This Application makes reference to:
Each of the above referenced Application is hereby incorporated herein by reference in its entirety.
Certain embodiments of the disclosure relate to an antenna system for millimeter wave-based wireless communication. More specifically, certain embodiments of the disclosure relate to a waveguide antenna element based beam forming phased array antenna system for millimeter wave communication.
Wireless telecommunication in modern times has witnessed advent of various signal transmission techniques, systems, and methods, such as use of beam forming and beam steering techniques, for enhancing capacity of radio channels. For the advanced high-performance fifth generation communication networks, such as millimeter wave communication, there is a demand for innovative hardware systems, and technologies to support millimeter wave communication in effective and efficent manner. Current antenna systems or antenna arrays, such as phased array antenna or TEM antenna, that are capable of supporting millimeter wave communication comprise multiple radiating antenna elements spaced in a grid pattern on a flat or curved surface of communication elements, such as transmitters and receivers. Such antenna arrays may produce a beam of radio waves that may be electronically steered to desired directions, without physical movement of the antennas. A beam may be formed by adjusting time delay and/or shifting the phase of a signal emitted from each radiating antenna element, so as to steer the beam in the desired direction. Although some of the existing antenna arrays exhibit low loss, however, mass production of such antenna arrays that comprise multiple antenna elements may be difficult and pose certain practical and technical challenges. For example, the multiple antenna elements (usually more than hundred) in an antenna array, needs to be soldered on a substrate during fabrication, which may be difficult and a time-consuming process. This adversely impacts the total cycle time to produce an antenna array. Further, assembly and packaging of such large sized antenna arrays may be difficult and cost intensive task. Thus, an advanced antenna system may be desirable that may be cost-effective, easy to fabricate, assemble, and capable of millimeter wave communication in effective and efficent manner.
Further limitations and disadvantages of conventional and traditional approaches will become apparent to one of skill in the art, through comparison of such systems with some aspects of the present disclosure as set forth in the remainder of the present application with reference to the drawings.
A waveguide antenna element based beam forming phased array antenna system for millimeter wave communication, substantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.
These and other advantages, aspects and novel features of the present disclosure, as well as details of an illustrated embodiment thereof, will be more fully understood from the following description and drawings.
Certain embodiments of the disclosure may be found in a waveguide antenna element based beam forming phased array antenna system for millimeter wave communication. In the following description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown, by way of illustration, various embodiments of the present disclosure.
In some embodiments, the waveguide antenna element based beam forming phased array 100A may be made of electrically conductive material, such as metal. For example, the waveguide antenna element based beam forming phased array 100A may be made of copper, aluminum, or mettalic alloy that are considered good electrical conductors. In some embodiments, the waveguide antenna element based beam forming phased array 100A may be made of plastic and coated with electrically conductive material, such as metal, for mass production. The exposed or outer surface of the waveguide antenna element based beam forming phased array 100A may be coated with electrically conductive material, such as metal, whereas the inner body may be plastic or other inexpensive polymeric substance. The waveguide antenna element based beam forming phased array 100A may be surface coated with copper, aluminum, silver, and the like. Thus, the waveguide antenna element based beam forming phased array 100A may be cost-effective and capable of mass production as a result of the unitary body structure of the waveguide antenna element based beam forming phased array 100A. In some embodiments, the waveguide antenna element based beam forming phased array 100A may be made of optical fibre for enhanced conduction in the millimeter wave frequency.
As the first pair of horizontal polarization pins 304a and 304b protrude slightly from the first end 210 from the level of the body (i.e., the ground 208) of the radiating waveguide antenna cell 102A, a firm contact with the first substrate 402 may be established. The first substrate 402 comprises an upper side 402A and a lower side 402B. The first end 210 of the plurality of radiating waveguide antenna cells 102, such as the radiating waveguide antenna cell 102A, of the waveguide antenna element based beam forming phased array 100A may be mounted on the upper side 402A of the first substrate 402. Thus, the waveguide antenna element based beam forming phased array 100A may also be reffered to as a surface mount open waveguide antenna. In some embodiments, the chip 404 may be positioned beneath the lower side 402B of the first substrate 402. In operation, the current may flow from the ground 208 towards the negative terminal 406a of the chip 404 through at least a first pin (e.g., the pin 304b of the first pair of horizontal polarization pins 304a and 304b), and the electrically conductive connection 408a. Similarly, the current may flow from the positive terminal 406b of the chip 404 towards the ground 208 through at least a second pin (e.g., the pin 304a of the first pair of horizontal polarization pins 304a and 304b) of the plurality of pins 206 in the radiating waveguide antenna cell 102A. This forms a closed circuit, where the flow of current in the opposite direction in closed circuit within the radiating waveguide antenna cell 102A in at least one polarization creates a magnetic dipole and differential in at least two electromagnetic waves resulting in propogation of the RF wave 410 via the open end 202 of the radiating waveguide antenna cell 102A.The chip 404 may be configured to form a RF beam and further control the propagation and a direction of the RF beam in millimeter wave frequency through the open end 202 of each radiating waveguide antenna cell by adjusting signal parameters of RF signal (i.e. the radiated RF wave 410) emitted from each radiating waveguide antenna cell of the plurality of radiating waveguide antenna cells 102.
