Wafer-shaped hollow fiber module

Information

  • Patent Grant
  • D638096
  • Patent Number
    D638,096
  • Date Filed
    Wednesday, June 3, 2009
    15 years ago
  • Date Issued
    Tuesday, May 17, 2011
    13 years ago
Abstract
Description


FIG. 1 is a perspective view of one embodiment of a wafer-shaped hollow fiber module showing the new design;



FIG. 2 is a front plan view of the embodiment from FIG. 1.



FIG. 3 is a back plan view of the embodiment from FIG. 1.



FIG. 4 is a first side elevational view of the embodiment from FIG. 1; and,



FIG. 5 is a second side elevational view of the embodiment from FIG. 1.


The broken line showing of filter media and the threaded features are included for the purpose of illustrating and form no part of the claimed design.


Claims
  • The ornamental design for a wafer-shaped hollow fiber module, as shown and described.
US Referenced Citations (6)
Number Name Date Kind
D262484 Ward et al. Dec 1981 S
D410064 Hunter et al. May 1999 S
5972009 Fortier et al. Oct 1999 A
D555226 Leavitt et al. Nov 2007 S
20060163140 Taylor et al. Jul 2006 A1
20070278145 Taylor et al. Dec 2007 A1