Waveguides and backplane systems

Information

  • Patent Grant
  • 6724281
  • Patent Number
    6,724,281
  • Date Filed
    Friday, October 12, 2001
    23 years ago
  • Date Issued
    Tuesday, April 20, 2004
    20 years ago
Abstract
Waveguides and backplanes systems are disclosed. A waveguide according to the present invention includes a first conductive channel, and a second conductive channel disposed generally parallel to the first channel. A gap is defined between the first and second channels that allows propagation along a waveguide axis of electromagnetic waves in a TE n,0 mode, wherein n is an odd number, but suppresses electromagnetic waves in a TE m,0 mode, wherein m is an even number. An NRD waveguide is disclosed that includes an upper conductive plate and a lower conductive plate, with a dielectric channel disposed between the conductive plates. A second channel is disposed adjacent to the dielectric channel between the conductive plates. The upper conductive plate has a gap above the dielectric channel that allows propagation along a waveguide axis of electromagnetic waves in an odd longitudinal magnetic mode, but suppresses electromagnetic waves in an even longitudinal magnetic mode. A backplane system according to the invention includes a substrate with a waveguide connected thereto. The backplane system includes at least one transmitter connected to the waveguide for sending an electrical signal along the waveguide, and at least one receiver connected to the waveguide for accepting the electrical signal.
Description




FIELD OF THE INVENTION




This invention relates to waveguides and backplane systems. More particularly, the invention relates to broadband microwave modem waveguide backplane systems.




BACKGROUND OF THE INVENTION




The need for increased system bandwidth for broadband data transmission rates in telecommunications and data communications backplane systems has led to several general technical solutions. A first solution has been to increase the density of moderate speed parallel bus structures. Another solution has focused on relatively less dense, high data rate differential pair channels. These solutions have yielded still another solution—the all cable backplanes that are currently used in some data communications applications. Each of these solutions, however, suffers from bandwidth limitations imposed by conductor and printed circuit board (PCB) or cable dielectric losses.




The Shannon-Hartley Theorem provides that, for any given broadband data transmission system protocol, there is usually a linear relationship between the desired system data rate (in Gigabits/sec) and the required system 3 dB bandwidth (in Gigahertz). For example, using fiber channel protocol, the available data rate is approximately four times the 3 dB system bandwidth. It should be understood that bandwidth considerations related to attenuation are usually referenced to the so-called “3 dB bandwidth.”




Traditional broadband data transmission with bandwidth requirements on the order of Gigahertz generally use a data modulated microwave carrier in a “pipe” waveguide as the physical data channel because such waveguides have lower attenuation than comparable cables or PCB's. This type of data channel can be thought of as a “broadband microwave modem” data transmission system in comparison to the broadband digital data transmission commonly used on PCB backplane systems. The present invention extends conventional, air-filled, rectangular waveguides to a backplane system. These waveguides are described in detail below.




Another type of microwave waveguide structure that can be used as a backplane data channel is the non-radiative dielectric (NRD) waveguide operating in the transverse electric


1


,


0


(TE


1


,


0


) mode. The TE


1


,


0


NRD waveguide structure can be incorporated into a PCB type backplane bus system. This embodiment is also described in detail in below. Such broadband microwave modem waveguide backplane systems have superior bandwidth and bandwidth-density characteristics relative to the lowest loss conventional PCB or cable backplane systems.




An additional advantage of the microwave modem data transmission system is that the data rate per modulated symbol rate can be multiplied many fold by data compression techniques and enhanced modulation techniques such as K-bit quadrature amplitude modulation (QAM), where K=16, 32, 64, etc. It should be understood that, with modems (such as telephone modems, for example), the data rate can be increased almost a hundred-fold over the physical bandwidth limits of so-called “twisted pair” telephone lines.




Waveguides have the best transmission characteristics among many transmission lines, because they have no electromagnetic radiation and relatively low attenuation. Waveguides, however, are impractical for circuit boards and packages for two major reasons. First, the size is typically too large for a transmission line to be embedded in circuit boards. Second, waveguides must be surrounded by metal walls. Vertical metal walls cannot be manufactured easily by lamination techniques, a standard fabrication technique for circuit boards or packages. Thus, there is a need in the art for a broadband microwave modem waveguide backplane systems for laminated printed circuit boards.




