This disclosure relates to textile-based wearable on-skin interface devices with tactile functionality.
Electronic devices have undergone dramatic transformations over the last several decades. As electronic devices are increasingly being used throughout the day for various tasks, new form factors are being developed. Form factors have been developed that use the human skin as an interface to facilitate human-computer interactions (“HCl”). Conventional on-skin interfaces are created through digital fabrication approaches including laser-cutting, lamination, and inkjet printing, or through craft techniques such as screen-printing and stenciling. The expressive and material qualities of conventional on-skin interfaces are largely limited to color and graphic customization. Conventional on-skin interfaces have not implemented complex circuit typography such as electrical vertical access structures (“VIAS”), integrated novel functional materials, or incorporated aesthetic qualities such as textures and unusual materials.
Conventional on-skin interfaces may be silicone based, such as Polydimethylsiloxane (“PDMS”), because silicone is flexible, soft, stretchable, and may enclose electronics. However, PDMS is not breathable. PDMS covers the skin surface completely such that air and/or moisture cannot pass through, which creates discomforts to users, especially when larger son-skin interfaces are applied. In addition, thin PDMS structures, which may afford a user more comfort, are typically not re-usable and lack in the sturdiness and stability to withstand regular wear and tear for longer periods.
Conventional on-skin interfaces may include tactile interfaces. While tactile interfaces have utilized skin as an area for haptic input, bulky form factors and complicated mechanical systems have hindered wider utilization of body locations. Form factors in such interfaces are contained to wristbands, limiting application to only the forearm. Moreover, complexity in mechanical design allows little compatibility across different tactile feedback, encumbering both user and designers. Conventional methods for high-resolution tactile outputs are often bulky and not body conformable. Conventional methods often require rigid devices (i.e., pumps or compressors), which may not be wearable and can constrain the use of conventional on-skin interfaces to certain body locations. Each tactile output often requires distinct actuation mechanisms, making it challenging to combine different techniques for designing richer haptic sensations. The lack of skin conformity and versatile actuation mechanism in current tactile devices limits their expressiveness.
Additionally, interactive devices in HCl have predominantly been static or fixed in one location. Mobility in conventional devices is enabled by rigid appendages such as grippers, magnetic wheels, and spikes, and accordingly are not suitable for on-skin application. Conventional mobile interface devices lack the use of pliable materials.
The present technology is directed towards textile-based, wearable on-skin interface devices with tactile functionality. The wearable on-skin interface may be used to recognize hand gestures, provide feedback in response to device notification, or provide haptic feedback in response to a variety of sensor inputs. The wearable on-skin interface device has embedded circuitry and components including one or more of a battery, a memory, an energy harvester, a microprocessor, sensors, and actuators. In an example, the wearable on-skin interface device may not include a battery and may be capable of wireless charging by near field communication (“NFC”) capabilities. The components are interconnected by one or more conductors to create a circuit.
The wearable on-skin interface device is a textile structure with components that function to detect environmental inputs and provide outputs as responses. In an example, the microprocessor may be configured to receive inputs from the sensors and use the inputs to determine one or more of a spatial location, configuration, or orientation of the sensors. The one or more of a spatial location, configuration, or orientation of the sensors may be used to track movements of a user, such as in an avatar application or during a sporting event. The one or more of a spatial location, configuration, or orientation of the sensors may be used as a navigation tool, such as a global positioning system (“GPS”) navigation or a navigation tool for a person with impaired vision. In an example, the microprocessor may receive inputs from the sensors and use the inputs to track vital signs or signals in health care related application. In an example, the microprocessor may receive inputs from the sensors and use the inputs to initiate a response function from the actuators.
The textile structure may be a woven textile structure with one or more layers of interlaced materials. Weaving enables circuitry to be incorporated into the textile structure for electrical connections between the layers while maintaining a slim form. Weaving provides two- and three-dimensional structural capabilities for integration of complex circuit typology with a broad selection of materials and diverse textures. The components of the wearable on-skin interface device may be embedded within the layers of the interlaced materials. The interlaced materials include weft and yarns (or materials) with either the weft or the warp material being a conductive material to serve as the conductor within the wearable on-skin interface device. The conductive material of the weft or warp material functions to establish electrical connections between adjoining layers of the interlaced materials to form one or more electrical vertical access structures (“VIAS”).
