Claims
- 1. A method of curing a polymer thick film onto a substrate comprising the steps of:
- (1) providing an aqueous conductive polymer thick film-forming and printable composition comprising:
- (a) about 10 to 0.25 to about 20% by weight of water-soluble thermoplastic polymer selected from the group consisting of polyethyloxyazoline, polyvinyl pyrrolidone, polyvinyl alcohol, polyacrylamide, polyglycol, and polyacrylic acid;
- (b) about 10 to 70% by weight of a water insoluble polymer dispersion in water, said dispersed polymer selected from the group consisting of polyurethane resin polymer, acrylic resin polymer, polyester resin polymer, and vinyl resin polymer;
- (c) about 2% to about 20% by weight of at least one glycol drying-retarder agent;
- (d) an effective electrically conducting amount of less than 90% by weight of conductive particles selected from the group consisting of conductive metal particles, carbon black particles, graphite particles, and combinations thereof; with the proviso that the amount of said carbon black particles, graphite particles, or combinations thereof do not exceed 40% by weight; and
- (e) an effective solvating amount of water to dissolve water-soluble thermoplastic polymer (a); each of said amounts being based upon the total weight of said composition;
- (2) applying said composition to a substrate; and
- (3) thermally curing said composition at an elevated temperature onto said substrate.
- 2. The method of claim 1 wherein said elevated temperature is from 70.degree. F. to 300.degree. F.
- 3. The method of claim 1 wherein said water-soluble thermoplastic pollers if polyethyloxyazoline.
- 4. The method of claim 1 wherein said water-soluble thermoplastic polymer is polyvinyl pyrrolidone.
- 5. The method of claim 1 wherein said dispersed polymer is vinyl resin polymer.
- 6. The method of claim 1 wherein said glycol drying-retarding agent is ethylene glycol.
- 7. The method of claim 1 wherein said conductive particles are silver flake.
- 8. The method of claim 1 additionally comprising viscosity modifying agents and defoaming surfactants.
- 9. The method of claim 1 wherein said conductive particles are from about 1 micron to about 50 microns.
Parent Case Info
This application is a division of application Ser. No. 07/997,374, filed Dec. 28, 1992, now U.S. Pat. No. 5,286,415 which is incorporated herein by reference in its entirety.
US Referenced Citations (6)
Divisions (1)
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Number |
Date |
Country |
Parent |
997374 |
Dec 1992 |
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