This application relates to the field of electronic components, and more specifically, capacitors and the manufacture of capacitors.
Wet capacitors are used in the design of circuits due to their volumetric efficiency, stable electrical parameters, high reliability and long service life. Such capacitors typically have a larger capacitance per unit volume than certain other types of capacitors, making them valuable in high-current, high power and low-frequency electrical circuits. One type of wet capacitor is a wet electrolytic capacitor including an anode, a cathode, and a fluid electrolyte. Wet electrolytic capacitors tend to offer a good combination of high capacitance with low leakage current. Wet electrolytic capacitors are basic to various types of electrical equipment from satellites, aerospace, airborne, military group support, oil exploration, power supplies, and the like.
Known wet electrolytic capacitors are generally characterized as having a generally cylindrical shape and axial leaded terminations suited for Through-Hole Mounting (THM). Generally, tantalum electrolytic capacitors are known to have a general cylindrical shape and axial lead terminations suited for THM.
THM assembly technology was standard practice for capacitors until the late 1980s, when Surface-Mount Technology (SMT), resulting in Surface Mount Devices (SMDs), largely replaced THM for a variety of cost and efficiency reasons. For example, THM requires the drilling of holes in the printed circuit board (PCB), which is expensive and time consuming. Component assembly speed for SMT is generally faster than that of THM because THM requires soldering on both sides of the board, as opposed to surface-mounts, which typically require attention to only one side of the PCB. THM assembly generally uses wave, selective, or hand-soldering techniques, which are much less reliable and repeatable than reflow ovens used for surface mounting. Furthermore, SMT components are generally smaller than its THM counterparts because they have either smaller leads or no leads at all.
One way to improve volumetric efficiency is to use a high performing material, for example, tantalum (Ta), Niobium (Nb), or Niobium Oxide (NbO), for the anode material. Certain solid core or pellet surface mount capacitors of this general type are known in the art. Examples can be seen at U.S. Pat. Nos. 6,380,577, 6,238,444, and 7,161,797, which are incorporated by reference herein. In those patents, examples show a solid interior core (sometimes called an anode body, slug or pellet) is primarily Ta. The tantalum anode body is usually sintered. A wire is commonly formed in the anode body in one of two ways: (a) “embedded” meaning the wire (which also can be tantalum) is covered with tantalum powder during a pressing process; or (b) “welded” meaning after the pellet is pressed and sintered, the wire is welded to the Ta slug. The other end extends outside the slug. The capacitor dielectric material is made by anodic oxidation of the anode material to form an oxide layer over the surface of the anode body (e.g., Ta to Ta2O5). If the anode body is Nb the oxidation is Nb to Nb2O5; if NbO, the oxidation is NbO to Nb2O5. A capacitor cathode is commonly formed by coating the dielectric layer with a solid electrolyte layer (e.g., of MnO2) and a conductive polymer, and later covered with graphite and silver for better conductivity and improved mechanical strength. Anode and cathode terminations can be connected to the free end of the Ta wire and the outer electrolyte surface coating of the Ta pellet, respectively, and all these components can then be encapsulated within a case (e.g., by molding plastic around the components), leaving only outer surface(s) of the anode and cathode terminations exposed on the exterior of the case for, e.g., surface mounting.
As can be appreciated, such known capacitors do not utilize a tantalum case or “can,” or a “wet” (fluid) electrolyte. Thus, they do not address the issue of volumetric efficiency when introducing a fluid electrolyte into a pre-formed tantalum case or can. They also do not address how to effectively seal such a case when the fluid electrolyte has been introduced.
There remains a need, then, for an improved wet electrolytic capacitor having a tantalum case, and in particular, for an improved wet electrolytic capacitor suitable for surface mounting and having improved volumetric efficiency. Further, there is a need for a capacitor having an improved construction for introducing an electrolyte into the interior of the capacitor body, without taking up valuable space in or on the capacitor body.
In one aspect of the present invention, a wet electrolytic surface mount capacitor is provided having a case with a fill port located through a wall of the body of the capacitor. A fluid electrolyte is introduced into the interior of the body through the fill port. The fill port is sealed by a compressible fill port plug and a fill port cover.
The present invention is also directed to, in another aspect, a wet electrolytic surface mount capacitor including a body defining an interior area and having a fill port formed through a wall of the body. The body has a cathode end and an opposite anode end, and is preferably tantalum. A capacitive element is positioned in an interior of the body and isolated from the body. A surface mount anode termination is provided in electrical communication with the capacitive element and isolated from the body. A surface mount cathode termination is provided in electrical communication with the body. An electrolyte is contained in the interior area of the body, and is introduced into the interior area of the body through the fill port. A fill port plug is positioned adjacent the fill port. A fill port cover is positioned on the body to compress the fill port plug against the fill port to seal the fill port. The fill port cover may be welded to the body.