The textile structure may also be a knitted textile structure with one or more channels within the knitted structure. The components of the wearable on-skin interface device may be embedded within the channels of the knitted structure.
The wearable on-skin interface device may be configured to be affixed to a user or an object by an adhesive layer, or as a sleeve configuration to be affixed by compression. The wearable on-skin interface device may have fasteners, clips, or other suitable mechanisms to be affixable to the user. The wearable on-skin interface device may be a garment or other article of clothing that is wearable by a user.
The wearable on-skin interface device includes a 5-dimensional design space. The 5-dimensional design space is achieved through a combination of weave structure, functional dimensionality, and aesthetic dimensionality. The wearable on-skin interface device may be configured with skin-shifting actuation or self-shifting actuation.
The wearable on-skin interface device is configurable for various types of skin topographies. Tactile feedback can be customized according to an underlying skin topography or body landmark. Tactile interfaces can be designed for placement on planar body parts (e.g., back of hand), cylindrical body parts (e.g., forearm), protruded body joints (e.g., elbow, knees, and knuckles), and concave body locations (e.g., the purlicue, armpit, and Achilles tendon arch).
The wearable on-skin interface device may be configured for motion, or locomotion, relative to a surface to which the wearable on-skin interface device is placed. A locomotion wearable device is a soft and coordinated system configured to transverse or “crawl” cylindrical surfaces or objects. The locomotion wearable device is a sleeve-type, conformable form factor that exhibits anisotropic friction while in motion. The locomotion wearable device exerts a normal force to the cylindrical surface to which the device is affixed such that the device can transverse cylindrical surfaces in a longitudinal direction without slipping.
The wearable on-skin interface device may be configured as a patch wearable device, with functionality including bending, expanding, and shrinking. A patch wearable device is a deformable interface devised as a woven patch that enables diverse movement-based interactions adaptive to garments or on-skin wearing. The patch wearable device is a detachable and relocatable actuation unit that can be sewn or attached to clothing or skin at various locations. The patch wearable device integrates actuators at a structural level and varies the texture and stiffness of the woven substrate. The woven substrate is embedded with SMA actuators that is woven with unique structural and yarn material combinations to yields a versatile woven substrate tunable for different actuation mechanisms. Taking advantage of the structural and textural flexibility of weaving, the patch wearable device enables slim integration while preserving expressive weave aesthetics.
These and other aspects, objects, features, and advantages of the disclosed technology will become apparent to those having ordinary skill in the art upon consideration of the following detailed description of illustrated examples.
Turning now to the drawings, in which like numerals indicate like (but not necessarily identical) elements throughout the figures, examples of the technology are described in detail.
In example embodiments, network 130 includes one or more wired or wireless telecommunications systems by which network devices may exchange data. For example, the network 130 may include one or more of a local area network (LAN), a wide area network (WAN), an intranet, an Internet, a storage area network (SAN), a personal area network (PAN), a metropolitan area network (MAN), a wireless local area network (WLAN), a virtual private network (VPN), a cellular or other mobile communication network, a BLUETOOTH® wireless technology connection, a near field communication (NFC) connection, any combination thereof, and any other appropriate architecture or system that facilitates the communication of signals, data, and/or messages.
Remote computing device 110 may be any type of computing machine, such as, but not limited to, those discussed in more detail with respect to
Wearable device 120 comprises a battery 121, a memory 122, an energy harvester 123, a microprocessor 124, sensors 125, and actuators 126. Battery 121, memory 122, energy harvester 123, microprocessor 124, sensors 125, and actuators 126 are interconnected by one or more conductors 310 (as described herein in reference to
The conductive material of the weft material or the warp material functions to establish electrical connections between adjoining layers of the interlaced materials. The electrical connections between the adjoining layers of the interlaced materials form one or more electrical vertical access structures (“VIAS”) within the textile structure.
In an example, the textile structure may be a knitted textile structure with one or more channels within the knitted structure. Battery 121, memory 122, energy harvester 123, microprocessor 124, sensors 125, and actuators 126 of wearable device 120 may be embedded within the channels of the knitted structure.