In accordance with an embodiment, a first end 508 of a set of radiating waveguide antenna cells 510 of the waveguide antenna element based beam forming phased array 100A (as the unitary body) may be mounted on the first substrate 402. For example, in this case, the first end 508 of the set of radiating waveguide antenna cells 510 of the waveguide antenna element based beam forming phased array 100A is mounted on the upper side 402A of the first substrate 402. The plurality of chips 502 may be positioned between the lower side 402B of the first substrate 402 and the upper surface 504A of the system board 504. The set of radiating waveguide antenna cells 510 may correspond to certain number of radiating waveguide antenna cells, for example, four radiating waveguide antenna cells, of the plurality of radiating waveguide antenna cells 102 (
In accordance with an embodiment, the system board 504 includes an upper surface 504A and a lower surface 504B. The upper surface 504A of the system board 504 comprises a plurality of electrically conductive connection points 518 (e.g., solder balls) to connect to the ground (e.g., the ground 514a to 514d) of each of set of radiating waveguide antenna cells 510 of the waveguide antenna element based beam forming phased array 100A using electrically conductive wiring connections 520 that passes through the first substrate 402. The first substrate 402 may be positioned between the waveguide antenna element based beam forming phased array 100A and the system board 504.
In accordance with an embodiment, the heat sink 506 may be attached to the lower surface 504B of the system board 504. The heat sink may have a comb-like structure in which a plurality of protrusions (such as protrusions 506a and 506b) of the heat sink 506 passes through a plurality of perforations in the system board 504 such that the plurality of chips 502 are in contact to the plurality of protrusions (such as protrusions 506a and 506b) of the heat sink 506 to dissipate heat from the plurality of chips 502 through the heat sink 506.
In some embodiments, as shown in
In accordance with an embodiment, a vertical length 612 between the chip (such as the chip 404 or one of the plurality of chips 502) and a first end of each radiating waveguide antenna cell (such as the first end 210 of the radiating waveguide antenna cell 102A) of the plurality of radiating waveguide antenna cells 102, defines an amount of routing loss between each chip and the first end (such as the first end 210) of each radiating waveguide antenna cell. The first end of each radiating waveguide antenna cell (such as the first end 210 of the radiating waveguide antenna cell 102A) includes the lower end 608 of the plurality of pins 610 and the ground at the first end. When the vertical length 612 reduces, the amount of routing loss also reduces, whereas when the vertical length 612 increases, the amount of routing loss also increases. In other words, the amount of routing loss is directly proportional to the vertical length 612. Thus, in
In
In accordance with an embodiment, the plurality of chips 502 are configured to control propagation, a direction and angle (or tilt, such as 18, 22.5 or 45 degree tilt) of the RF beam (e.g. the main lobe 902 of the RF beam) in millimeter wave frequency through the open end 906 of the plurality of radiating waveguide antenna cells 102 for the millimeter wave communication between the antenna system 500A or 500B and a millimeter wave-based communication device. Example of the millimeter wave-based communication device may include, but are not limited to active reflectors, passive reflectors, or other millimeter wave capable telecommunications hardware, such as customer premises equipments (CPEs), smartphones, or or other base stations. In this case, a 22.5 degree tilt of the RF beam is shown in
The radiating waveguide antenna cells 1102a to 1102d may be mounted on a substrate module 1108a. The radiating waveguide antenna cells 1102e to 1102h may be mounted on a substrate module 1108b. The substrate modules 1108a and 1108b corresponds to the first substrate 402. The plurality of non-radiating dummy waveguide antenna cells (such as non-radiating dummy waveguide antenna cells 1104a and 1104b) are mounted on a second substrate (such as dummy substrates 1106a and 1106b). In some embodiments, the plurality of non-radiating dummy waveguide antenna cells may be mounted on the same type of substrate (such as the first substrate 402 or substrate modules 1108a and 1108b) as of the plurality of radiating waveguide antenna cells. In some embodiments, the plurality of non-radiating dummy waveguide antenna cells cells (such as non-radiating dummy waveguide antenna cells 1104a and 1104b) may be mounted on a different type of substrate, such as the dummy substrates 1106a and 1106b, which may be inexpensive as compared to first substrate the plurality of radiating waveguide antenna cells to reduce cost. The second substrate (such as dummy substrates 1106a and 1106b) may be different than the first substrate (such as the substrate modules 1108a and 1108b). This is a significant advantage compared to conventional approaches, where the conventional radiating antenna elements and the dummy antenna elements are on the same expensive substrate. The plurality of chips 502, the main system board 504, and the heat sink 506, are also shown, which are connected in a similar manner as described in
In accordance with an embodiment, the antenna system (such as the antenna system 500A, 500B, 1100, and 1300), may comprise a first substrate (such as the first substrate 402 or the substrate modules 1108a and 1108b), a plurality of chips (such as the chip 404 or the plurality of chips 502); and a waveguide antenna element based beam forming phased array (such as the waveguide antenna element based beam forming phased array 100A, 1000A, or 1200A) having a unitary body that comprises a plurality of radiating waveguide antenna cells (such as the plurality of radiating waveguide antenna cells 102, 1002, 1202, or 510), in a first layout (such as the first layout 1004 for millimeter wave communication. Each radiating waveguide antenna cell comprises a plurality of pins (such as the plurality of pins 206) that are connected with a body (such as the ground 208) of a corresponding radiating waveguide antenna cell that acts as ground for the plurality of pins. A first end of the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array as the unitary body in the first layout is mounted on the first substrate. The plurality of chips may be electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming through a second end (such as the open end 202 or 906) of the plurality of radiating waveguide antenna cells for the millimeter wave communication.