SUMMARY OF THE INVENTION




A waveguide according to the present invention comprises a first conductive channel disposed along a waveguide axis, and a second conductive channel disposed generally parallel to the first channel. A gap is defined between the first and second channels along the waveguide axis. The gap has a gap width that allows propagation along the waveguide axis of electromagnetic waves in a TE n,


0


mode, wherein n is an odd number, but suppresses electromagnetic waves in a TE m,


0


mode, wherein m is an even number.




Each channel can have an upper broadwall, a lower broadwall opposite and generally parallel to the upper broadwall, and a sidewall generally perpendicular to and connected to the broadwalls. The upper broadwall of the first channel and the upper broadwall of the second channel are generally coplanar, and the gap is defined between the upper broadwall of the first channel and the upper broadwall of the second channel. Similarly, the lower broadwall of the first channel and the lower broadwall of the second channel are generally coplanar, and a second gap is defined between the lower broadwall of the first channel and the lower broadwall of the second channel. Thus, the first channel can have a generally C-shaped, or generally I-shaped cross-section along the waveguide axis, and can be formed by bending a sheet electrically conductive material.




In another aspect of the invention, an NRD waveguide having a gap in its conductor for mode suppression, comprises an upper conductive plate and a lower conductive plate, with a dielectric channel disposed along a waveguide axis between the conductive plates. A second channel is disposed along the waveguide axis adjacent to the dielectric channel between the conductive plates. The upper conductive plate has a gap along the waveguide axis above the dielectric channel. The gap has a gap width that allows propagation along the waveguide axis of electromagnetic waves in an odd longitudinal magnetic mode, but suppresses electromagnetic waves in an even longitudinal magnetic mode.




A backplane system according to the invention comprises a substrate, such as a printed circuit board or multilayer board, with a waveguide connected thereto. The waveguide can be a non-radiative dielectric waveguide, or an air-filled rectangular waveguide. According to one aspect of the invention, the waveguide has a gap therein for preventing propagation of a lower order mode into a higher order mode.




The backplane system includes at least one transmitter connected to the waveguide for sending an electrical signal along the waveguide, and at least one receiver connected to the waveguide for accepting the electrical signal. The transmitter and the receiver can be transceivers, such as broadband microwave modems.




Another backplane system according to the invention can include a first dielectric substrate and a second dielectric substrate disposed generally parallel to and spaced from the first substrate. First and second conductive channels are disposed between the first and second substrates. The first channel is disposed along a waveguide axis. The second channel is disposed generally parallel to and spaced from the first channel to thereby define a gap between the first and second channels along the waveguide axis. The gap has a gap width that allows propagation along the waveguide axis of electromagnetic waves in TE n,


0


mode, wherein n is an odd number, but suppresses electromagnetic waves in a TE m,


0


mode, wherein m is an even number.











BRIEF DESCRIPTION OF THE DRAWINGS




The foregoing summary, as well as the following detailed description of the preferred embodiments, is better understood when read in conjunction with the appended drawings. For the purpose of illustrating the invention, there is shown in the drawings an embodiment that is presently preferred, it being understood, however, that the invention is not limited to the specific methods and instrumentalities disclosed.





FIG. 1

shows a plot of channel bandwidth vs. data channel pitch for a 0.75 m prepreg backplane.





FIG. 2

shows a plot of bandwidth density vs. data channel pitch for a 0.75 m prepreg backplane.





FIG. 3

shows a plot of bandwidth vs. bandwidth density/layer for a 0.5 m FR-4 backplane, and 1 m and 0.75 m prepreg backplanes.





FIG. 4

shows a schematic of a backplane system in accordance with the present invention.





FIG. 5

depicts a closed, extruded, conducting pipe, rectangular waveguide.





FIG. 6

depicts the current flows for the TE


1


,


0


mode in a closed, extruded, conducting pipe, rectangular waveguide.





FIG. 7A

depicts a split rectangular waveguide according to the present invention.





FIG. 7B

depicts an air-filled waveguide backplane system according to the present invention.





