The present disclosure generally relates to optical connections and, more particularly, to waveguide substrates, waveguide substrate connector assemblies, and methods of fabricating waveguide substrates for providing optical connections between optical fibers of optical connectors.
In optical communication networks, optical cables and equipment are used to route the optical signals to desired network locations. For example, some pieces of equipment may serve as junction points between different optical cables. At these junction points it is often necessary to breakout optical signals from one cable to smaller groups of the optical signals (or even individual optical signals), which may then be carried by a larger number of other cables for further distribution in the network. A common piece of fiber optic equipment that is used to breakout optical signals in this manner is known as a fiber optic module or cassette, an example of which is illustrated in
As another example, some pieces of equipment may serve a junction point between one or more optical cables and opto-electrical components. This type of equipment often comprises a housing or enclosure having a faceplate or bulkhead that supports one or more adapters for interfacing with connector(s) that terminate the cable(s). Within the housing, optical fibers are often used to route optical signals from the adapter(s) to the opto-electrical components.
Although optical fibers are commonly used to route optical signals within bodies or housings, managing their connections and routing/placement can be challenging, especially when there is a drive to keep equipment as small as possible. One potential solution to address these challenges involves using a waveguide substrate to achieve the desired optical signal routing within a body or housing. The waveguide substrate may be a glass substrate with waveguides formed by a laser, ion-exchange processes, or other techniques. Several examples of such a waveguide substrate are disclosed in WO 2019/195219A (“the '219 publication”), entitled “WAVEGUIDE SUBSTRATES AND WAVEGUIDE SUBSTRATE CONNECTOR ASSEMBLIES HAVING WAVEGUIDES AND ALIGNMENT FEATURES AND METHODS OF FABRICATING THE SAME,” the disclosure of which is fully incorporated herein by reference. Although the '219 publication discloses various different interfaces for a waveguide substrate to couple to (i.e., mate with) optical connectors, there remains a desire for further designs. The use of waveguide substrates as a substitute for optical fiber routing in network equipment is not widespread, and different designs may have different advantages to further promote the adoption of this technology.
The present disclosure provides a waveguide substrate configured to interface with an optical connector that includes a ferrule extending from a connector body. The waveguide substrate comprises: a first surface and a second surface opposite the first surface; and a communication side defined between the first surface and the second surface. The communication side has at least one projecting boss that at least partially defines a bore for receiving the ferrule of the optical connector. Each projecting boss of the at least one projecting boss includes an outboard end from which the bore extends into the waveguide substrate, and an end of the bore within the waveguide substrate defines an optical interface surface. The waveguide substrate also comprises at least one waveguide within the waveguide substrate extending from the optical interface surface of the bore; and a first slot formed in each projecting boss of the at least one projecting boss. The first slot is formed between the bore of the projecting boss and the first surface, and extends from the outboard end of the projecting boss and along a majority of the bore.
In some embodiments, the waveguide substrate further comprises a second slot formed in each projecting boss of the at least one projecting boss. The second slot is formed between the bore of the projecting boss and the second surface, and extends from the outboard end of the projecting boss and along a majority of the bore.
In some embodiments, for each projecting boss of the at least one projecting boss, the communication side of the waveguide substrate further includes relief cavities adjacent the projecting boss for receiving a portion of the connector body. The first slot formed in each projecting boss may extend further into the waveguide substrate than the relief cavities.
Optical waveguide assemblies are also provided in this disclosure, such assemblies including an optical waveguide substrate (e.g., as described above) and at least one housing coupled to the communication side of the waveguide substrate. The communication side of the waveguide substrate includes relief cavities adjacent each projecting boss of the at least one projecting boss. Each housing comprises at least one connector cavity for receiving the optical connector. Each of the relief cavities in the communication side of the waveguide substrate and each projecting boss communicate with the at least one connector cavity.
Fiber optic assemblies are also provided in this disclosure. According to one embodiment, a fiber optic assembly comprises a body defining an interior and an optical wave assembly (e.g., as described in the preceding paragraph) positioned in the interior of the body. The fiber optic assembly may a fiber optic module/cassette in some embodiments.
Additional features and advantages will be set out in the detailed description below, and in part will be readily apparent to those skilled in the technical field of optical connectivity. It is to be understood that the foregoing general description, the following detailed description, and the accompanying drawings are merely exemplary and intended to provide an overview or framework to understand the nature and character of the claims.
