Claims
- 1. A laminate comprising a base layer and a low melt layer directly or indirectly bonded on one side thereof to said base layer and a product layer adhered to the other side of said low melt layer, said low melt layer extending beyond said product layer along a peripheral portion thereof, wherein said low melt layer when in registry with an adjacent laminate and subjected to heat bonds with and forms a substantially water tight seal with the adjacent laminate.
- 2. The laminate of claim 1, wherein said base layer is one or more of a polypropylene, a polyester, a polyethylene, a polyamide, a polyvinyl chloride, a substituted vinyl, and mixtures, blends and copolymers thereof.
- 3. The laminate of claim 1, wherein said low melt layer is one or more of an ethylene vinyl acetate, a polyester copolymer, a polyolefin, a polyamide and mixtures, blends and copolymers thereof.
- 4. The laminate of claim 2, wherein said low melt layer is one or more of an ethylene vinyl acetate, a polyester copolymer, a polyolefin, a polyamide and mixtures, blends and copolymers thereof.
- 5. The laminate of claim 4, wherein said base layer is polypropylene.
- 6. The laminate of claim 4, wherein said low melt layer is polyethylene.
- 7. The laminate of claim 6, wherein said polypropylene base layer is bonded to said low melt polyethylene layer with a copolymer of polypropylene and polyethylene.
- 8. The laminate of claim 1, wherein said low melt layer has a melting point greater than about 180° F. and less than about 325° F.
- 9. The laminate of claim 7, wherein the said low melt layer has a melting point in the range of from about 195° F. to about 325° F.
- 10. The laminate of claim 1, wherein the low melt layer extends outwardly of said product layer not less than about 2 inches.
- 11. The laminate of claim 10, wherein said product layer is one or more of a non-woven fabric, a carpet underlayment, a wood floor underlayment, a polyurethane foam, or a synthetic organic resin weave backing for carpet.
- 12. A laminate comprising a base layer and a low melt layer bonded thereto and a product layer, wherein said base layer is one or more of a polypropylene, a polyester, a polyethylene, a polyamide, a polyvinyl chloride, a substituted vinyl, and mixtures, blends and copolymers thereof and said low melt layer is one or more of an ethylene vinyl acetate, a polyester copolymer, a polyolefin, a polyamide and mixtures, blends and copolymers thereof, said low melt layer having a melting point not greater than about 325° F., wherein at least one edge of said low melt layer extends beyond said product layer such that it is capable of overlapping an adjacent laminate and forming a substantially water tight seal therewith.
- 13. The laminate of claim 12, wherein said base layer includes polypropylene or a blend, mixture or copolymer thereof.
- 14. The laminate of claim 12, wherein said low melt layer includes polyethylene or a blend, mixture or a copolymer thereof.
- 15. The laminate of claim 13, wherein said low melt layer includes polyethylene or a blend, mixture or a copolymer thereof.
- 16. The laminate of claim 15, wherein the side of said low melt layer opposite said base layer is bonded directly or indirectly to one or more of a product layer selected from a non-woven fabric, a carpet underlayment, a wood floor underlayment, a polyurethane foam or a synthetic organic resin weave backing for carpet.
- 17. The laminate of claim 16, wherein said base layer is polypropylene, said low melt layer is polyethylene bonded thereto with a copolymer of polypropylene and polyethylene.
- 18. The laminate of claim 17, wherein said low melt layer is bonded to said polypropylene base layer and a carpet underlayment.
- 19. The laminate of claim 17, wherein said low melt layer is bonded to said polypropylene base layer and a wood floor underlayment.
- 20. The laminate of claim 17, wherein said low melt layer is bonded to said polypropylene base layer and a polyurethane layer.
- 21. The laminate of claim 17, wherein said low melt layer is bonded to said polypropylene base layer and a scrap synthetic fiber pad carpet underlayment.
- 22. A laminate comprising a base layer and a low melt polyethylene layer directly or indirectly bonded to one side of said base layer and a product layer bonded directly or indirectly to said low melt polyethylene layer opposite to said base layer said low melt polyethylene layer extending beyond said base layer and said product layer along a peripheral portion thereof, wherein said low polyethylene melt layer when in registry with an adjacent laminate and subjected to heat bonds with and forms a substantially water tight seal with the adjacent laminate.
- 23. The laminate of claim 22, wherein said base layer is polypropylene and said low melt layer is polyethylene having a melting point greater than about 180° F. and less than about 325° F. and said another layer is at least about {fraction (1/16)} inch in thickness and is a synthetic organic resin.
- 24. The laminate of claim 23, wherein said base layer and said low melt polyethylene layer are bonded with a copolymer of polypropylene and polyethylene.
- 25. The laminate of claim 24, wherein said low melt layer has a melting point of about 200° F.
- 26. The laminate of claim 25, wherein said product layer is one or more of a non-woven fabric, a carpet underlayment, a wood floor underlayment, a polyurethane foam, or a synthetic organic resin weave backing for carpet.
- 27. A method of forming a laminate comprising
registering a film layer having a low melting point surface with a product layer such that one edge of the low melting point surface extends beyond the product layer and passing the so registered layers through a heating station to cause the layers to be bonded.
- 28. The method of claim 27, wherein the film layer having a low melting point surface includes polyethylene.
- 29. The method of claim 28, wherein the polyethylene has a melting point greater than 180° F. and less than about 325° F.
- 30. The method of claim 29, wherein the heating station includes a drum filled with a heated fluid.
RELATED APPLICATION
[0001] This application, pursuant to 37 C.F.R. § 1.78(c), claims priority based on provisional application serial No. 60/333,783 filed Nov. 28, 2001.
Provisional Applications (1)
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Number |
Date |
Country |
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60333783 |
Nov 2001 |
US |