In accordance with an embodiment, the waveguide antenna element based beam forming phased array may be a one-piece structure of four-by-four waveguide array comprising sixteen radiating waveguide antenna cells in the first layout, where the one-piece structure of four-by-four waveguide array corresponds to the unitary body of the waveguide antenna element based beam forming phased array. The waveguide antenna element based beam forming phased array may be one- piece structure of eight-by-eight waveguide array comprising sixty four radiating waveguide antenna cells in the first layout, where the one-piece structure of eight-by-eight waveguide array corresponds to the unitary body of the waveguide antenna element based beam forming phased array.
In accordance with an embodiment, the waveguide antenna element based beam forming phased array may be one-piece structure of N-by-N waveguide array comprising M number of radiating waveguide antenna cells in the first layout, wherein N is a positive integer and M is N to the power of 2. In accordance with an embodiment, the waveguide antenna element based beam forming phased array may further comprise a plurality of non-radiating dummy waveguide antenna cells (such as the plurality of non-radiating dummy waveguide antenna cells 1002 or 204 or the non-radiating dummy waveguide antenna cells 1104a and 1104b) in the first layout. The plurality of non-radiating dummy waveguide antenna cells may be positioned at edge regions surrounding the plurality of radiating waveguide antenna cells in the first layout to enable even radiation for the millimeter wave communication through the second end of each of the plurality of radiating waveguide antenna cells irrespective of positioning of the plurality of radiating waveguide antenna cells in the first layout.
In accordance with an embodiment, the antenna system may further comprise a second substrate (such as dummy substrates 1106a and 1106b). The plurality of non-radiating dummy waveguide antenna cells in the first layout are mounted on the second substrate that is different than the first substrate.
In accordance with an embodiment, the antenna system may further comprise a system board (such as the system board 504) having an upper surface and a lower surface. The upper surface of the system board comprises a plurality of electrically conductive connection points (such as the plurality of electrically conductive connection points 518) to connect to the ground of each of the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array using electrically conductive wiring connections that passes through the first substrate, where the first substrate is positioned between the waveguide antenna element based beam forming phased array and the system board.
In accordance with an embodiment, the antenna system may further comprise a heat sink (such as the heat sink 506) that is attached to the lower surface of the system board. The heat sink have a comb-like structure in which a plurality of protrusions of the heat sink passes through a plurality of perforations in the system board such that the plurality of chips are in contact to the plurality of protrusions of the heat sink to dissipate heat from the plurality of chips through the heat sink. The first substrate may comprise an upper side and a lower side, where the first end of the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array may be mounted on the upper side of the first substrate, and the plurality of chips are positioned between the lower side of the first substrate and the upper surface of the system board.
In accordance with an embodiment, the first substrate may comprises an upper side and a lower side, where the plurality of chips and the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array are positioned on the upper side of the first substrate. A vertical length between the plurality of chips and the first end of the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array may be less than a defined threshold to reduce insertion or routing loss between the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array and the plurality of chips, based on the positioning of the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array and the plurality of chips on a same side of the first substrate.
In accordance with an embodiment, the unitary body of the waveguide antenna element based beam forming phased array may have a metallic electrically conductive surface that acts as a heat sink to dissipate heat from the plurality of chips to atmospheric air through the metallic electrically conductive surface of the waveguide antenna element based beam forming phased array, based on a contact of the plurality of chips with the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array on the upper side of the first substrate. The plurality of pins in each radiating waveguide antenna cell may be protrude pins (such as the plurality of protrude pins 702) that protrude from the first end from a level of the body of the corresponding radiating waveguide antenna cell to establish a firm contact with the first substrate.
In accordance with an embodiment, the waveguide antenna element based beam forming phased array is a dual-polarized open waveguide array antenna configured to transmit and receive radio frequency waves for the millimeter wave communication in both horizontal and vertical polarizations or as left hand circular polarization (LHCP) or right hand circular polarization (RHCP). The plurality of pins in each radiating waveguide antenna cell may include a pair of vertical polarization pins that acts as a first positive terminal and a first negative terminal and a pair of horizontal polarization pins that acts as a second positive terminal and a second negative terminal, wherein the pair of vertical polarization pins and the pair of horizontal polarization pins are utilized for dual-polarization. The plurality of chips comprises a set of receiver (Rx) chips, a set of transmitter (Tx) chips, and a signal mixer chip.
In accordance with an embodiment, the plurality of chips may be configured to control propagation and a direction of a radio frequency (RF) beam in millimeter wave frequency through the second end of the plurality of radiating waveguide antenna cells for the millimeter wave communication between the antenna system and a millimeter wave-based communication device, where the second end may be an open end of the plurality of radiating waveguide antenna cells for the millimeter wave communication. The propagation of the radio frequency (RF) beam in millimeter wave frequency may be controlled based on at least a flow of current in each radiating waveguide antenna cell, where the current flows from the ground towards a negative terminal of a first chip of the plurality of chips via at least a first pin of the plurality of pins, and from a positive terminal of the first chip towards the ground via at least a second pin of the plurality of pins in each corresponding radiating waveguide antenna cell of the plurality of radiating waveguide antenna cells.
In accordance with an embodiment, the antenna system may further comprise an interposer (such as the interposer 1302) beneath the edge regions of the waveguide antenna element based beam forming phased array at the first end in the first layout to shield radiation leakage from the first end of the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array. In accordance with an embodiment, the antenna system may further comprise a ground (gnd) layer (such as the gnd layer 1602) between the first end of the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array and the first substrate to avoid or minimize ground loop noise from the ground of each radiating waveguide antenna cell of the plurality of the radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array.