FIG. 8

shows a plot of attenuation vs. frequency in a rectangular waveguide.





FIG. 9

shows plots of the bandwidth and bandwidth density characteristics of various waveguide backplane systems.





FIG. 10

provides the attenuation versus frequency characteristics of conventional laminated waveguides using various materials.





FIG. 11

provides the attentuation versus frequency characteristics of a backplane system according to the present invention.





FIG. 12

provides the attenuation versus frequency characteristics of another backplane system according to the present invention.





FIG. 13A

depicts a prior art non-radiative dielectric (NRD) waveguide.





FIG. 13B

shows a plot of the field patterns for the odd mode in the prior art waveguide of FIG.


13


A.





FIG. 14

shows a dispersion plot for the TE


1


,


0


mode in a prior art NRD waveguide.





FIG. 15A

depicts an NRD waveguide backplane system.





FIG. 15B

depicts an NRD waveguide backplane system according to the present invention.





FIG. 16

shows a plot of inter-waveguide crosstalk vs. frequency for the waveguide system of FIG.


13


A.











DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS




Example of a Conventional System: Broadside Coupled Differential Pair PCB Backplane




The attenuation (A) of a broadside coupled PCB conductor pair data channel has two components: a square root of frequency (f) term due to conductor losses, and a linear term in frequency arising from dielectric losses. Thus,








A


=(


A




1


*SQRT(


f


)


+A




2




*f


)*


L


*(8.686 db/neper)  (1)






where








Al


=(π*μ


0


*ρ)


0.5


/(


w/p


)*


p*Z




0


  (2)






and








A




2




=π*DF


*(μ


0





0


))


0.5


.  (3)






The data channel pitch is p, w is the trace width, ρ is the resistivity of the PCB traces, and ε and DF are the permittivity and factor of the PCB dielectric, respectively. For scaling, w/p is held constant at −0.5 or less and Z


0


is held constant by making the layer spacing between traces, h, proportional to p where h/p=0.2. The solution of Equation (1) for A=3 dB yields the 3 dB bandwidth of the data channel for a specific backplane length, L.




“SPEEDBOARD,” which is manufactured and distributed by Gore, is an example of a low loss, fluorinated polycarbon (e.g.. “TEFLON”) laminate.

FIG. 1

shows a plot of the bandwidth per channel for a 0.75 m “SPEEDBOARD” backplane as a function of data channel pitch. As the data channel pitch, p, decreases, the channel bandwidth also decreases due to increasing conductor losses relative to the dielectric losses. For a highly parallel (i.e., small data channel pitch) backplane. it is desirable that the density of the parallel channels increase faster than the corresponding drop in channel bandwidth. Consequently, the bandwidth density per channel layer, BW/p, is of primary concern. It is also desirable that the total system bandwidth increase as the density of the parallel channels increases.

FIG. 2

shows a plot of bandwidth density vs. data channel pitch for a 0.75 m “SPEEDBOARD” backplane. It can be seen from

FIG. 2

, however, that the bandwidth-density reaches a maximum at a channel pitch of approximately 1.2 mm. Any change in channel pitch beyond this maximum results in a decrease in bandwidth density and, consequently, a decrease in system performance. The maximum in bandwidth density occurs when the conductor and dielectric losses are approximately equal.




The backplane connector performance can be characterized in terms of the bandwidth vs. bandwidth-density plane, or “phase plane” representation. Plots of bandwidth vs. bandwidth density/layer for a 0.5 m glass reinforced epoxy resin (e.g., “FR-4”) backplane. and for 1.0 m and 0.75 m “SPEEDBOARD” backplanes are shown in

FIG. 3

, where channel pitch is the independent variable. It is evident that, for a given bandwidth density, there are two possible solutions for channel bandwidth, i.e., a dense low bandwidth “parallel” solution, and a high bandwidth “serial” solution. The limits on bandwidth-density for even high performance PCBs should be clear to those of skill in the art.




Backplane System





FIG. 4

shows a schematic of a backplane system B in accordance with the present invention. Backplane system B includes a substrate S, such as a multilayer board (MLB) or a printed circuit board (PCB). A waveguide W mounts to substrate S, either on an outer surface thereof, or as a layer in an inner portion of an MLB (not shown).




