Wafer aligner

Information

  • Patent Grant
  • D1003327
  • Patent Number
    D1,003,327
  • Date Filed
    Monday, December 13, 2021
    3 years ago
  • Date Issued
    Tuesday, October 31, 2023
    a year ago
  • Inventors
    • Liu; Jonus
    • Huang; Jheng-Fu
    • Tseng; Yi-Chan
    • Huang; Shou-Yang
  • Original Assignees
  • Examiners
    • Agilee; Omeed
    • Butac; Fritzgerald L
    Agents
    • Wang Law Firm, Inc.
  • US Classifications
    Field of Search
    • US
    • D15 122
    • D15 199
    • D10 81
    • D16 230-234
    • D24 108
    • D24 164
    • D24 168-170
    • D24 233
    • D26 27
    • CPC
    • H01L21/68707
    • H01L21/682
    • H01L21/67017
    • H01L21/6715
  • International Classifications
    • 1509
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a perspective view of a wafer aligner showing our new design;



FIG. 2 is a front view thereof;



FIG. 3 is a rear view thereof;



FIG. 4 is a left side view thereof;



FIG. 5 is a right side view thereof;



FIG. 6 is a top plan view thereof; and,



FIG. 7 is a bottom plan view thereof.


The broken lines show portions of a wafer aligner that form no part of claimed design.


Claims
  • The ornamental design for a wafer aligner, as shown and described.
US Referenced Citations (12)
Number Name Date Kind
D323173 Ishii Jan 1992 S
D580061 Adams Nov 2008 S
D583059 Adams Dec 2008 S
D612879 Nagasaka Mar 2010 S
D776290 Wan Jan 2017 S
D783692 Strothmann Apr 2017 S
D798349 Li Sep 2017 S
D843006 Huang Mar 2019 S
D914884 Glassett Mar 2021 S
D917585 Okuma Apr 2021 S
D927565 Yao Aug 2021 S
D976971 Chen Jan 2023 S