The accompanying drawings are included to provide a further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiment(s), and together with the description serve to explain principles and operation of the various embodiments. Features and attributes associated with any of the embodiments shown or described may be applied to other embodiments shown, described, or appreciated based on this disclosure.
Various embodiments will be clarified by examples in the description below. In general, the description relates to a waveguide substrate that interfaces with one or more optical connectors. The waveguide substrate is designed to route optical signals from the optical fiber(s) that are terminated by the optical connector(s). To this end, the waveguide substrate may be used in fiber optic equipment where optical signal routing takes place. For example, the waveguide substrate may be used in fiber optic modules/cassettes (e.g., the fiber optic module 10 of
Referring to
In the embodiment shown, four subsets of the waveguides 110 are provided at the second side 104, with the two waveguides 110 of each subset having a particular pitch at the second side 104. This pitch differs than the pitch between the waveguides 110 of adjacent subsets at the second side 104 in the embodiment shown, but in alternative embodiments the pitch between all the waveguides 110 at the second side 104 may be uniform. The break-out of optical signals from a larger connection group to smaller connection groups or even to individual connections facilitates the routing of optical signals toward different locations in the optical network. In alternative embodiments, there may be a different number of waveguides 110 in the larger connection group and/or smaller connection groups, such as 4, 8, 12, 24, 36, 48, etc. waveguides 110 at the first side 102 breaking out into a plurality of smaller subsets of 2, 4, 8, 12, etc. at the second side 104.
The first side 102 may be considered an input side because of its association with the larger connection group, and the second side 104 may be considered an output side. The references to “input” and “output” are therefore related to breaking out the larger connection group and not necessarily optical signal direction, as there may be two-way optical traffic between the first side 102 and the second side 104 using the waveguides 110. More generically, the first side 102 and the second side 104 may each be referred to as a “communication side” of the waveguide substrate 100 because optical signals enter and/or exit the waveguides 110 on these sides.
Each waveguide 110 is defined by a line on or channel within the waveguide substrate 100 having a refractive index that is different from the material outside of the waveguide 110 such that light is maintained within the waveguide 110 when propagating through the waveguide substrate 100. Any known or yet-to-be-developed methods of forming waveguides 110 in the waveguide substrate 100 may be used. For example, an ion-exchange process may be used to write the waveguides 110 by using a mask to change the refractive index of the material along paths defining the desired waveguides. As another example, a laser may be used to create two-dimensional or three-dimensional waveguides within bulk material of the waveguide substrate 100.
In the illustrated example, ends of the waveguides 110 are relatively closely spaced (i.e., have a small pitch) at the first side 102, and spread out to be relatively largely spaced (i.e., have a large pitch) at the second side 104. As a non-limiting example, and described in detail below, the first side 102 may be configured to interface with a multifiber push-on/pull-off (MPO) connector (e.g., according to standard IEC 61754-7-2: 2019 or TIA/EIA 604-5-F: 2019), while the second side 104 may be configured to interface with LC connectors (e.g., simplex or duplex connectors according to intermatability standard IEC 61754-20-2: 2012 or TIA/EIA 604-10-B: 2008).
As shown in
The second side 104 also includes a plurality of alignment features 118 configured to provide alignment of one or more housings (also not shown in
The present disclosure instead introduces new configurations of the waveguide substrate 100 for connectivity/mating purposes. Specifically, the present disclosure introduces new, advantageous configurations for coupling with an optical connector that includes one or more ferrules extending from a connector body. For example, the embodiment shown in
Each bore 122 extends into the waveguide substrate 100 from the outboard end 130 of the corresponding projecting boss 120. The bores 122 are effectively “blind” bores, terminating within the waveguide substrate 100 at respective optical interface surfaces 132. Thus, the optical interface surfaces 132 can be considered as bottom or end surfaces of the bores 122. The waveguides 110 of the waveguide substrate 100 extend from the optical interface surfaces 132.