The waveguide antenna element based beam forming phased arrays 100A, 110A, 1000A, 1200A may be utilized in, for example, active and passive reflector devices disclosed in, for example, U.S. application Ser. No. 15/607,743, and U.S. application Ser. No. 15/834,894.
While various embodiments described in the present disclosure have been described above, it should be understood that they have been presented by way of example, and not limitation. It is to be understood that various changes in form and detail can be made therein without departing from the scope of the present disclosure. In addition to using circuitry or hardware (e.g., within or coupled to a central processing unit (“CPU”), microprocessor, micro controller, digital signal processor, processor core, system on chip (“SOC”) or any other device), implementations may also be embodied in software (e.g. computer readable code, program code, and/or instructions disposed in any form, such as source, object or machine language) disposed for example in a non-transitory computer-readable medium configured to store the software. Such software can enable, for example, the function, fabrication, modeling, simulation, description and/or testing of the apparatus and methods describe herein. For example, this can be accomplished through the use of general program languages (e.g., C, C++), hardware description languages (HDL) including Verilog HDL, VHDL, and so on, or other available programs. Such software can be disposed in any known non-transitory computer-readable medium, such as semiconductor, magnetic disc, or optical disc (e.g., CD-ROM, DVD-ROM, etc.). The software can also be disposed as computer data embodied in a non-transitory computer-readable transmission medium (e.g., solid state memory any other non-transitory medium including digital, optical, analogue-based medium, such as removable storage media). Embodiments of the present disclosure may include methods of providing the apparatus described herein by providing software describing the apparatus and subsequently transmitting the software as a computer data signal over a communication network including the internet and intranets.
It is to be further understood that the system described herein may be included in a semiconductor intellectual property core, such as a microprocessor core (e.g., embodied in HDL) and transformed to hardware in the production of integrated circuits. Additionally, the system described herein may be embodied as a combination of hardware and software. Thus, the present disclosure should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.
Number | Name | Date | Kind |
---|---|---|---|
5561850 | Makitalo et al. | Oct 1996 | A |
5666124 | Chethik et al. | Sep 1997 | A |
5771017 | Dean et al. | Jun 1998 | A |
5905473 | Taenzer | May 1999 | A |
5940033 | Locher et al. | Aug 1999 | A |
6018316 | Rudish et al. | Jan 2000 | A |
6307502 | Marti-Canales et al. | Oct 2001 | B1 |
6433920 | Welch et al. | Aug 2002 | B1 |
6456252 | Goyette | Sep 2002 | B1 |
6718159 | Sato | Apr 2004 | B1 |
6804491 | Uesugi | Oct 2004 | B1 |
6992622 | Chiang et al. | Jan 2006 | B1 |
7058367 | Luo et al. | Jun 2006 | B1 |
7187949 | Chang et al. | Mar 2007 | B2 |
7206294 | Garahi et al. | Apr 2007 | B2 |
7339979 | Kelkar | Mar 2008 | B1 |
7363058 | Gustaf | Apr 2008 | B2 |
7424225 | Elliott | Sep 2008 | B1 |
7574236 | Mansour | Aug 2009 | B1 |
7636573 | Walton et al. | Dec 2009 | B2 |
7911985 | Proctor, Jr. et al. | Mar 2011 | B2 |
7986742 | Ketchum et al. | Jul 2011 | B2 |
8190102 | Rofougaran | May 2012 | B2 |
8228188 | Key et al. | Jul 2012 | B2 |
8385305 | Negus et al. | Feb 2013 | B1 |
8385452 | Gorokhov | Feb 2013 | B2 |
8482462 | Komijani et al. | Jul 2013 | B2 |
8570988 | Wallace et al. | Oct 2013 | B2 |
8644262 | Sun et al. | Feb 2014 | B1 |
8654815 | Forenza et al. | Feb 2014 | B1 |
8885628 | Palanki et al. | Nov 2014 | B2 |
9037094 | Moshfeghi | May 2015 | B2 |
9065515 | Pezennec et al. | Jun 2015 | B2 |
9225482 | Moshfeghi | Dec 2015 | B2 |
9252908 | Branlund | Feb 2016 | B1 |
9456354 | Branlund | Sep 2016 | B2 |
9686060 | Moshfeghi | Jun 2017 | B2 |