Waveguide W transports electrical signals between one or more transmitters T and one or more receivers R. Transmitters T and receivers R could be transceivers and, preferably, broad band microwave modems.




Preferably, backplane system B uses waveguides having certain characteristics. The preferred waveguides will now be described.




Air Filled Rectangular Waveguide Backplane System





FIG. 5

depicts a closed, extruded, conducting pipe, rectangular waveguide


10


. Waveguide


10


is generally rectangular in cross-section and is disposed along a waveguide axis


12


(shown as the z-axis in FIG.


5


). Waveguide


10


has an upper broadwall


14


disposed along waveguide axis


12


, and a lower broadwall


16


opposite and generally parallel to upper broadwall


14


. Waveguide


10


has a pair of sidewalls


18


A,


18


B, each of which is generally perpendicular to and connected to broadwalls


12


and


14


. Waveguide


10


has a width a and a height b. Height b is typically less than width a. The fabrication of such a waveguide for backplane applications can be both difficult and expensive.





FIG. 6

depicts the current flows for the TE


1


,


0


mode in walls


14


and


18


B of waveguide


10


. It can be seen from

FIG. 6

that the maximum current is in the vicinity of the edges


20


A,


20


B of waveguide


10


, and that the current in the middle of upper broadwall


14


is only longitudinal (i.e., along waveguide axis


12


).




According to the present invention, a longitudinal gap is introduced in the broadwalls so that the current and field patterns for the TE


1


,


0


mode are unaffected thereby. As shown in

FIG. 7A

, a waveguide


100


of the present invention includes a pair of conductive channels


102


A,


102


B. First channel


102


A is disposed along a waveguide axis


110


. Second channel


102


B is disposed generally parallel to first channel


102


A to define a gap


112


between first channel


102


A and second channel


102


B.




Gap


112


allows propagation along waveguide axis


110


of electromagnetic waves in a TE n,


0


mode, where n is an odd integer, but suppresses the propagation of electromagnetic waves in a TE n,


0


mode, where n is an even integer. Waveguide


100


suppresses the TE n,


0


modes for even values of n because gap


112


is at the position of maximum transverse current for those modes. Consequently, those modes cannot propagate in wave guide


100


. Consequently, waves can continue to be propagated in the TE


1


,


0


mode, for example, until enough energy builds up to allow the propagation of waves in the TE


3


,


0


mode. Because the TE n,


0


modes are suppressed for even values of n, waveguide


100


is a broadband waveguide.




Waveguide


100


has a width a and height b. To ensure suppression of the TE n,


0


modes for even values of n, the height b of waveguide


100


is defined to be about 0.5 a or less. The data channel pitch p is approximately equal to a. The dimensions of waveguide


100


can be set for individual applications based on the frequency or frequencies of interest. Gap


112


can have any width, as long as an interruption of current occurs. Preferably, gap


112


extends along the entire length of waveguide


100


.




As shown in

FIG. 7A

, each channel


102


A,


102


B has an upper broadwall


104


A,


104


B, a lower broadwall


106


A,


106


B opposite and generally parallel to its upper broadwall


104


A,


104


B, and a sidewall


108


A,


108


B generally perpendicular to and connected to broadwalls


104


,


106


. Upper broadwall


104


A of first channel


102


A and upper broadwall


104


B of second channel


102


B are generally coplanar. Gap


112


is defined between upper broadwall


104


A of first channel


102


A and upper broadwall


104


B of the second channel


102


B.




Similarly, lower broadwall


106


A of first channel


102


A and lower broadwall


106


B of second channel


102


B are generally coplanar, with a second gap


114


defined therebetween. Sidewall


108


A of first channel


102


A is opposite and generally parallel to sidewall


108


B of second channel


102


B. Side walls


108


A and


108


B are disposed opposite one another to form boundaries of waveguide


100


.




An array of waveguides


100


can then be used to form a backplane system


120


as shown in FIG.


