Claims
- 1. A stator for a helicoidal progressing cavity transducer comprising a plurality of wafers, each having an internal wall substantially perpendicular to the wafer surface and arranged one after the other in array, each having a bifoil opening of the same geometry and the same height and the same minor and major axis, the axis of each wafer angularly displaced counterclockwise from the like axis of adjacent wafers in the array of wafers, by an angle a in degrees which is given by the formula: ##EQU10## where (h) is the thickness of the wafer, (P.sub.s) is the length of one pitch of the stator, and means to securely fasten said wafers to each other in said array.
- 2. A stator according to claim 1, in which the ratio of the thickness (h) of the wafer to the pitch of the stator (P.sub.s) is in the range of about 0.05 to about 4 .times. 10.sup..sup.-4.
- 3. The stator of claim 1, in which the wafer is metallic and said ratio of ( h/P.sub.s), is in the range of about 0.02 to about 4 .times. 10.sup..sup.-4.
- 4. A transducer comprising a stator according to claim 1 and a helicoidal rotor having a circular cross section and a pitch length (P.sub.r) one-half the pitch length (P.sub.s) of the stator, and a circular cross section diameter (D) which is not substantially less than the minor axis (D.sub.s) of the bifoil.
- 5. The transducer of claim 4, in which the ratio of the thickness of the wafer (h) to the pitch of the stator (P.sub.s) is in the range of about 0.05 to about 1 .times. 10.sup..sup.-4 but not limited by this range.
- 6. The transducer of claim 4, in which the wafer is metallic and in which the ratio of the thickness (h) to the pitch of the stator (P.sub.s) is in the range of about 0.02 to about 4 .times. 10.sup..sup.-4.
- 7. The transducer of claim 4, in which the thickness of the wafer ( h) is related to the eccentricity (E) of the rotor, its diameter D.sub.r and the pitch (P.sub.s) of the stator and the length of the tangents of the bifoil of the wafer (nE) such that ##EQU11## is not more than about 0.05.
- 8. The transducer of claim 7, in which the ratio of the thickness of the wafer (h) to the pitch of the stator (P.sub.s) is in the range of about 0.05 to about 4 .times. 10.sup..sup.-4.
- 9. The transducer of claim 7, in which the wafer is metallic and has a ratio of the thickness (h) to the stator pitch (P.sub.s) of from about 0.02 to about 4 .times. 10.sup..sup.-4.
- 10. The transducer of claim 7, in which the minor axis of the wafer is greater than the diameter of the rotor by the value: ##EQU12##
- 11. The transducer of claim 10, in which the thickness of the wafer (h) to the stator pitch (P.sub.s) is in the range of about 0.05 to about 4 .times. 10.sup..sup.-4.
- 12. The transducer of claim 10, in which the wafers are metallic and the ratio of the thickness of the wafers ( h) to the stator pitch (P.sub.s) is in the range of about 0.02 to about 4 .times. 10.sup..sup.-4.
- 13. A method of forming a laminated stator which comprises mounting a form having a helicoidal surface of pitch (P.sub.s) and whose cross section through its length contains a bifoil opening of uniform geometry and dimensions, assembling in a longitudinal array on the said form, a plurality of wafers having an opening of the same bifoil geometry and having an internal surface substantially perpendicular to the wafer surface, and having thickness (h), which is a small fraction of the said pitch (P.sub.s), securing said wafers to each other against angular displacement, removing said form from said longitudinal array.
- 14. The method of claim 13, in which the minor axis of the bifoil cross section of the wafer opening being greater than the minor axis of the form cross section in the amount at least equal
- to about ##EQU13## where: ##EQU14## and where (nE) is equal to the tangent length of the bifoil opening of the wafer and (P.sub.s) is the pitch of the form, and (h) is the thickness of the wafer.
- 15. The method of claim 13, which comprises inserting into said array of wafers a second form, having the same helicoidal geometric formation as said first-named form but having cross-sectional major and minor axis, positioning said second form centrally of the wafer bifoil opening of said array to form a uniform space between the internal surface of said wafer array and said second form, injecting elastomeric compound into the said space to form a uniform lining between the internal surface of said array of wafers and the external surface of said second form, curing said lining and withdrawing said second core.
- 16. The method of claim 13, in which the ratio of the thickness of the wafer (h) to the pitch of the form (P.sub.s) is not more than about 0.05.
- 17. The method of claim 16, which comprises inserting into said array of wafers a second form, having the same helicoidal geometric formation as said first-named form but having a small cross-sectional major and minor axis, positioning said second form centrally of the wafer bifoil opening of said array to form a uniform space between the internal surface of said wafer array and said second form, injecting elastomeric compound into the said space to form a uniform lining between the internal surface of said array of wafers and the external surface of said second form, curing said lining and withdrawing said second core.
- 18. The method of claim 13, in which the bifoil opening of said wafer has major and minor axes greater than the major and minor axes of the bifoil cross section of said form.
- 19. The method of claim 18, in which the wafer is metallic and has a ratio of the thickness (h) of the wafer to the pitch of the form (P.sub.s) in the range of about 0.02 to about 4 .times. 10.sup..sup.-4.
Parent Case Info
This application is a continuation-in-part of application Ser. No. 415,754 filed Nov. 14, 1973, now abandoned, and application Ser. No. 433,540 filed Jan. 15, 1974, now U.S. Pat. No. 3,912,426.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
3652192 |
Kramer et al. |
Mar 1972 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
1,275,697 |
Oct 1961 |
FR |
735,690 |
Jun 1966 |
CA |
Related Publications (1)
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Number |
Date |
Country |
|
433540 |
Jan 1974 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
415754 |
Nov 1973 |
|