9698948 | Moshfeghi | Jul 2017 | B2 |
9787103 | Leabman et al. | Oct 2017 | B1 |
9829563 | Xiao et al. | Nov 2017 | B2 |
10069555 | Islam et al. | Sep 2018 | B2 |
20020034958 | Oberschmidt et al. | Mar 2002 | A1 |
20020132600 | Rudrapatna | Sep 2002 | A1 |
20020193074 | Squibbs | Dec 2002 | A1 |
20030012208 | Bernheim et al. | Jan 2003 | A1 |
20030129989 | Gholmieh et al. | Jul 2003 | A1 |
20030236109 | Nagata | Dec 2003 | A1 |
20040110469 | Judd et al. | Jun 2004 | A1 |
20040116129 | Wilson | Jun 2004 | A1 |
20040127174 | Frank et al. | Jul 2004 | A1 |
20040166808 | Hasegawa et al. | Aug 2004 | A1 |
20050048964 | Cohen et al. | Mar 2005 | A1 |
20050069252 | Hwang et al. | Mar 2005 | A1 |
20050134517 | Gottl | Jun 2005 | A1 |
20050136943 | Banerjee et al. | Jun 2005 | A1 |
20050181755 | Hoshino et al. | Aug 2005 | A1 |
20050232216 | Webster et al. | Oct 2005 | A1 |
20050237971 | Skraparlis | Oct 2005 | A1 |
20050243756 | Cleveland et al. | Nov 2005 | A1 |
20050270227 | Stephens | Dec 2005 | A1 |
20060063494 | Zhang et al. | Mar 2006 | A1 |
20060246922 | Gasbarro et al. | Nov 2006 | A1 |
20060267839 | Vaskelainen et al. | Nov 2006 | A1 |
20070001924 | Hirabayashi | Jan 2007 | A1 |
20070040025 | Goel et al. | Feb 2007 | A1 |
20070052519 | Talty et al. | Mar 2007 | A1 |
20070066254 | Tsuchie et al. | Mar 2007 | A1 |
20070100548 | Small | May 2007 | A1 |
20070116012 | Chang et al. | May 2007 | A1 |
20070280310 | Muenter et al. | Dec 2007 | A1 |
20080076370 | Kotecha et al. | Mar 2008 | A1 |
20080117961 | Han et al. | May 2008 | A1 |
20080212582 | Zwart et al. | Sep 2008 | A1 |
20080225758 | Proctor et al. | Sep 2008 | A1 |
20080258993 | Gummalla et al. | Oct 2008 | A1 |
20080261509 | Sen | Oct 2008 | A1 |
20080315944 | Brown | Dec 2008 | A1 |
20090029645 | Leroudier | Jan 2009 | A1 |
20090093265 | Kimura et al. | Apr 2009 | A1 |
20090156227 | Frerking et al. | Jun 2009 | A1 |
20090224137 | Hoermann | Sep 2009 | A1 |
20090233545 | Sutskover et al. | Sep 2009 | A1 |
20090325479 | Chakrabarti et al. | Dec 2009 | A1 |
20100080197 | Kanellakis et al. | Apr 2010 | A1 |
20100090898 | Gallagher et al. | Apr 2010 | A1 |
20100105403 | Lennartson et al. | Apr 2010 | A1 |
20100117890 | Vook et al. | May 2010 | A1 |
20100124895 | Martin et al. | May 2010 | A1 |
20100136922 | Rofougaran | Jun 2010 | A1 |
20100149039 | Komijani et al. | Jun 2010 | A1 |
20100167639 | Ranson et al. | Jul 2010 | A1 |
20100172309 | Forenza et al. | Jul 2010 | A1 |
20100220012 | Reede | Sep 2010 | A1 |
20100273504 | Bull et al. | Oct 2010 | A1 |
20100291918 | Suzuki et al. | Nov 2010 | A1 |
20100304680 | Kuffner et al. | Dec 2010 | A1 |
20100304770 | Wietfeldt et al. | Dec 2010 | A1 |
20100328157 | Culkin et al. | Dec 2010 | A1 |
20110003610 | Key et al. | Jan 2011 | A1 |
20110045764 | Maruyama et al. | Feb 2011 | A1 |
20110063181 | Walker | Mar 2011 | A1 |
20110069773 | Doron et al. | Mar 2011 | A1 |
20110081875 | Imamura et al. | Apr 2011 | A1 |
20110105032 | Maruhashi et al. | May 2011 | A1 |
20110105167 | Pan et al. | May 2011 | A1 |
20110136478 | Trigui | Jun 2011 | A1 |
20110140954 | Fortuny-Guasch | Jun 2011 | A1 |
20110194504 | Gorokhov et al. | Aug 2011 | A1 |
20110212684 | Nam et al. | Sep 2011 | A1 |
20110222616 | Jiang et al. | Sep 2011 | A1 |
20110268037 | Fujimoto | Nov 2011 | A1 |
20110299441 | Petrovic | Dec 2011 | A1 |
20120034924 | Kalhan | Feb 2012 | A1 |
20120057508 | Moshfeghi | Mar 2012 | A1 |
20120082070 | Hart et al. | Apr 2012 | A1 |
20120082072 | Shen | Apr 2012 | A1 |
20120083207 | Rofougaran et al. | Apr 2012 | A1 |
20120083225 | Rofougaran et al. | Apr 2012 | A1 |
20120083233 | Rofougaran et al. | Apr 2012 | A1 |
20120083306 | Rofougaran et al. | Apr 2012 | A1 |
20120093209 | Schmidt et al. | Apr 2012 | A1 |
20120120884 | Yu et al. | May 2012 | A1 |
20120129543 | Patel et al. | May 2012 | A1 |
20120131650 | Gutt et al. | May 2012 | A1 |
20120149300 | Forster | Jun 2012 | A1 |
20120184203 | Tulino et al. | Jul 2012 | A1 |
20120194385 | Schmidt et al. | Aug 2012 | A1 |
20120206299 | Valdes-Garcia | Aug 2012 | A1 |
20120230274 | Xiao et al. | Sep 2012 | A1 |