The bores 122 may be formed using a laser damage-and-etch process. For example, a pulsed laser beam may be used to modify material of the waveguide substrate 100 where the bores 122 are desired. Etching solution may then be applied to etch away the modified/damaged material to form the bores 122. To facilitate such etching, the waveguide substrate 100 in the embodiment shown includes a first slot 136 and a second slot 138 formed in each projecting boss 120. Each first slot 136 is formed between the bore 122 of the projecting boss 120 and the first surface 106. Each first slot 136 also extends from the outboard end 130 of the projecting boss 120 and along a majority of the bore 122. For example, each bore 122 can be considered to have a length between its outboard end 130 and its optical interface surface 132, and the first slot 136 may extend along at least 50%, at least 75%, at least 90%, etc. of that length. Likewise, each second slot 138 is formed between the bore 122 of the projecting boss 120 and the second surface 108 so as to be opposite the first slot 136, and extends from the outboard end 130 of the projecting boss 120 and along a majority of the bore 122. The relatively long length of the first slot 136 and the second slot 138 may allow etching solution to better reach (and thereby etch away) all laser-damaged material intended to define the bore 122.
Still referring to
Two duplex LC connectors 158 (“connectors 158”) are shown as being coupled to the housing 154, which is configured to accept a total of four of such connectors 158 (for a total of eight LC fiber optic connections) in respective connector cavities 160 defined by the housing 154. In essence, the housing 154 has a ganged configuration, functioning like various individual housings that have a respective connector cavity for receiving a connector 158. Indeed, individual housings (not shown) for each connector 158 that interfaces with the second side 104 of the waveguide substrate 100 may be provided in alternative embodiments. For example, the individual housings may correspond to simplex adapters or duplex adapters, depending on the configuration of the connector with which the second side 104 is designed to interface. Configurations involving housings with a smaller ganged arrangement (e.g., only configured to accept two connectors 158) are also possible. The housing 154 helps align optical fibers (not shown) supported by the connectors 158 with the waveguides 110 (
For example,
When inserting the connector 158/connector sub-assembly 180 into a connector cavity 160 of the housing 154, the ring 174 provides coarse alignment for the ferrule 184, leading it to the bore 122 of the projecting boss 120. Further insertion of the connector 158 is possible because the relief cavities 140 accommodate portions of the connector body 182, as shown in
When coupled together, the housing 154 and the second side 104 of the waveguide substrate 100 may define an interface that complies with intermatability standards or specifications for the connectors 158. Thus, in the embodiment shown, the housing 154 and the second side 104 of the waveguide substrate 100 may cooperate to define a receptacle/adapter according to duplex configurations in LC intermatability standards (e.g., IEC 61754-20-2: 2012 or TIA/EIA 604-10-B: 2008). In alternative embodiments, the second side 104 of the waveguide substrate 100 and the housing 154 may be designed to accept different types of connectors, such as CS connectors, SN connectors, or MDC connectors according to the QSFP-DD Multi-Source Agreement (MSA) Hardware Specification, Rev. 5.1, 2020 (and the relevant documents cross-referenced therein).
Referring to both
Similarly, the adapter 16 may be defined by the housing 152 alone or in combination with the first side 102 of the waveguide substrate 100. Thus, the housing 152 alone or in combination with the first side 102 of the waveguide substrate 100 may define a receptacle/adapter according to MPO intermatability standards (e.g., according to standard IEC 61754-7-2: 2019 or TIA/EIA 604-5-F: 2019). The shape of the waveguide substrate 100 and routing/path of the waveguides 110 can be designed/configured based on the design of the fiber optic module 10, and particularly the relative positions of the adapters 16, 18. The configuration does not change the manner in which the optical waveguide assembly 150 functions to route optical signals in the manner discussed above. The fiber optic module 10 may include additional features such as side rails 22 on the body 12, with one of the rails 22 being integral with a rear latch 24.
Those skilled in the art will appreciate that other modifications and variations can be made without departing from the spirit or scope of the invention. For example, although only
Since modifications, combinations, sub-combinations, and variations of the disclosed embodiments incorporating the spirit and substance of the invention may occur to persons skilled in the art, the invention should be construed to include everything within the scope of the appended claims and their equivalents.
This application claims the benefit of priority of U.S. Provisional Application No. 63/135,823, filed on Jan. 11, 2021, and U.S. Provisional Application No. 63/185,507, filed on May 7, 2021, the content of which is relied upon and incorporated herein by reference in entirety.