In an example, wearable device 120 may be configured to be affixed to a user. Wearable device 120 may comprise an adhesive layer such that wearable device 120 may be affixed to a location on a user. In an example, the adhesive layer may be a polyvinyl alcohol adhesive, an eyelash glue, a medical prosthetic adhesive, a nail adhesive, or any other suitable adhesive to affix wearable device 120 to a user. Wearable device 120 may be configured as a sleeve that may slide onto the user such that the wearable device is affixed to the user by compression. Wearable device 120 may comprise fasteners, clips, or any other suitable mechanism to affix wearable device 120 to the user. Wearable device 120 may be a garment or other article that is wearable by a user. For example, wearable device 120 may be a shirt, pants, glove, sock, hair piece, or any other suitable garment or article wearable by a user. Wearable device 120 may be affixed to the skin of the user, the hair of the user, a garment of the user, or any suitable location such that wearable device 120 may detect one or more inputs from the environment in which wearable device 120 is located and provide a response to the one or more inputs.
In an example, wearable device 120 may be configured to be affixed to a location on an object, an agricultural product, or any other suitable application such that wearable device 120 may detect one or more inputs from the environment in which wearable device 120 is located and provide a response to the one or more inputs. Embodiments of wearable device 120 will be discussed in greater detail herein with respect to
Wearable device 120 comprises battery 121. Battery 121 functions to provide power to the components of wearable device 120. While
Wearable device 120 comprises memory 122. Memory 122 functions to store data associated with inputs from sensors 125. In an example, microprocessor 124 receives inputs from sensors 125 and stores data associated with the inputs in memory 122. In an example, memory 122 has a small form factor such that memory 122 may be embedded within the one or more interlaced layers or channels of wearable device 120. In an example, memory 122 may be stacked on top of battery 121 within the one or more interlaced layers of wearable device 120. In an example, memory 122 may be a removable memory such as a Secure Digital (“SD”) card. Memory 122 may be any suitable memory capable of storing data associated with the inputs from sensors 125.
Wearable device 120 comprises energy harvester 123. Energy harvester 123 functions as power management for wearable device 120. In an example, battery 121 connects to energy harvester 123. Energy harvester 123 may function as a voltage regulator for battery 121. In an example, energy harvester 123 may provide a low power direct current to direct current (“DC-DC”) boost charge, store energy, charge and protect battery 121, be programmable to regulate power output, and be programmable to extract energy from external energy sources. In an example, energy harvester 123 has near-field communication (“NFC”) capabilities. In an example, energy harvester 123 has a small form factor such that energy harvester 123 may be embedded within the one or more interlaced layers or channels of wearable device 120.
Wearable device 120 comprises microprocessor 124. Microprocessor 124 may be configured to monitor and control the operation of the components in the wearable device 120. Microprocessor 124 may be a general purpose processor, a processor core, a multiprocessor, a reconfigurable processor, a microcontroller, a printed circuit board (“PCB”), a digital signal processor (“DSP”), an application specific integrated circuit (“ASIC”), a graphics processing unit (“GPU”), a field programmable gate array (“FPGA”), a programmable logic device (“PLD”), a controller, a state machine, gated logic, discrete hardware components, any other processing unit, or any combination or multiplicity thereof. Microprocessor 124 may be a single processing unit, multiple processing units, a single processing core, multiple processing cores, special purpose processing cores, co-processors, or any combination thereof. Microprocessor 124 may be powered by battery 121.
In an example, microprocessor 124 has a small form factor such that microprocessor 124 may be embedded within the one or more interlaced layers or channels of wearable device 120. In an example, microprocessor 124 may comprise one or more Inter-Integrated Circuit (“I2C”) interfaces to interface with sensors 125. In an example, microprocessor 124 may comprise one or more serial peripheral interfaces (“SPI”) for communications with NFC interface 221 (discussed herein with reference to
Microprocessor 124 may be configured to receive inputs from sensors 125 for processing. In an example, microprocessor 124 may receive inputs from sensors 125 and use the inputs to determine one or more of a spatial location, configuration, or orientation of the sensors 125 of wearable device 120. The one or more of a spatial location, configuration, or orientation of the sensors 125 may be used to track movements of a user, such as in an avatar application or during a sporting event. The one or more of a spatial location, configuration, or orientation of the sensors 125 may be used as a navigation tool, such as a global positioning system (“GPS”) navigation or a navigation tool for the blind. In an example, microprocessor 124 may receive inputs from sensors 125 and use the inputs to track vital signs or signals in health care related application. In an example, microprocessor 124 may receive inputs from sensors 125 and use the inputs to initiate a response function from actuators 126. For example, microprocessor 124 may transmit a signal to one or more actuators 126 to initiate the response function. In an alternate example, microprocessor 124 may be configured to receive inputs from sensors 125 and transmit data associated with the inputs to an external computing system, such as remote computing device 110, for further processing.