A method of forming a cathode is also provided. A method of making a wet electrolytic surface mount capacitor, may preferably comprise the steps of: forming a body defining an interior area, the body having an open anode end and an opposite closed cathode end; forming a fill port through a wall of the body; placing a capacitive element in the interior area of the body and isolating the capacitive element from the body; placing a cover over the anode end; introducing an electrolyte into the interior area of the body through the fill port; positioning a fill port plug adjacent the fill port; attaching the fill port cover to an outer surface of the body over the fill port plug to compress the fill port plug against the fill port to seal the fill port; forming a surface mount anode termination on an outer surface of the capacitor in electrical communication with the capacitive element and isolated from the body; and forming a surface mount cathode termination on an outer surface of the capacitor in electrical communication with the body.
A more detailed understanding may be had from the following description, given by way of example in conjunction with the accompanying drawings wherein:
Certain terminology is used in the following description for convenience only and is not limiting. The words “right,” “left,” “top,” and “bottom” designate directions in the drawings to which reference is made. The words “a” and “one,” as used in the claims and in the corresponding portions of the specification, are defined as including one or more of the referenced item unless specifically stated otherwise. This terminology includes the words above specifically mentioned, derivatives thereof, and words of similar import. The phrase “at least one” followed by a list of two or more items, such as “A, B, or C,” means any individual one of A, B or C, as well as any combination thereof.
As shown in
As shown in
As shown in
As shown in
As shown in
As shown in
As stated, the capacitive element comprises a solid pellet anode body 230, with an embedded or welded wire in the anode body. A dielectric layer is formed by oxidation of the anode body and an electrolyte layer forms over the dielectric layer.
Considering the capacitor 200 from the anode end 206, a glass-to-metal seal (GTMS) cover 234 is positioned adjacent the anode end 206 within the walls of the body 202 of the capacitor 200, and is welded in place to effectively seal the originally open anode end 206. The cover 234 includes a conductive metal outer portion 237 formed from tantalum, and a non-conductive central insert portion 236 formed from glass and including an anode tube 242. As shown in
The GTMS cover 234 is placed at the anode end opening of the tantalum case 202, while the anode wire 232 is inserted into the anode tube 242. The anode tube 242 is electrically isolated from the tantalum outer portion 237 by a glass bead forming the insert portion 236 that is inserted into the GTMS (glass-to-metal-seal) structure. During manufacture, the GTMS cover 234 is welded to the case 202 while the anode wire 232 is welded to the anode tube 242 within the GTMS central insert portion 236 creating the anode of the capacitor. Accordingly, the GTMS cover 234 comprises several components that are essentially fused together to form a single cover 234 unit: the tantalum (metal) outer portion 237, glass (non-conductive) central insert portion 236, and the tantalum anode tube 242.
As shown, for example, in
An anode termination 254 includes a first wall portion 256 and a second wall portion 258 that is bent generally perpendicularly to the first wall portion 256. The first wall portion 256 is positioned vertically in the orientation of the Figures, and includes an opening 260 aligned with opening 244 and opening 252. The first wall portion 256 may have inwardly angled edges adjacent its top corners, as shown in
As shown in
A cathode termination 280 includes a first wall portion 282 and a second wall portion 284 that is bent generally perpendicularly to the first wall portion 282. The first wall portion 282 is positioned vertically in the orientation of the Figures, and is positioned adjacent the cathode end 208 of the body 202. The cathode termination 280 is essentially L-shaped. The second wall portion 284 is positioned horizontally in the orientation of the Figures, and is positioned along the bottom 216 of the body 202, and adjacent the cathode end 208.
A fluid electrolyte 300 is introduced into the interior area 203 of the capacitor 200 through the fill port 218. A fill port plug 302 is used to close the fill port 218, and is positioned adjacent the fill port 218 along an outer surface of the body 202. The fill port plug 302 preferably comprises a compressible material such as rubber, for example a synthetic rubber, and/or a fluoropolymer elastomer or plastic. The fill port plug 302 is compressible, and may be a, oblong, spherical, or funnel-shaped plug so as to fit in a complimentary manner within the funnel-shaped fill port 218. A fill port cover 304, which preferably comprises tantalum, is provided over the fill port plug 302, and compresses the fill port plug 302 into the fill port 218, thus effectively sealing the fill port 218 and thus the body of the capacitor. The fill port cover 304 may preferably be welded to the body 202. The electrolyte 300 fills the space of the interior area 203 between the capacitive element 230 and the cathode layer 211 and body 202, and provides for electrical communication between those.
