage detection circuit 14 may be set in such a manner as to trigger the voltage drop circuit 16, according to the voltage level of the input voltage Vin, so that the voltage difference between the output voltage Vout and the input voltage Vin corresponds to different voltage drops according to different voltage levels of the input voltage Vin.
Compared to the prior art voltage clamper, the present invention voltage clamper utilizes the bias circuit and the voltage detection circuit to judge the voltage level of the now applied external input voltage, and determine the corresponding voltage difference between the output voltage and the input voltage according to the voltage level. According to the present invention voltage clamper, a plurality of voltage segments are set and each of the voltage segments corresponds to a specific voltage drop to adjust the output voltage. A greater voltage drop is applied to the input voltage corresponding to the voltage segment having a higher voltage level to generate the expected output voltage. Oppositely, a smaller voltage drop is applied to the input voltage corresponding to the voltage segment having a lower voltage level to generate the expected output voltage. In other words, the present invention voltage clamper will apply a greater voltage drop, according to the input voltage, to greatly reduce the output voltage when the input voltage has a high voltage level. Therefore, the problem that one device (such as a memory chip), triggered by the output voltage generated by the voltage clamper according to the external input voltage, cannot function normally owing to the output voltage exceeding the normally functional range of the operation voltage of the device is avoided. In addition, the present invention voltage clamper will not perform the voltage drop operation when the input voltage has a low voltage level. Therefore, the performance of one device (such as a memory chip), triggered by the output voltage generated by the voltage clamper according to the external input voltage, is not greatly affected due to the output voltage being smaller than the normally functional range of the operation voltage of the device. In summary, the present invention voltage clamper dynamically determines the voltage drop applied in the voltage drop operation according to the voltage level of the external input voltage, rather than applying a fixed voltage drop. The present invention voltage clamper thus can maintain the output voltage within the range of the operation voltage of the device utilizing the present invention voltage clamper, no matter if the external input voltage has a high voltage level or a low voltage level. As a result, the phenomena of an insufficient voltage drop and an overly high voltage drop, which usually occur when utilizing the prior art voltage clamper, do not occur when utilizing the present invention voltage clamper.
Those skilled in the art will readily observe that numerous modifications and alterations of the device may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Number | Date | Country | Kind |
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92123322 A | Aug 2003 | TW | national |
Number | Name | Date | Kind |
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6677801 | Shimomura | Jan 2004 | B2 |
Number | Date | Country | |
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20050046468 A1 | Mar 2005 | US |