Number | Name | Date | Kind |
---|---|---|---|
5155785 | Holland | Oct 1992 | A |
5343544 | Boyd et al. | Aug 1994 | A |
5367594 | Essert | Nov 1994 | A |
6062740 | Ohtsuka | May 2000 | A |
6477290 | Wan | Nov 2002 | B1 |
6754429 | Borrelli et al. | Jun 2004 | B2 |
6850671 | Carnevale et al. | Feb 2005 | B2 |
6990265 | Kubby et al. | Jan 2006 | B2 |
8270784 | Thomson | Sep 2012 | B2 |
8699838 | Andrzejewski | Apr 2014 | B2 |
9029242 | Holden et al. | May 2015 | B2 |
9223094 | Schneider | Dec 2015 | B2 |
9348096 | Kmit et al. | May 2016 | B2 |
9442259 | Furuya | Sep 2016 | B2 |
9753229 | Murray | Sep 2017 | B2 |
9829667 | White | Nov 2017 | B2 |
9846283 | Pepe | Dec 2017 | B2 |
10459160 | Brusberg | Oct 2019 | B2 |
10684419 | Fortusini et al. | Jun 2020 | B2 |
10955633 | Schneider | Mar 2021 | B2 |
11372169 | Evans | Jun 2022 | B2 |
20040240812 | Sun | Dec 2004 | A1 |
20040258359 | Corkum et al. | Dec 2004 | A1 |
20100220957 | Asahi | Sep 2010 | A1 |
20120057836 | Andrzejewski | Mar 2012 | A1 |
20130094801 | Morris | Apr 2013 | A1 |
20140205241 | Nielson | Jul 2014 | A1 |
20140294339 | Lagziel et al. | Oct 2014 | A1 |
20150166396 | Marjanovic et al. | Jun 2015 | A1 |
20150261261 | Bhagavatula et al. | Sep 2015 | A1 |
20160025942 | Pepe | Jan 2016 | A1 |
20160199944 | Hosseini | Jul 2016 | A1 |
20170059781 | Fortusini | Mar 2017 | A1 |
20170146751 | Sutherland | May 2017 | A1 |
20180156985 | Nielson | Jun 2018 | A1 |
20190302371 | Van Wuijckhuijse | Oct 2019 | A1 |
20200241220 | Evans | Jul 2020 | A1 |
20210018697 | Evans | Jan 2021 | A1 |
20220128767 | Evans | Apr 2022 | A1 |
20220221669 | de Jong | Jul 2022 | A1 |
Number | Date | Country |
---|---|---|
1381736 | Nov 2002 | CN |
101576711 | Nov 2009 | CN |
102958642 | Mar 2013 | CN |
102971838 | Mar 2013 | CN |
103018799 | Apr 2013 | CN |
105246850 | Jan 2016 | CN |
105618936 | Jun 2016 | CN |
1162484 | Dec 2001 | EP |
3077150 | Oct 2016 | EP |
04-284406 | Oct 1992 | JP |
09-311237 | Dec 1997 | JP |
2002-267852 | Sep 2002 | JP |
2009001969 | Dec 2008 | WO |
2012023430 | Feb 2012 | WO |
2014165175 | Oct 2014 | WO |
2015081436 | Jun 2015 | WO |
2016137488 | Sep 2016 | WO |
2017046190 | Mar 2017 | WO |
2019195219 | Oct 2019 | WO |
Entry |
---|
CommScope, “Fiber Indexing”, available online at <https://web.archive.org/web/20170903124659if_/http://www.commscope.com/Solutions/Fiber-Indexing/>, 2017, 3 pages. |
Corbari et al., “Femtosecond versus picosecond laser machining of nano-gratings and micro-channels in silica glass”, Optics Express, vol. 21, No. 4, 2013, pp. 3946-3958. |
Fernández-Pradas et al., “Laser fabricated microchannels inside photostructurable glass-ceramic”, Applied Surface Science, vol. 255, No. 10, 2009, pp. 5499-5502. |
International Search Report and Written Opinion of the International Searching Authority; PCT/US2019/025294; dated Jun. 25, 2019; 12 Pages; European Patent Office. |
Karimelahi et al., “Rapid micromachining of high aspect ratio holes in fused silica glass by high repetition rate picosecond laser”, Applied Physics A: Materials Science and Processing, vol. 114, 2013, pp. 91-111. |
Optoscribe, “Fiber Coupled InterconneX (FCX™) for Photonic Integration”, available online at <https://web.archive.org/web/20170509155220/http://www.optoscribe.com:80/products/fcx-fiber-coupled-interconnex/>, May 9, 2017, 2 pages. |
Number | Date | Country | |
---|---|---|---|
20220221669 A1 | Jul 2022 | US |
Number | Date | Country | |
---|---|---|---|
63185507 | May 2021 | US | |
63135823 | Jan 2021 | US |