Disclosed embodiments herein relate generally to the regulation of voltage in electrical circuits, and more particularly to a voltage regulator capable of generating a positive temperature coefficient for self-compensation, as well as related methods of regulating voltage.
In recent years, there continues to be dramatic density increases in integrated circuit technology for semiconductor chips. For example, the minimum feature size of lithography, such as the size of MOSFETs, has been reduced to one micrometer and below. In the fabrication of precision capacitors in conjunction with FET devices on the same chip at these reduced dimensions, it is increasingly difficult to maintain manufacturing parameters such that precise outputs from these devices are still available.
Many applications implemented on modern semiconductor chips require accurate voltages. A classic example is writeable memory, which requires the amplitude of the erase voltage to balance the write voltage of the writeable memory cells. If the erase voltage does not accurately match the write voltage, the memory cell will typically continue to store a binary “1” value, rather than the intended “0” binary value. To insure that the write voltage and erase voltage are generated properly, an on-chip voltage regulation circuit (e.g., a voltage regulator) is typically required.
Unfortunately, there are several on-chip and environmental effects that consistently counteract the regulation of on-chip voltages. Examples of these include temperature effects and manufacturing process variations. Relatively extreme variations in temperature, for example, the operating temperature of active devices within a voltage regulator, often affect the resistance, capacitance, voltage and current flow of on-chip components, and thus the overall semiconductor chip itself. In addition, process variations typically affect line spacings and the thickness of oxides, metals, and other layers of the semiconductor wafer, which consequently can affect on-chip voltages. This disclosure is directed to combating the problems caused by temperature fluctuations and process variations in voltage regulator circuitry.
Disclosed herein is a voltage regulator for regulating a boost voltage generated by a boost circuit to compensate an applied voltage of an electrical circuit. In one embodiment, the voltage regulator includes a regulated voltage input operable to receive a regulated voltage derived from the boost voltage, a reference voltage input operable to receive a constant reference voltage, and a control voltage output operable to provide a feedback output voltage to the boost circuit for controlling the generated boost voltage. In addition, the voltage regulator includes at least one active load element coupled to the regulated voltage input, the reference voltage input, and the control voltage output, and operable to produce the feedback output voltage based on a comparison of the regulated voltage to the reference voltage. In such an embodiment, the at least one active load element has one or more performance characteristics affecting the comparison and thus the feedback output voltage. The voltage regulator still further includes a variable current source coupled to the control voltage output and having one or more performance characteristics, where the variable current source is operable to generate a variable current at the control voltage output to mitigate the affect of the one or more performance characteristics of the at least one active load element on the comparison and the feedback output voltage such that the boost circuit generates the boost voltage to be substantially constant.
Also disclosed is a method of regulating a boost voltage generated by a boost circuit. In one embodiment, the method includes receiving a regulated voltage derived from the boost voltage and receiving a constant reference voltage. The method also includes producing a feedback output voltage based on a comparison of the regulated voltage to the reference voltage, where the producing is affected by one or more performance characteristics. Also the method includes providing the feedback output voltage to the boost circuit for controlling the generated boost voltage. Furthermore, in this embodiment, the method also includes generating a variable current associated with the feedback output voltage to mitigate the affect of the one or more performance characteristics on the comparison and the feedback output voltage such that the boost voltage is generated to be substantially constant, where the variable current is also affected by one or more performance characteristics.
For a more complete understanding of the principles disclosure herein, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
Referring initially to
Conventional boosted voltage regulator circuits 110 are widely utilized in many applications requiring a positive boosted voltage VBOOST higher than the applied voltage of the overall circuit in the application. Alternatively, a negative boosted voltage below ground is provided, as the application varies. For example, when the boosted voltage VBOOST reaches or goes over the regulated level, the regulator 110 will shut down the charge pump 120 so that the positive boosted voltage VBOOST Stops increasing. Conversely, when the boosted voltage VBOOST is below the regulated level, the regulator 110 will allow the charge pump 120 to supply the necessary amount of boosted voltage VBOOST.