Wearable device 120 comprises sensors 125-1 through 125-n. Wearable device 120 may comprise a single sensor 125 or a plurality of sensors 125. Sensors 125 are components of wearable device 120 that detect one or more inputs from the environment in which wearable device 120 is located. In an example, each sensor 125 has a small form factor such that sensors 125 may be embedded within the one or more interlaced layers or channels of wearable device 120. Sensors 125 may be one or more of a capacitive touch sensor, a strain sensor, a pressure sensor, a biosensor, an inertial movement unit (“IMU”), a microphone, a water sensor, a velocity sensor, a resistive sensor, a physiological sensor, or any other suitable sensor to detect an input from the environment in which wearable device 120 is located. In an example, a biosensor may be configured to monitor or measure one or more of a temperature, blood pressure, pulse, or any other suitable biometric. In an example, an IMU may comprise a machine learning core to pre-process data and be configured to measure one or more of an acceleration, orientation, and angular movement rate.
Wearable device 120 comprises actuators 126-1 through 126-n. Actuators 126 may also be referred to as functional devices. Actuators 126 are components of wearable device 120 configured to provide a response function based on one or more signals from microprocessor 124 or inputs from one or more sensors 125. Wearable device 120 may comprise a single actuator 126 or a plurality of actuators 126. In an example, each actuator 126 has a small form factor such that actuators 126 may be embedded within the one or more interlaced layers or channels of wearable device 120. As used herein, an actuator comprises a device configured to change from a first state to a second state responsive to a first input. In some aspects, the actuator is further configured to change from the second state back to the first state responsive to a second input, which could be the same input as the first input or a different input than the first input. In some aspects, the actuator is configured to change from a first state to a particular one of a plurality of available states responsive to an input corresponding to that particular one of a plurality of available states. In some examples, the actuator is configured to cycle between a first state and a second state responsive to one or more inputs. In some examples, the actuator is biased toward a first state so that, following actuation of the actuator to change state from the first state to the second state, the actuator will automatically return to the first state under action of the bias. In some examples, actuators 126, in accord with at least some aspects of the present concepts, may include one or more of a haptic feedback component, a stiffness component, a thermochromic display, an illumination device, an audio device, a shape-memory alloy (“SMA”) device, an optical fiber, or any other suitable functional device. In an example, an actuator 126 may be comprised of either the weft or warp material. For example, the weft material may be an optical fiber with a response function of illumination. The response function of actuators 126 may comprise one or more of a force, a vibration, a motion, a variable-stiffness response, a color change, a light emittance, a thermal sensation, a skin-shifting actuation, a self-shifting actuation, a bending movement, an expanding movement, a shrinking movement, a deformation movement, a pinching movement, a brushing movement, a twisting movement, a lengthening movement, or any other suitable response function. In an example, the thermal sensation may be a warming sensation or a cooling sensation. For example, the haptic feedback component may be a SMA actuator configured to apply a force, a vibration, or a motion. The stiffness component may comprise a SMA actuator to enable variable-stiffness. The thermochromic display may comprise thermochromic yards configured for color change. The SMA device may comprise SMA micro-springs configured to function as skin-shifting actuators when attached to a skin location of a user or as a self-shifting actuator when in close contact to a skin location of a user. The SMA micro-springs may be configured to apply one or more of a compression, a pinch, a brush, or a twist.
While
Wirelessly charged wearable device system 200 comprises external power source 210. External power source 210 comprises an NFC transceiver such that external power source 210 may transmit power via RFID transmissions or other suitable transmission means to an NFC enabled device, such as wearable device 220.