20120238202 | Kim et al. | Sep 2012 | A1 |
20120250659 | Sambhwani | Oct 2012 | A1 |
20120259547 | Morlock et al. | Oct 2012 | A1 |
20120314570 | Forenza et al. | Dec 2012 | A1 |
20130027240 | Chowdhury | Jan 2013 | A1 |
20130027250 | Chen | Jan 2013 | A1 |
20130040558 | Kazmi | Feb 2013 | A1 |
20130044028 | Lea et al. | Feb 2013 | A1 |
20130057447 | Pivit et al. | Mar 2013 | A1 |
20130089123 | Rahul et al. | Apr 2013 | A1 |
20130094439 | Moshfeghi | Apr 2013 | A1 |
20130094522 | Moshfeghi | Apr 2013 | A1 |
20130094544 | Moshfeghi | Apr 2013 | A1 |
20130095747 | Moshfeghi | Apr 2013 | A1 |
20130095770 | Moshfeghi | Apr 2013 | A1 |
20130095874 | Moshfeghi et al. | Apr 2013 | A1 |
20130114468 | Hui et al. | May 2013 | A1 |
20130155891 | Dinan | Jun 2013 | A1 |
20130272220 | Li et al. | Oct 2013 | A1 |
20130272437 | Eidson et al. | Oct 2013 | A1 |
20130286962 | Heath, Jr. et al. | Oct 2013 | A1 |
20130287139 | Zhu et al. | Oct 2013 | A1 |
20130322561 | Abreu et al. | Dec 2013 | A1 |
20130324055 | Kludt et al. | Dec 2013 | A1 |
20130343235 | Khan | Dec 2013 | A1 |
20140003338 | Rahul et al. | Jan 2014 | A1 |
20140010319 | Baik et al. | Jan 2014 | A1 |
20140016573 | Nuggehalli et al. | Jan 2014 | A1 |
20140035731 | Chan et al. | Feb 2014 | A1 |
20140044041 | Moshfeghi | Feb 2014 | A1 |
20140044042 | Moshfeghi | Feb 2014 | A1 |
20140044043 | Moshfeghi et al. | Feb 2014 | A1 |
20140045478 | Moshfeghi | Feb 2014 | A1 |
20140045541 | Moshfeghi et al. | Feb 2014 | A1 |
20140072078 | Sergeyev et al. | Mar 2014 | A1 |
20140198696 | Li et al. | Jul 2014 | A1 |
20140241296 | Shattil | Aug 2014 | A1 |
20150003307 | Moshfeghi et al. | Jan 2015 | A1 |
20150011160 | Jurgovan et al. | Jan 2015 | A1 |
20150031407 | Moshfeghi | Jan 2015 | A1 |
20150042744 | Ralston et al. | Feb 2015 | A1 |
20150091706 | Chemishkian et al. | Apr 2015 | A1 |
20150123496 | Leabman et al. | May 2015 | A1 |
20150229133 | Reynolds et al. | Aug 2015 | A1 |
20150303950 | Shattil | Oct 2015 | A1 |
20150318897 | Hyde et al. | Nov 2015 | A1 |
20150318905 | Moshfeghi et al. | Nov 2015 | A1 |
20150341098 | Angeletti et al. | Nov 2015 | A1 |
20160014613 | Ponnampalam et al. | Jan 2016 | A1 |
20160054440 | Younis | Feb 2016 | A1 |
20160094092 | Davlantes et al. | Mar 2016 | A1 |
20160094318 | Shattil | Mar 2016 | A1 |
20160192400 | Sohn et al. | Jun 2016 | A1 |
20160203347 | Bartholomew et al. | Jul 2016 | A1 |
20160211905 | Moshfeghi et al. | Jul 2016 | A1 |
20160219567 | Gil et al. | Jul 2016 | A1 |
20160285481 | Cohen | Sep 2016 | A1 |
20170026218 | Shattil | Jan 2017 | A1 |
20170078897 | Duan et al. | Mar 2017 | A1 |
20170126374 | Moshfeghi et al. | May 2017 | A1 |
20170156069 | Moshfeghi et al. | Jun 2017 | A1 |
20170201437 | Balakrishnan et al. | Jul 2017 | A1 |
20170212208 | Baek et al. | Jul 2017 | A1 |
20170237290 | Bakker et al. | Aug 2017 | A1 |
20170257155 | Liang et al. | Sep 2017 | A1 |
20170288727 | Rappaport | Oct 2017 | A1 |
20170324480 | Elmirghani et al. | Nov 2017 | A1 |
20170339625 | Stapleton | Nov 2017 | A1 |
20180026586 | Carbone et al. | Jan 2018 | A1 |
20180048390 | Palmer et al. | Feb 2018 | A1 |
20180090992 | Shrivastava et al. | Mar 2018 | A1 |
20180220416 | Islam et al. | Aug 2018 | A1 |
20190089434 | Rainish et al. | Mar 2019 | A1 |
Entry |
---|
Baggett, Benjamin M.W. Optimization of Aperiodically Spaced Phased Arrays for Wideband Applications. MS Thesis. Virginia Polytechnic Institute and State University, 2011. pp. 1-137. |
K. Han and K. Huang, “Wirelessly Powered Backscatter Communication networks: Modeling, Coverage and Capacity,” Apr. 9, 2016, Arxiv.com. |
Non-Final Office Action in U.S. Appl. No. 15/432,091 dated Nov. 22, 2017. |
Notice of Allowance in U.S. Appl. No. 15/432,091 dated Apr. 11, 2018. |
Notice of Allowance in U.S. Appl. No. 15/835,971 dated May 29, 2018. |
Shimin Gong et al., “Backscatter Relay Communications Powered by Wireless Energy Beamforming,” IEEE Trans. on Communication, 2018. |
Non-Final Office Action in U.S. Appl. No. 16/111,326 dated Mar. 1, 2019. |
Notice of Allowance in U.S. Appl. No. 15/607,743 dated Jan. 22, 2019. |
Notice of Allowance in U.S. Appl. No. 15/834,894 dated Feb. 20, 2019. |