Unfortunately, the boosted voltage VBOOST regulated by a conventional boosted voltage regulator will typically decrease as operating temperature for the circuit increases. To illustrate this point, attention is turned to
Looking now at
For either voltage regulator 310, 320, the voltage across the source and gate nodes (|VGS|) of the transistors M0, M1, M2 is:
VGS=VREG−VREF, (1)
and a current through the transistors M0, M1, M2 (Id) is provided. Therefore, during normal operation, the current source S0, S1 draws a constant current IREF through the transistors M0, M1, M2 such that the absolute value of the voltage across the source and gate nodes (|VGS|) of the transistors M0, M1, M2 is equal to the absolute value of the respective threshold voltage (|VTH|) for those transistors M0, M1, M2. Thus, in the first voltage regulator circuit 310, when:
|VREG−VREF|>|VTH|(M0), (2)
the drain current (Id) of M0 will overcome the reference current IREF causing the output VOUT of the voltage regulator 310 to move from low to high. Similarly, in the second voltage regulator circuit 320, when:
|VREG−VREF|>|VTH|(M1)+|VTH|(M2), (3)
the drain current (Id) of the transistors M1, M2 will overcome the reference current IREF causing the output VOUT of the voltage regulator 320 to move from low to high. For both circuits 310, 320, when the output VOUT goes high, the charge pump (see
Therefore, the transfer point for the voltage regulator output VOUT of circuit 310 is defined in equation (4):
VREG=VREF+|VTH|, (4)
where VREF is the reference voltage and VTH is the threshold voltage of the transistor devices having a negative temperature coefficient. Consequently, the negative temperature coefficient of the transistors M0, M1, M2 results in the regulator voltage VREG decreasing, and thus an incorrect output voltage VOUT, as their temperature increases due to a drop in each transistor's threshold voltage VTH (see
VREG=VREF+N*|VTH|, (5)
where VREF and VTH are as defined above for equation (1), and N is the number of PMOS devices in the voltage regulator circuit 320 in series between the output voltage node VOUT and the regulator voltage VREG.
Looking briefly at
Turning now to
The voltage regulator 500 of
As mentioned above, during the boosting of voltage at the output VOUT of the voltage regulator 500, the threshold voltage VTH of the transistors M3, M4 in the base circuit 510 decreases as temperature increases. This results in the threshold voltage VTH being overcome at a lower regulator voltage VREG, which causes the drain current Id to increase too soon and make the output voltage VOUT prematurely high. Accordingly, the disclosed voltage regulator 500 is configured to overcome the problems associated with threshold voltage VTH decline at high temperatures, by incorporating this characteristic of MOSFET threshold voltage VTH into a leakage current source 520 that provides a positive temperature coefficient to the base circuit 510.
As illustrated in
VREG=VREF+N*|VTH|+ΔV(Ip-leak). (6)
As before, VREF and VTH are as defined above, N is the number of PMOS devices that are placed in series between the output voltage node VOUT and the regulator voltage VREG, and V(Ip-leak) is a positive temperature coefficient item created by the leakage current Ip-leak drawn by the leakage current source 520. The ΔV(Ip-leak) is the cumulative threshold voltage VTH difference across the N transistors based on their drain/source currents IDS when the leakage current Ip-leak is drawn.
During operation, the PMOS M5 is biased at an OFF state because the gate is coupled to the power supply VDD; thus, the gate-source voltage VGS of PMOS M5 is 0 Volts. As a result, the current Ioff drawn from PMOS M5 is an off current or a sub-threshold current or a sub-threshold leakage. However, the current Ioff from PMOS M5 rapidly increases as its temperature rises during operation. This current Ioff then drains through NMOS M6. Transistors M6 and M7 are coupled together to form a current mirror. Therefore, as the current drained from PMOS M5 through NMOS M6 is magnified, the magnification is mirrored through NMOS M7 to draw a current Ip-leak. The ratio of magnification corresponds to the ratio of transistor size for NMOS M7 over NMOS M6.
As illustrated, the leakage current Ip-leak is pulled from the drain of the first transistor M3, where the output voltage VOUT is tapped. As mentioned above, when the current through PMOS M3 overcomes the reference current IREF (which remains constant), the output voltage VOUT increases. Since the increasing temperature typically results in the drain current Id overcoming the reference IREF current sooner than desired, because the decreased threshold voltage VTH is overcome by a lower regulator voltage VREG, the leakage current Ip-leak compensates for the premature drain current Id so that the output voltage VOUT does not increase as quickly. Since the amount of leakage current Ip-leak is proportional to the temperature increase (through PMOS M5), when the drain current Id increases based on the threshold voltage VTH degradation caused by increasing temperature, the leakage current Ip-leak proportionally increases based on that same increasing temperature. By proportionally compensating for this threshold voltage VTH decline, the output voltage VOUT is not allowed to go high until a higher regulator voltage VREG is reached. As a result, the regulator voltage VREG is allowed to reach substantially the same amount that would be required make the output VOUT high if increasing temperature did not decrease the threshold voltage VTH of NMOS M3 and M4 in the first place (i.e., before increased temperature degraded the threshold voltage VTH). Looking briefly at
In addition, with a voltage regulator circuit constructed according to the disclosed principles, the voltage expense of generating the leakage current Ip-leak by operating the leakage current source 520 as disclosed above is relatively low, especially in low temperature situations. A still further benefit of the disclosed voltage regulator circuit is that the same or similar compensation may be provided if the threshold voltage VTH decline is caused by process variation when manufacturing the circuit. In this situation, as before, PMOS M5 will have a current Ioff leaking therethrough because of the same threshold voltage VTH decline based on a process corner variation in all the MOSFETs in the regulator circuit. As a result, the leakage current Ip-leak generated by the leakage current source disclosed herein will equally compensate the decline in threshold voltage VTH found in the base circuit MOSFETs in spite of manufacturing process variations.
