Claims
- 1. A high bond strength, heat resistant water-based adhesive composition for bonding to a polyolefin surface comprising
- 75 to 94 weight percent of total composition an emulsion containing about 58% solids of a copolymer of 90-98% ethyl acrylate and 2-10% propylene chlorohydrin dimethyl ammoniumethyl methacrylate,
- 5 to 15 weight percent of total composition an water-based epoxy resin dispersion containing about 57% solids, and
- 1 to 10 weight percent of total composition an aqueous solution containing about 33% solids of polyethyleneimine.
- 2. A high bond strength, heat resistant water-based adhesive composition for bonding to a polyolefin surface comprising
- 75 to 94 weight percent of total composition an emulsion having about 58% solids of a copolymer of 90-98% ethyl acrylate and 2-10% propylene chlorohydrin dimethyl ammoniumethyl methacrylate,
- 5 to 15 weight percent of total composition an water-based epoxy resin dispersion containing about 57% solids, and
- 1 to 10 weight percent of total composition an aqueous solution containing about 33% solids of polyethyleneimine,
- said composition when used in bonding a vinyl backed cloth to a polyolefin surface provides a minimum bond strength of 10 lbs/in when tested according to ASTM Standard Test Procedure D-903.
Parent Case Info
This is a continuation-in-part of U.S. patent application Ser. No. 911,731 filed Sept. 26, 1986, which is now abandoned.
US Referenced Citations (9)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
911731 |
Sep 1986 |
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