Corrected Notice of Allowance in U.S. Appl. No. 15/607,743 dated Apr. 3, 2019. |
Response to Rule 312 Communication for U.S. Appl. No. 15/834,894 dated Apr. 19, 2019; Miscellaneous Communication to Applicant for U.S. Appl. No. 15/834,894 dated Apr. 19, 2019. |
USPTO Miscellaneous communication for U.S. Appl. No. 15/834,894 dated Apr. 19, 2019. |
Corrected Notice of Allowance for U.S. Appl. No. 15/607,743 dated May 10, 2019. |
Corrected Notice of Allowance for U.S. Appl. No. 16/031,007 dated Jul. 8, 2019. |
Ex Parte Quayle Action for U.S. Appl. No. 16/032,668 dated Jul. 10, 2019. |
Notice of Allowance issued in U.S. Appl. No. 16/129,423 dated Jul. 15, 2019 |
Notice of Allowance for U.S. Appl. No. 16/032,617 dated Jul. 18, 2019. |
Non-Final Office Action for U.S. Appl. No. 16/016,619 dated Sep. 25, 2018. |
Corrected Notice of Allowance for U.S. Appl. No. 13/473,180 dated Jun. 11, 2014. |
Corrected Notice of Allowance for U.S. Appl. No. 16/031,007 dated Aug. 5, 2019. |
Examiner's Answer to Appeal Brief for U.S. Appl. No. 13/473,144 dated Jul. 26, 2017. |
Examiner's Answer to Appeal Brief for U.S. Appl. No. 13/473,160 dated Dec. 24, 2015. |
Examiner's Answer to Appeal Brief for U.S. Appl. No. 13/919,932 dated Jan. 10, 2017. |
Final Office Action for U.S. Appl. No. 13/473,144 dated Jul. 28, 2016. |
Final Office Action for U.S. Appl. No. 13/473,144 dated Aug. 14, 2014. |
Final Office Action for U.S. Appl. No. 13/919,932 dated Oct. 23, 2015. |
Final Office Action for U.S. Appl. No. 13/919,972 dated Jan. 21, 2016. |
Final Office Action for U.S. Appl. No. 14/940,130 dated Oct. 14, 2016. |
Final Office Action for U.S. Appl. No. 16/129,413 dated Aug. 13, 2019. |
Final Office Action for U.S. Appl. No. dated Oct. 22, 2014. |
International Preliminary Report on Patentability for International Patent PCT/US2012/058839, 5 pages, dated Apr. 22, 2014. |
List of References cited by Applicant and considered by Applicant for U.S. Appl. No. 14/325,218 dated Apr. 21, 2017. |
Non-Final Office Action for U.S. Appl. No. 13/473,083 dated Mar. 3, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/473,096 dated Apr. 23, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/473,096 dated Dec. 9, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/473,096 dated Nov. 3, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/473,105 dated Nov. 25, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/473,113 dated Oct. 2, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/473,144 dated Feb. 6, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/473,144 dated Feb. 9, 2015. |
Non-Final Office Action for U.S. Appl. No. 13/473,144 dated Oct. 7, 2015. |
Non-Final Office Action for U.S. Appl. No. 13/473,160 dated Jan. 15, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/473,180 dated Sep. 12, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/919,922 dated Jan. 30, 2015. |
Non-Final Office Action for U.S. Appl. No. 13/919,932 dated Feb. 6, 2015. |
Non-Final Office Action for U.S. Appl. No. 13/919,958 dated Jan. 5, 2015. |
Non-Final Office Action for U.S. Appl. No. 13/919,967 dated Feb. 9, 2015. |
Non-Final Office Action for U.S. Appl. No. 13/919,972 dated Jun. 4, 2015. |
Non-Final Office Action for U.S. Appl. No. 14/455,859 dated Nov. 13, 2015. |
Non-Final Office Action for U.S. Appl. No. 14/709,136 dated Sep. 28, 2016. |
Non-Final Office Action for U.S. Appl. No. 14/813,058 dated Jun. 10, 2016. |
Non-Final Office Action for U.S. Appl. No. 14/940,130 dated Apr. 6, 2016. |
Non-Final Office Action for U.S. Appl. No. 14/980,281 dated Apr. 20, 2016. |
Non-Final Office Action for U.S. Appl. No. 14/980,338 dated Mar. 14, 2017. |
Non-Final Office Action for U.S. Appl. No. 15/229,135 dated Dec. 21, 2017. |
Non-Final Office Action for U.S. Appl. No. 15/372,417 dated May 3, 2018. |
Non-Final Office Action for U.S. Appl. No. 15/441,209 dated Jul. 3, 2018. |
Non-Final Office Action for U.S. Appl. No. 15/595,940 dated Nov. 17, 2017. |
Non-Final Office Action for U.S. Appl. No. 15/616,911 dated Jan. 3, 2019. |
Non-Final Office Action for U.S. Appl. No. 15/706,759 dated Jun. 12, 2018. |