Turning now to
Similar to the conventional positive regulator circuits 310, 320, for either negative voltage regulator 710, 720, the current source S3, S4 draws a constant current IREF through the transistors M9, M10, M11 such that the absolute value of the voltage across the source and gates (|VGS|) of each transistor M9, M10, M11 is almost equal to the absolute value of the respective threshold voltage (|VTH|) for those transistors M9, M10, M11. However, since the voltage regulators 710, 720 in
VREG=VREF−|VTH|, (7)
while the transfer point for the output voltage VOUT of the second circuit 720 is defined by equation (8):
VREG=VREF−N*|VTH|. (8)
As with the prior equations, VREF is the reference voltage, VTH is the threshold voltage of the transistor devices M9, M10, M11, and N is the number of transistor devices employed in the voltage regulator circuit 720. Also as with conventional PMOS circuits, increased temperatures can degrade the threshold voltages VTH of the NMOS devices, resulting in inaccurate regulation of the regulator voltage VREG by altering the state of the output signal VOUT.
Turning finally to
The voltage regulator 800 of
In order to properly boost voltage at the output VOUT in a negative boost application, and thus to create the positive temperature coefficient discussed above, a leakage current source 820 is created with the third, fourth and fifth transistor devices M14, M15, M16, and is coupled to the base circuit 810. As this current begins to flow through NMOS M14 it reaches PMOS M15, providing a magnification of the current. The magnified current is then mirrored by PMOS M16 as leakage current In-leak. In this negative boost application, the leakage current source 820 creates the leakage current In-leak and provides it to the base circuit 810 of the voltage regulator 800 at the source of NMOS M12, where the output voltage VOUT is tapped, in order to compensate the constant reference current IREF when needed, so as to prevent the output voltage VOUT from changing states (low vs. high) prematurely because of increases in temperature (that cause the threshold voltages VTH of NMOS M12 and M13 to decline). Equation (8) (or equation (7), in one transistor regulator circuits) may thus be derived into equation (9):
VREG=VREF−N*|VTH|−ΔV(In-leak), (9)
where VREF, N, and VTH are as defined above, and V(In-leak) is the positive temperature coefficient item in the negative boost application that is created by the leakage current In-leak provided by the leakage current source 820. The ΔV(In-leak) is the cumulative threshold voltage VTH difference across the N transistors based on their drain/source currents IDS when the leakage current In-leak is provided. Thus, with a voltage regulator based on the circuit 800 illustrated in
While various embodiments of voltage regulator circuits, and methods for regulating voltages, according to the principles disclosed herein have been described above, it should be understood that they have been presented by way of example only, and not limitation. Thus, the breadth and scope of the invention(s) should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with any claims and their equivalents issuing from this disclosure. Furthermore, the above advantages and features are provided in described embodiments, but shall not limit the application of such issued claims to processes and structures accomplishing any or all of the above advantages.
Additionally, the section headings herein are provided for consistency with the suggestions under 37 CFR 1.77 or otherwise to provide organizational cues. These headings shall not limit or characterize the invention(s) set out in any claims that may issue from this disclosure. Specifically and by way of example, although the headings refer to a “Technical Field,” such claims should not be limited by the language chosen under this heading to describe the so-called technical field. Further, a description of a technology in the “Background” is not to be construed as an admission that technology is prior art to any invention(s) in this disclosure. Neither is the “Brief Summary” to be considered as a characterization of the invention(s) set forth in issued claims. Furthermore, any reference in this disclosure to “invention” in the singular should not be used to argue that there is only a single point of novelty in this disclosure. Multiple inventions may be set forth according to the limitations of the multiple claims issuing from this disclosure, and such claims accordingly define the invention(s), and their equivalents, that are protected thereby. In all instances, the scope of such claims shall be considered on their own merits in light of this disclosure, but should not be constrained by the headings set forth herein.