Wearable device 220 comprises an NFC interface 221, a memory 122, an energy harvester 123, a microprocessor or microcontroller 124, sensors 125, and actuators 126. Memory 122, energy harvester 123, microprocessor 124, sensors 125, and actuators 126 were previously described herein with reference to
In an example use case of wearable device 120 as depicted in
A lace serpentine weave is illustrated at 510 with an enlargement at 511. A lace serpentine weave interlaces sections of warp and weft materials at non-orthogonal angles to expose regions of negative space and achieve a slim form, making a lace serpentine weave particularly suited for joints. A Manhattan routing weave is illustrated at 520 with an enlargement at 521. A Manhattan routing weave is a grid-like weave structure that routes weaving materials in horizontal and vertical directions. A Manhattan routing weave is advantageous in a wearable device 120 or 220 for effectively routing a complex network of distributed wearable device 120 and 220 components in a thin textile structure with groups of wires serving for a fully integrated electrical design. A tapestry coil weave is illustrated at 530. A tapestry coil weave is an advanced weaving technique that enables a variety of 2-dimensional and 3-dimensional circuit topographies, allowing for customization of a variety of wearable device 120 or 220 configurations and embodiments. A double weave coil is illustrated at 540 with an enlargement at 541. A double weave coil is an advanced weaving technique that enables a variety of 2-dimensional and 3-dimensional circuit topographies. A double weave coil can integrate circuits across multiple layers with VIAS.
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Another design option is for the wearable device 120 or 220 to be close to, but not attached to the skin. When the wearable device 120 or 220 is close to, but not attached to the skin, the SMA micro-springs may be referred to as self-shifting actuators. The actuation of the SMA micro-springs can deform the interface, resulting in circumferential or lateral contraction of the interface. Circumferential contraction results in a compression sensation depicted at 1313, and lateral contraction results in a brushing sensation through the “scrunching” of the wearable device 120 or 220 depicted at 1314.
In
As depicted in
Locomotion wearable device 1710 comprises actuators 1712. One or more actuators 1712 are embedded within each channel 1713. In an example, actuators 1712 are fluidic actuators, such as a fluidic yarn actuator, that linearly extend to enable propulsion of locomotion wearable device 1710. In an example, actuators 1712 are pneumatic actuators that linearly extend to enable propulsion of locomotion wearable device 1710. In an example, actuators 1712 are connected to a pressure source, not depicted in
Locomotion wearable device 1710 comprises channels 1713. Channels 1713 can be knitted with either the material for scales 1711 or ground layer 1716. To enclose a variety of sizes of actuators 1711, channels 1713 comprise a tubular jacquard structure. The tubular jacquard structure creates pouches in various shapes and dimensions. By altering tubular jacquard, channels 1713 can accommodate differing numbers of actuators 1712 in different shapes. Channels 1713 may be constructed in conjunction with scale 1711 and ground layer 1716. In addition to actuators 1712, a variety of materials or devices may also be embedded into channels 1713 through a knitted hole, without additional efforts for integration.
Locomotion wearable device 1710 is depicted with a head direction 1714 and a tail direction 1715. Head direction 1714 and tail direction 1715 will be discussed in greater details herein with reference to
Locomotion wearable device 1710 comprises a ground layer 1716. Ground layer 1716 may also be referred to as a base layer. Ground layer 1716 is comprised of a material with elastic properties. In an example, ground layer 1716 is knitted with regular knit loops. As ground layer 1716 and scales 1711 are knitted, stress builds within ground layer 1716. When released from a knitting apparatus, the stress built up in the ground layer 1716 enables the entire structure of locomotion wearable device 1710, including scales 1711, to draw inward or shrink. Ground layer 1716 pulls scales 1711 laterally. The shrinkage is larger along the rows than columns, affecting a great amount of lateral flexing of scales 1711. An adequate amount of elasticity in ground layer 1716 and stiffness in scales 1711 is needed for balance. The balance between the elasticity in ground layer 1716 and the stiffness in scales 1711 determines the angled orientation of the scales. For example, if the scale material exhibits little stiffness, scales 1711 will have a negligible curve. When scales 1711 are straight or have negligible curve, scales 1711 will not stack onto each other and accordingly lose the stepped texture.