Non-Final Office Action for U.S. Appl. No. 15/893,626 dated Jun. 12, 2018. |
Non-Final Office Action for U.S. Appl. No. 16/101,044 dated Dec. 26, 2018. |
Non-Final Office Action for U.S. Appl. No. 16/125,757 dated Aug. 9, 2019. |
Non-Final Office Action for U.S. Appl. No. 16/129,413 dated Feb. 4, 2019. |
Non-Final Office Action for U.S. Appl. No. 16/129,423 dated Feb. 4, 2019. |
Non-Final Office Action for U.S. Appl. No. 16/377,980 dated Aug. 21, 2019. |
Notice of Allowance for U.S. Appl. No. 13/473,083 dated Jan. 7, 2015. |
Notice of Allowance for U.S. Appl. No. 13/473,096 dated Apr. 17, 2015. |
Notice of Allowance for U.S. Appl. No. 13/473,105 dated Jun. 10, 2014. |
Notice of Allowance for U.S. Appl. No. 13/473,113 dated Aug. 10, 2015. |
Notice of Allowance for U.S. Appl. No. 13/473,160 dated May 25, 2017. |
Notice of Allowance for U.S. Appl. No. 13/473,180 dated May 1, 2014. |
Notice of Allowance for U.S. Appl. No. 13/919,922 dated Oct. 27, 2015. |
Notice of Allowance for U.S. Appl. No. 13/919,932 dated Feb. 28, 2018. |
Notice of Allowance for U.S. Appl. No. 13/919,958 dated Sep. 2, 2015. |
Notice of Allowance for U.S. Appl. No. 13/919,967 dated Jul. 29, 2019. |
Notice of Allowance for U.S. Appl. No. 13/919,972 dated Dec. 20, 2016. |
Notice of Allowance for U.S. Appl. No. 14/325,218 dated Dec. 19, 2016. |
Notice of Allowance for U.S. Appl. No. 14/455,859 dated Apr. 20, 2016. |
Notice of Allowance for U.S. Appl. No. 14/709,136 dated Feb. 16, 2017. |
Notice of Allowance for U.S. Appl. No. 14/813,058 dated Nov. 7, 2016. |
Notice of Allowance for U.S. Appl. No. 14/940,130 dated Feb. 1, 2017. |
Notice of Allowance for U.S. Appl. No. 14/980,281 dated Feb. 7, 2017. |
Notice of Allowance for U.S. Appl. No. 14/980,338 dated Feb. 22, 2018. |
Notice of Allowance for U.S. Appl. No. 15/229,135 dated May 22, 2018. |
Notice of Allowance for U.S. Appl. No. 15/372,417 dated Dec. 7, 2018. |
Notice of Allowance for U.S. Appl. No. 15/441,209 dated Dec. 28, 2018. |
Notice of Allowance for U.S. Appl. No. 15/472,148 dated Dec. 10, 2018. |
Notice of Allowance for U.S. Appl. No. 15/595,919 dated Jun. 5, 2019. |
Notice of Allowance for U.S. Appl. No. 15/595,940 dated May 1, 2018. |
Notice of Allowance for U.S. Appl. No. 15/616,911 dated Jul. 24, 2019. |
Notice of Allowance for U.S. Appl. No. 16/129,423 dated Jul. 15, 2019. |
Notice of Allowance for U.S. Appl. No. 16/382,386 dated Jul. 24, 2019. |
Patent Board Decision—Examiner Affirmed for U.S. Appl. No. 13/473,144 dated Jun. 4, 2018. |
Patent Board Decision—Examiner Affirmed in Part for U.S. Appl. No. 13/473,160 dated Feb. 21, 2017. |
Patent Board Decision—Examiner Reversed for U.S. Appl. No. 13/919,932 dated Dec. 19, 2017. |
Restriction Requirement for U.S. Appl. No. 15/893,626 date Aug. 12, 2016. |
Non-Final Office Action for U.S. Appl. No. 16/294,025 dated Sep. 12, 2019. |
Corrected Notice of Allowance for U.S. Appl. No. 16/031,007 dated Sep. 16, 2019. |
Corrected Notice of Allowance for U.S. Appl. No. 15/616,911 dated Oct. 31, 2019. |
Corrected Notice of Allowance for U.S. Appl. No. 15/616,911 dated Dec. 12, 2019. |
Corrected Notice of Allowance for U.S. Appl. No. 16/031,007 dated Oct. 22, 2019. |
Corrected Notice of Allowance for U.S. Appl. No. 16/032,617 dated Oct. 28, 2019. |
Corrected Notice of Allowance for U.S. Appl. No. 16/129,423 dated Nov. 7, 2019. |
Final Office Action for U.S. Appl. No. 16/125,757 dated Dec. 2, 2019. |
Misc Communication from USPTO for U.S. Appl. No. 16/382,386 dated Oct. 8, 2019. |
Non-Final Office Action for U.S. Appl. No. 16/231,903 dated Sep. 18, 2019. |
Non-Final Office Action for U.S. Appl. No. 16/526,544 dated Sep. 18, 2019. |
Non-Final Office Action in U.S. Appl. No. 15/836,198 dated Oct. 31, 2019. |
Notice of Allowance for U.S. Appl. No. 16/032,668 dated Sep. 20, 2019. |
Notice of Allowance for U.S. Appl. No. 15/595,919 dated Oct. 25, 2019. |
Notice of Allowance for U.S. Appl. No. 16/129,423 dated Nov. 27, 2019. |
Notice of Allowance for U.S. Appl. No. 16/111,326 dated Oct. 10, 2019. |
Number | Date | Country | |
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20190267721 A1 | Aug 2019 | US |