Number | Date | Country | Kind |
---|---|---|---|
41 26 075.9 | Aug 1991 | DEX |
Filing Document | Filing Date | Country | Kind | 102e Date | 371c Date |
---|---|---|---|---|---|
PCT/EP92/01722 | 7/29/1992 | 2/3/1994 | 2/3/1994 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO93/03110 | 2/18/1993 |
Number | Name | Date | Kind |
---|---|---|---|
2003065 | Boyce | May 1935 | |
2357073 | Billing | Aug 1944 | |
2943071 | Laden | Jun 1960 | |
3157533 | Clancy et al. | Nov 1964 | |
3692713 | Columbus et al. | Sep 1972 | |
3836386 | Roy | Sep 1974 | |
3857803 | Shenfeld et al. | Dec 1974 | |
4262058 | Saunders | Apr 1981 | |
4464202 | Andres et al. | Aug 1984 | |
4964939 | Gleason | Oct 1990 |
Number | Date | Country |
---|---|---|
0080141 | Jun 1983 | EPX |
1620092 | Apr 1970 | DEX |
Entry |
---|
Chemical Abstracts, vol. 89, No. 10, Oct. 1, 1978, Columbus, Ohio, US; Abstract No. 148480q, "Thermosetting Adhesive Composition" p. 90. |