7


B. As described above in connection with

FIG. 7A

, each waveguide


100


has a width, a. Backplane system


120


can be constructed using a plurality of generally “I” shaped conductive channels


103


or “C” shaped conductive channels


102


A,


102


B. Preferably, the conductive channels are made from a conductive material, such as copper, which can be fabricated by extrusion or by bending a sheet of conductive material. The conductive channels can then be laminated (by gluing, for example), between two substrates


118


A,


118


B, which, in a preferred embodiment, are printed circuit boards (PCBs). The PCBs could have, for example, conventional circuit traces (not shown) thereon.




Unlike the conventional systems described above, the attenuation in a waveguide


110


of present invention is less than 0.2 dB/meter and is not the limiting factor on bandwidth for backplane systems on the order of one meter long. Instead, the bandwidth limiting factor is mode conversion from a low order mode to the next higher mode caused by discontinuities or irregularities along the waveguide. (Implicit in the following analysis of waveguide systems is the assumption of single, upper-sideband modulation with or without carrier suppression.)





FIG. 8

is a plot of attenuation vs. frequency in a rectangular waveguide


100


according to the present invention. It can be seen from

FIG. 8

that the lowest operating frequency, f


0


, that avoids severe attenuation near cutoff is approximately twice the TE


1


,


0


cutoff frequency, f


c


, or








fc<f




0


≦2*(


c


/2


a


)=


c/a


  (4).






The cutoff frequency for the TE


3


,


0


mode, which is the next higher mode because of gap


112


, is three times the TE


1


,


0


cutoff frequency or








f




m


=3*(


c


/2


a


)=1.5


*f




0


  (5).






The bandwidth, BW, based on the upper sideband limit, is then (f


m


-f


0


), which, on substitution for c, the speed of light, is








BW


−150(Ghz*mm)/


p,


  (6)






where p, the data channel pitch, has been substituted for a, the waveguide width. Again, b/p is defined to be less than 0.5 to suppress TE


0


,n modes. The bandwidth density, BWD, is simply the bandwith divided by the pitch or








BWD=BW/p


=150


/p*p


(Ghz/mm)  (7).






Then the relationship between BW and BWD is








BW


=(150


*BWD


)


0.5


(Ghz)  (8).






A plot of this relationship, corresponding to a frequency range of, for example, about 20 GHz to about 50 GHz, is shown relative to the bandwidth vs bandwidth density performance of a “SPEEDBOARD” backplane in FIG.


9


. It can be seen from

FIG. 9

that the bandwidth and bandwidth-density range obtainable with the rectangular TE


1


,


0


mode backplane system is approximately twice that of the “SPEEDBOARD” system.





FIGS. 10-12

also demonstrate the improvement that the present invention can have over conventional systems.

FIG. 10

provides a graph of attenuation versus frequency for a typical prior art waveguide. As the frequency of the wave propagating through the waveguide increases from about 40 Ghz, the attenuation remains relatively constant at −5 dB, more or less, until the frequency reaches about 80-85 Ghz. At that point, the attenuation increases dramatically to about −30 dB. This sudden increase in attenuation occurs because, at about 80-85 Ghz, the mode of the wave changes. As frequency continues to increase beyond the 80-85 Ghz range (i.e., after the mode changes), the attenuation of the wave returns to normal. Thus, in a prior art waveguide system, a dramatic increase in attenuation of the wave can be observed at the point where the mode changes.





FIGS. 11 and 12

provide graphs of attenuation versus frequency for a typical backplane system according to the invention wherein the waveguide has a gap such as described above for preventing propagation of a lower order mode into a higher order mode. The graph of

FIG. 11

represents propagation of the wave in a first direction through the waveguide. The graph of

FIG. 12

represents propagation of the wave in the opposite direction through the waveguide. As shown in both

FIGS. 11 and 12

, the attenuation of the wave is relatively constant, at about 0 dB, in the range of frequencies from about 6 Ghz to about 20 Ghz. Thus. FIGS. 10-12 demonstrate that the waveguides of the present invention provide greater relative bandwidth than conventional systems.




Although described in this section as an “air filled” waveguide, the present invention could use filler material in lieu of air. The filler material could be any suitable dielectric material.




