Wafer pod

Information

  • Patent Grant
  • D408139
  • Patent Number
    D408,139
  • Date Filed
    Tuesday, August 12, 1997
    27 years ago
  • Date Issued
    Tuesday, April 20, 1999
    25 years ago
  • US Classifications
    Field of Search
    • US
    • D03 273
    • D03 269
    • D03 302
    • D09 420
    • D09 423
    • D09 424
    • 206 444
    • 206 445
    • 206 454
    • 206 455
    • 206 503
    • 206 508
  • International Classifications
    • 0301
    • Term of Grant
      14Years
Abstract
Description
Claims
  • The ornamental design for a wafer pod, as shown and described.
US Referenced Citations (10)
Number Name Date Kind
D344891 Dressen Mar 1994
D376688 Gallagher et al. Dec 1996
D387903 Jacoby et al. Dec 1997
4588086 Coe May 1986
4684021 Niebling et al. Aug 1987
4709834 Mortensen et al. Dec 1987
4793488 Mortensen Dec 1988
4817799 Gregerson et al. Apr 1989
5025926 Gregerson et al. Jun 1991
5207324 Kos May 1993