As shown schematically as flow diagrams in
As illustrated in
As illustrated in
The capacitor assembly is illustrated in
An insulative wrapping 215 is provided to cover the body 202 [528].
An isolative shim 249 is placed over the cover 234 [530], with the openings in the isolative shim 249 and the anode tube 242 aligned. An anode termination 254 is placed over the isolative shim 249 and the raised lip portion 262 of the anode termination is welded to the anode tube 242 [532].
A cathode termination 280 is placed over the cathode end 208 of the body 202 [534], and the first wall portion 282 of the cathode termination 280 is welded to the capacitor body 202 adjacent the cathode end 208.
It is appreciated that the steps shown in
As described herein, a wet electrolytic surface mount capacitor is provided having an increased volumetric efficiency, by virtue of, inter alia, providing a fill port through a wall of a capacitor body in order to introduce the fluid electrolyte into the interior area of the capacitor body. The single fill port-plug-cover arrangement of the invention saves critical space for various components of the capacitor, and provides more flexibility in positioning, sizing and arranging various components of the capacitor. In addition, the anode terminal and the cathode termination form surface mount terminations for mounting the capacitor to, for example, a printed circuit board.
Although the features and elements of the present invention are described in the example embodiments in particular combinations, each feature may be used alone without the other features and elements of the example embodiments or in various combinations with or without other features and elements of the present invention.
Number | Name | Date | Kind |
---|---|---|---|
3956819 | Augeri | May 1976 | A |
4987519 | Hutchins et al. | Jan 1991 | A |
6238444 | Cadwallader | May 2001 | B1 |
6380577 | Cadwallader | Apr 2002 | B1 |
6560089 | Miltich et al. | May 2003 | B2 |
6594140 | Evans et al. | Jul 2003 | B1 |
6707660 | Evans et al. | Mar 2004 | B1 |
6791821 | Monnett | Sep 2004 | B1 |
6850405 | Mileham et al. | Feb 2005 | B1 |
6859353 | Elliott et al. | Feb 2005 | B2 |
6952339 | Knowles | Oct 2005 | B1 |
7274551 | Parler, Jr. et al. | Sep 2007 | B1 |
7983022 | O'Connor et al. | Jul 2011 | B2 |
8086312 | Nielsen et al. | Dec 2011 | B2 |
8238079 | Knowles | Aug 2012 | B1 |
8259435 | Millman et al. | Sep 2012 | B2 |
8339769 | Schott et al. | Dec 2012 | B2 |
8405956 | Dreissig et al. | Mar 2013 | B2 |
8451586 | Priban | May 2013 | B2 |
8477479 | Pease et al. | Jul 2013 | B2 |
8576544 | Rawal et al. | Nov 2013 | B2 |
8605411 | Biler et al. | Dec 2013 | B2 |
8687347 | Bates et al. | Apr 2014 | B2 |
9070512 | Breithaupt et al. | Jun 2015 | B2 |
9076592 | Masheder et al. | Jul 2015 | B2 |
9105401 | Dreissig et al. | Aug 2015 | B2 |
20030088293 | Clarke et al. | May 2003 | A1 |
20040225327 | Norton et al. | Nov 2004 | A1 |
20050195558 | Goldberger et al. | Sep 2005 | A1 |
20060023400 | Sherwood | Feb 2006 | A1 |
20060291140 | Kazaryan | Dec 2006 | A1 |
20080232029 | Ning | Sep 2008 | A1 |
20080247122 | Vaisman et al. | Oct 2008 | A1 |
20100175235 | Nielsen et al. | Jul 2010 | A1 |
20100268292 | Eidelman et al. | Oct 2010 | A1 |
20100297495 | Casby et al. | Nov 2010 | A1 |
20120087062 | Kurita | Apr 2012 | A1 |
20120106029 | Galvagni et al. | May 2012 | A1 |
20120127632 | Evans et al. | May 2012 | A1 |
20120257327 | Zednickova et al. | Oct 2012 | A1 |
20130095299 | Evans | Apr 2013 | A1 |
20140104755 | Hagiwara et al. | Apr 2014 | A1 |
20140268499 | O'Phelan et al. | Sep 2014 | A1 |
20150127060 | Eidelman et al. | May 2015 | A1 |
20150179349 | Biler et al. | Jun 2015 | A1 |
Number | Date | Country | |
---|---|---|---|
20170140876 A1 | May 2017 | US |