NonRadiative Dielectric (NRD) Waveguide Backplane System





FIG. 13A

shows a conventional TE mode NRD waveguide


20


. Waveguide


20


is derived from a rectangular waveguide (such as waveguide


10


described above), partially filled with a dielectric material, with the sidewalls removed. As shown, waveguide


20


includes an upper conductive plate


24


U, and a lower conductive plate


24


L disposed opposite and generally parallel to upper plate


24


U. Dielectric channel


22


is disposed along a waveguide axis (shown as the z-axis in

FIG. 13A

) between conductive plates


24


U and


24


L. Dielectric channel


22


has a width, a, along the x-axis and a height, b, along the y-axis, as shown. A second channel


26


is disposed along waveguide axis


30


adjacent to dielectric channel


22


. U.S. Pat. No. 5,473,296, incorporated herein by reference, describes the manufacture of NRD waveguides.




Waveguide


20


can support both an even and an odd longitudinal magnetic mode (relative to the symmetry of the magnetic field in the direction of propagation). The even mode has a cutoff frequency, while the odd mode does not. The field patterns in waveguide


20


for the desired odd mode are shown in FIG.


13


B. The fields in dielectric channel


22


(i.e.. the region between −a/2 and a/2 as shown in FIG.


13


B and designated “dielectric”) are similar to those of the TE


1


,


0


mode in rectangular waveguide


10


described above, and vary as Ey˜cos(kx) and Hz˜sin(kx). Outside of dielectric channel


22


. however, in the regions designated “air,” the fields decay exponentially with x. i.e.. exp(−τx). because of the reactive loading of the air spaces on the left and right faces


22


L.


22


R (see

FIG. 13A

) of dielectric channel


22


.




The dispersion characteristic of this mode for a “TEFLON” guide is shown in

FIG. 14

, where Beta and F are the normalized propagation constant and normalized frequency, respectively. That is,






Beta=


a


β/2  (9)






and








F


(


a


ω/2


c


)(


Dr


−1)


0.5


,  (


10


)






where c is the speed of light, and Dr is the relative dielectric constant of dielectric channel


22


, The range of operation is for values off between 1 and 2 where there is only moderate dispersion.




Since the fields outside the dielectric


22


decay exponentially, two or more NRD waveguides


30


can be laminated between substrates


24


U,


24


L, such as ground plane PCBs, to form a periodic multiple bus structure as illustrated in FIG.


15


A. As shown, the bus structure can include a plurality of dielectric channels


22


, each having a width, a, alternating with a plurality of air filled channels


26


. The dielectric channel


22


and adjacent air-filled channel


26


have a combined width p. The first order consequence of the coupling of the fields external to dielectric


22


is some level of crosstalk between the dielectric waveguides


30


. This coupling decreases with increasing pitch, p, and frequency, F, as illustrated in FIG.


16


. Therefore, the acceptable crosstalk levels determine the minimum waveguide pitch P


min


.




According to the present invention, and as shown in

FIG. 15B

, a longitudinal gap can be used to prevent the excitation and subsequent propagation of the higher order even mode, which has a transverse current maximum in the top and bottom ground plane structures at x=0.

FIG. 15B

depicts an NRD waveguide backplane system


120


of the present invention. Waveguide backplane system


120


includes an upper conductive plate


124


U, and a lower conductive plate


124


L disposed opposite and generally parallel to upper plate


124


U. Preferably, plates


124


U and


124


L are made from a suitable conducting material, such as a copper alloy, and are grounded.




A dielectric channel


122


is disposed along a waveguide axis


130


between conductive plates


124


U and


124


L. Gaps


128


in the conductive plates are formed along waveguide axis


130


. Preferably, gaps


128


are disposed near the middle of each dielectric channel


122


. An air-filled channel


126


is disposed along waveguide axis


130


adjacent to dielectric channel


122


. In a preferred embodiment, waveguide


120


can include a plurality of dielectric channels


122


separated by air-filled channels


126


. Dielectric channels


122


could be made from any suitable material.




