Patent Application
20150322299
The present invention relates to a water-based adhesive compound for producing tyres.
The adhesive compounds, or so-called cements, used in tyre manufacturing are normally organic solvent-based. Adhesive compounds of this sort are highly adhesive and very easy to use, mainly due to rubber dissolving easily in the organic compounds and so combining with other rubber to form practically one piece once the organic solvent evaporates.
For ecological reasons, recent European directives have drastically reduced the use of organic solvents in the tyre industry, thus forcing manufacturers to look for alternative ways of ensuring the necessary adhesion of rubber layers.
One solution researched into for some time now is water-based adhesive compounds.
For this solution to be feasible, however, the problem of dispersion and stability of the compound ingredients in the water solvent must be addressed.
As regards dispersion of the compound ingredients in water, the Applicant has discovered a class of emulsifiers capable of dispersing a wide range of ingredients in water, thus eliminating the problem of employing different types of emulsifiers to disperse different ingredients. In fact, tests show that using different types of emulsifiers may even impair adhesion of the compound. The universally effective emulsifiers referred to above are described and claimed in the Applicant's Patent Application WO2009/071562.
For a clear understanding of the problem posed by stability of water-based adhesive compounds, it is important to note that, for production purposes, water-based adhesive compounds must be usable with a large percentage of solid material. More specifically, for a given amount of dry compound deposited, the more solid material the water-based compound contains, the faster it dries and fewer applications are required.
As will be clear to anyone skilled in the art, the stability of a water-based compound becomes increasingly critical as the amount of solid material to be kept dispersed increases.
Another important point to bear in mind is the adhesive capacity of the compound at low temperature, to enable tyres to be produced regardless of the climate at the production plant location. At present, many water-based adhesive compounds show a drastic reduction in adhesive capacity even at temperatures below 15° C. The Applicant has surprisingly discovered a particular class of resins capable of ensuring a high degree of adhesive power, even at low temperatures, as well as a high degree of stability, even with a high percentage of solid material.
One object of the present invention is a water-based adhesive compound comprising water as a solvent; a cross-linkable, unsaturated-chain polymer base; an emulsifier of general formula (I); and an adhesive resin; said water-based adhesive compound being characterized in that said adhesive resin is an alkylphenol-formaldehyde resin;
R1CONR2CHR3COOX (I)
where:
R1 is an aliphatic group C6-C23
R2 is H or an aliphatic group C1-C8
R3 is H or an aliphatic or aromatic group C1-C8 and
X is a metal cation.
Surfactants of general formula (I) are described in the Applicant's Patent Application WO2009/071562 included herein by way of reference.
The aliphatic group R1 preferably comprises a double bond.
The emulsifier of general formula (I) is preferably CH3 (CH2)9CON(CH3) CH2COONa.
The alkyl group of the alkylphenol of the resin is preferably an aliphatic group C3-C10.
The alkylphenol of the resin is preferably p-phenol-2-pentyl-2,4,4-trimethyl.
The adhesive compound preferably comprises 0.5 to 25 phr of the alkylphenol-formaldehyde resin.
The water-based adhesive compound preferably comprises a solid portion comprising 100 phr of polymer base, 0.5 to 5 phr of the emulsifier of general formula (I), and 0.5 to 25 phr of alkylphenol-formaldehyde resin.
A further object of the present invention is combined use of alkylphenol-formaldehyde resin and an emulsifier of general formula (I) in tyre manufacturing water-based adhesive compounds, which are highly stable, and highly adhesive at low temperatures.
The following are purely non-limiting examples for a clearer understanding of the invention.
Four control compounds (A-D) and two compounds in accordance with the invention (E, F) were produced. Compound A is a control solvent-based adhesive compound, and compounds B-D control water-based adhesive compounds. More specifically, none of compounds B-D comprise both a surfactant of general formula (I) and an alkylphenol-formaldehyde resin.
It is important to note that the control water-based adhesive compounds (B-D) have a maximum 33% by weight solid portion, beyond which they lose stability and are unusable.
Compounds E and F are water-based adhesive compounds, in accordance with the present invention, comprising both a surfactant of general formula (I) and an alkylphenol-formaldehyde resin.
Compound F in particular is a preferred embodiment, in that, containing a smaller amount of carbon black, it has major advantages in terms of application. More specifically, as it is applied, the water-based compound may undergo severe shear stress, comparable to severe agitation, which could destabilize dispersion, thus resulting in coagulation phenomena and in the impossibility of applying the compound.
Though Table II shows a 45% by weight solid portion in the adhesive compounds according to the invention (E, F), these nevertheless remain stable even with larger solid portion percentages.
Water-based compounds B-F were produced by dispersing all the ingredients in Tables I and II simultaneously in enough water to form a homogeneous emulsion. The resulting aqueous solution was agitated mechanically for 30 minutes and then sonicated for 15 minutes to obtain an aqueous emulsion.
The above method of producing the aqueous emulsions is in no way to be inferred as limiting the object of the present invention.
Table I shows the compositions of the four control compounds, and the percentages by weight of the solvent (organic or water) and of the solid portion, the composition of which is shown in phr.
Emulsifier (a) is a fatty acid ethoxylate.
Emulsifier (b) is CH3 (CH2)9CON(CH3) CH2COONa.
Resin (a) is butylphenol-acetylene.
Resin (b) is a C5-C9 resin marketed by Eastman as TACOLYN 100.
Resin (c) is an alkylphenol-formaldehyde resin marketed by SI Group as HRJ-16231, and in which the alkylphenol of the resin is p-phenol-2-pentil-2,4,4-trimethyl.
In addition to natural rubber, the adhesive compounds according to the present invention may comprise any cross-linkable, unsaturated-chain polymer base obtained by polymerizing conjugate dienes and/or aliphatic Or aromatic vinyl monomers. For example, usable polymer bases are selected from the group comprising natural rubber; 1,4-cis polyisoprene; polybutadiene; isoprene-isobutene copolymers, possibly halogenated; butadiene-acrylonitrile copolymers; styrene-butadiene copolymers and styrene-butadiene-isoprene terpolymers in solution or emulsion; and ethylene-propylene-diene terpolymers. The above polymer bases may be used either singly or mixed together.
A test of adhesion to green rubber at different temperatures, and a 40° C. drying test were conducted on each of the compounds produced.
For the adhesion test, the compound was applied to a layer of green rubber and allowed to dry for roughly 1 hour in air at ambient temperature. Adhesion was then measured by applying another layer of green rubber to the compound and measuring the force required to detach it.
The time taken for all the water in a given amount of compound to evaporate was measured by TGA analysis.
For as accurate a comparison as possible, the above laboratory tests were conducted on equal amounts of dry compound.
Compounds B-F were sprayed or spread on.
Table III shows the adhesion and drying test results.
As shown clearly by the results in Table III, the water-based adhesive compounds according to the invention are more adhesive (at ambient and low temperatures) than both the water-based and solvent-based control compounds. The advantages in terms of adhesion and stability derive from the synergic effect of the surfactant of general formula (I) and the alkylphenol-formaldehyde resin.
In fact, the low-temperature adhesion results of control compound D, comprising the surfactant of general formula (I) but no alkylphenol-formaldehyde resin, are far lower than those of compounds E and F according to the invention.
On the other hand, compound C, comprising alkylphenol-formaldehyde resin but no surfactant of general formula (I), shows good low-temperature adhesion, but has the drawback of losing stability with solid portion percentages of over 33.
| Number | Date | Country | Kind |
|---|---|---|---|
| RM2012A000606 | Nov 2012 | IT | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/IB2013/060523 | 11/29/2013 | WO | 00 |
