Claims
- 1. A process of electroless plating a nickel-boron coating onto a metal substrate material comprising admixing a composition consisting essentially of a water soluble nickel salt, a chelating agent, an alkali metal hydroxide in an amount sufficient to produce a pH of about 12 to 14, and a boron containing reducing agent and 1.times.10.sup.-7 mole per liter to 5.times.10.sup.-5 mole per liter of thiocarbanilide as a stabilizer, to produce a solution heating the solution to a temperature of 185.degree. F. to 215.degree. F., immersing the substrate in the solution, and removing the coated substrate from the solution, resulting in a nickel boron coated substrate having improved wear resistance.
- 2. The process of claim 1 including maintaining concentrations of the solution components and the solution temperature constant throughout the plating process.
- 3. The process of claim 1 wherein the alkali metal hydroxide is sodium or potassium hydroxide present.
- 4. The process of claim 1 wherein the water soluble nickel salt is nickel sulfamate present in an amount of about 0.01 mole per liter to 0.15 mole per liter.
- 5. The process of claim 1 wherein the chelating agent is ethylenediamine and the molar concentration ratio of chelating agent to nickel salt is 4/1 to 12/1.
- 6. The process of claim 1 wherein the thiocarbanilide is present in an amount of 5.times.10.sup.-6 mole per liter.
- 7. The process of claim 1 wherein the substrate comprises titanium, steel, nickel, copper, aluminum or magnesium.
- 8. The process of claim 1 wherein the coating is at least 0.1 mil thick.
Government Interests
The Government has rights in this invention pursuant to a contract awarded by the Department of the Air Force.
US Referenced Citations (13)
Foreign Referenced Citations (1)
Number |
Date |
Country |
785694 |
Nov 1957 |
GBX |
Non-Patent Literature Citations (1)
Entry |
G. O. Mallory, "The Electroless Nickel-Boron Plating Bath; Effects of Variables on Deposit Properties", Plating, Apr. 1971, pp. 319-327. |