The bandwidth of the TE


1


,


0


mode NRD waveguide is dependent on the losses in dielectric and the conducting ground planes. For the case where b˜a/2, and the approximation to the eigenvalue








k


˜(ω/


c


)(


Dr


−1)


0.5


˜2


/a,


  (11)






holds. The attenuation has two components: a linear term in frequency proportional to the dielectric loss tangent, and a 3/2 power term in frequency due to losses in the conducting ground planes. For an attenuation of this form






α=(α


1


)(


f


)


1.5


+(α


2


)


f


  (12)






where a


1


and a


2


are constants. The bandwidth-length product, BW*L, based on the upper side-band 3 dB point is








BW*L


˜(0.345/α


2


)/(½)(α


1





2


)(


f




0


)


0.5


+1  (13)






where BW/f


0


<1, and f


0


is the nominal carrier frequency. Preferably, pitch p is a multiple of width a. Then, from (3), f


0


is proportional to 1/p. Also, bandwidth density BWD=BW/p. Plots of the bandwidth and bandwidth density characteristics for a “TEFLON” NRD waveguide, and for a Quartz NRD guide having Dr=4 and a loss tangent of 0.0001 are shown in FIG.


9


. For these plots p=3a. Thus, like the characteristics of rectangular waveguide


100


, NRD waveguide


120


offers increased bandwidth and, more importantly, an open ended bandwidth density characteristic relative to the parabolically closed bandwidth performance of conventional PCB backplanes.




Thus, there have been disclosed broadband microwave modem waveguide backplane systems for laminated printed circuit boards. Those skilled in the art will appreciate that numerous changes and modifications may be made to the preferred embodiments of the invention and that such changes and modifications may be made without departing from the spirit of the invention. For example,

FIG. 9

also includes a reference point for a minimum performance, multi-mode fiber optic system which marks the lower boundary of fiber optic systems potential bandwidth performance. It is anticipated that the microwave modem waveguides of the present invention can provide a bridge in bandwidth performance between conventional PCB backplanes and future fiber optic backplane systems. It is therefore intended that the appended claims cover all such equivalent variations as fall within the true spirit and scope of the invention.



Claims
  • 1. A backplane system, comprising:a substrate; a waveguide connected to the substrate, the waveguide including: a first conductive channel disposed along a waveguide axis; a second conductive channel disposed generally parallel to and spaced from the first channel to thereby define a first gap between the first and second channels along the waveguide axis; a third conductive channel disposed generally parallel to and spaced apart from the first channel to thereby define a second gap between the first and third channels along the waveguide axis; wherein each of the first and second gaps has a gap width that allows propagation along the waveguide axis of electromagnetic waves in a. TE n,0 mode, wherein n is an odd number, but suppresses electromagnetic waves in a TE m,0 mode, wherein mis an even number; at least one transmitter connected to the waveguide for sending an electrical signal along the waveguide; and at least one receiver connected to the waveguide for accepting the electrical signal.
  • 2. The waveguide of claim 1, wherein the third conductive channel is generally C-shaped.
  • 3. The waveguide of claim 1, wherein the third conductive channel is generally I-shaped.
  • 4. The waveguide of claim 1, wherein the third conductive channel comprises a bend sheet of electrically conductive material.
  • 5. A backplane system, comprising:a substrate; a non-radiative dielectric waveguide connected to the substrate, the waveguide having a gap therein for preventing propagation of a lower order mode into a higher order mode; at least one transmitter connected to the waveguide for sending an electrical signal along the waveguide; and at least one receiver connected to the waveguide for accepting the electrical signal.
  • 6. A backplane system, comprising:a substrate; a waveguide connected to the substrate, the waveguide including: a first conductive channel disposed along a waveguide axis; a second conductive channel disposed generally parallel to and spaced from the first channel to thereby define a gap between the first and second channels along the waveguide axis, the gap has a width that allows propagation along the waveguide axis of electromagnetic waves in a TE n,0 mode, wherein n is an odd number, but suppresses electromagnetic waves in a TE m,0 mode, wherein m is an even number; wherein one of the first conductive channel and the second conductive channel has a generally I-shaped cross section along the waveguide axis.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a division of U.S. patent application Ser. No. 09/429,812, filed Oct. 29, 1999 now U.S. Pat. No. 6,590,477, the contents of which are hereby incorporated herein by reference.

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