Wafer handling assembly

Information

  • Patent Grant
  • D803283
  • Patent Number
    D803,283
  • Date Filed
    Monday, May 16, 2016
    8 years ago
  • Date Issued
    Tuesday, November 21, 2017
    6 years ago
  • US Classifications
    Field of Search
    • US
    • D03 315
    • D13 182
    • D15 138
    • CPC
    • B25J15/0028
    • B25J15/0052
    • B25J11/0095
    • H01L21/6838
    • H01L21/68742
  • International Classifications
    • 1509
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a top perspective view of a first embodiment of a wafer handling assembly.



FIG. 2 is a top view of the wafer handling assembly of FIG. 1.



FIG. 3 is a side view of the wafer handling assembly of FIG. 1.



FIG. 4 is another side view of the wafer handling assembly of FIG. 1.



FIG. 5 is a bottom perspective view of the wafer handling assembly of FIG. 1.



FIG. 6 is a top perspective view of a second embodiment of a wafer handling assembly.



FIG. 7 is a top view of the wafer handling assembly of FIG. 6.



FIG. 8 is a side view of the wafer handling assembly of FIG. 6.



FIG. 9 is another side view of the wafer handling assembly of FIG. 6.



FIG. 10 is a bottom perspective view of the wafer handling assembly of FIG. 6.



FIG. 11 is a top perspective view of a third embodiment of a wafer handling assembly.



FIG. 12 is a top view of the wafer handling assembly of FIG. 11.



FIG. 13 is a side view of the wafer handling assembly of FIG. 11.



FIG. 14 is another side view of the wafer handling assembly of FIG. 11.



FIG. 15 is a bottom perspective view of the wafer handling assembly of FIG. 11.



FIG. 16 is a top perspective view of a fourth embodiment of a wafer handling assembly.



FIG. 17 is a top view of the wafer handling assembly of FIG. 16.



FIG. 18 is a side view of the wafer handling assembly of FIG. 16.



FIG. 19 is another side view of the wafer handling assembly of FIG. 16.



FIG. 20 is a bottom perspective view of the wafer handling assembly of FIG. 16.



FIG. 21 is a top perspective view of a fifth embodiment of a wafer handling assembly.



FIG. 22 is a top view of the wafer handling assembly of FIG. 21.



FIG. 23 is a side view of the wafer handling assembly of FIG. 21.



FIG. 24 is another side view of the wafer handling assembly of FIG. 21.



FIG. 25 is a bottom perspective view of the wafer handling assembly of FIG. 21.



FIG. 26 is a top perspective view of a sixth embodiment of a wafer handling assembly.



FIG. 27 is a top view of the wafer handling assembly of FIG. 26.



FIG. 28 is a side view of the wafer handling assembly of FIG. 26.



FIG. 29 is another side view of the wafer handling assembly of FIG. 26; and,



FIG. 30 is a bottom perspective view of the wafer handling assembly of FIG. 26.


Claims
  • The ornamental design for a wafer handling assembly, as shown and described.
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Foreign Referenced Citations (2)
Number Date Country
2012099755 May 2012 JP
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