The pattern of scales 1711 influences the behavior of locomotion wearable device 1710. In the knitting process, scales 1711 are knitted row by row. Knitting row by row controls how scales 1711 are stacked and which part of a scale 1711 is weighed down. When scales 1711 are stacked, the tendency to roll back diminishes as the adjacent scales 1711 are exerting pressure. For example, in the zigzag pattern depicted in
Density is defined as the distance between two rows with scales 1711. For example, a density of 1 row indicates the scales are knitted every other row.
While the geometrical parameters affect the global behavior of locomotion wearable device 1710, the yarn material determines the characteristics of scales 1711. In an example, scales 1711 may be knitted with a nylon monofilament, 38 AWG copper wire, or silver-plated multi-filament material. Any material of suitable stiffness may be used for scales 1711. The surface and cross-section of a material influences the overall roughness of scales 1711, which in turn impacts the friction. Single filament materials such as nylon monofilaments and metal wires exhibit smoother surfaces with a solid cross-section, often in the shape of a circle. Alternately, multi-material yarns such as silver-plated multi-filament comprise a core yarn and a wrapper, resulting in a non-uniform cross-section. The bristly surface of multi-material yarns, which are akin to the metal plated yarns, can also be attributed to the incoherent yarn composition. The curvature of scales 1711 is closely tied to the capability of the material to store tension during and after the knitting process. The scale curvature is determined by two primary facets: material stiffness and elasticity.
The patch wearable device comprises two main components: (1) SMA actuators, and (2) woven fabric substrates. SMA actuators may be SMA wire for shape memory, SMA wire for contraction, or an SMA spring. The SMA wire can be used for contraction, providing a stable and accurate length shrinkage via heating. The SMA wire for shape memory is malleable when cold but can return to a trained shape when heated. In an example, the SMA spring has a dense helix structure. The SMA spring can be stretched to more than 200% of the original length and contracts significantly when actuated. The warp and weft yarns for the patch wearable device were chosen to enhance the movement of the fabric patch upon actuation. Certain areas of the patch wearable device may bend easily while other areas may be stiff to ensure a hinge-like movement upon actuation. A machine-spun unbleached linen yarn is stiff, rough and has low elasticity. A silk yarn has a smooth surface with near-constant diameter, high tensile strength, stretches from 15 to 20 percent, and is mechanically compressible. By combining of linen and silk yarns in the warp and weft directions, localized physical properties of the patch wearable device can be manipulated. In an example, synthetic fibers can be used to reduce the production cost of the patch wearable device.
In addition to material variations, weave structures for the base fabric substrate of the patch wearable device and fabrication techniques for SMA integration may accentuate stiffness and pliability of specific areas of the patch wearable device. Weave patterns may be alternated between plain weave and twill weave. Tapestry may be used to create regions with different weave patterns. To create a plain weave, the weft yarn is alternated over and under each warp yarn to create a checkerboard-like pattern. In a twill weave, the weft yarn passes over one warp yarn followed by under two warp yarns to create diagonal ribs. In the plain weave, simple overlapping of yarns ensures that the weave angle remains stable at 90 degrees despite repeated bending, thereby, preventing distortions in the weave pattern. A plain weave may be incorporated at locations that would undergo repeated folding. In a twill weave, the distance between two adjacent yarns is smaller, which in turn prevents the fabric from compressing into small folds. A twill weave may be incorporated at locations required to be stiff.
In patch wearable devices integrating SMA springs, a double weave pattern may be used to incorporate the SMA springs between layers. To create the double weave, two layers of plain weave are interconnected on both sides. Five interlacing arrangements may be used to integrate an SMA actuator within the patch wearable device's weaving process. First, the SMA actuator can be integrated as a floating warp/weft to perform an unrestricted deformation and replicate a hinge-like behavior. Second, the SMA actuator can be interlaced within the weave as a supplementary warp or supplementary weft to ensure that the SMA actuator is clamped in place. Third, in the case of multi-layer fabrics, the VIAS was adopted from circuit boards to weaving planes. The SMA wire-form actuators serve as VIAS for linking a multi-layer cloth for a specific deformation design. While integrating the SMA actuator, the SMA actuator can be incorporated at angles other than right angles aligned with warp and weft through hand-manipulation as adopted in lace weaving. Woven fabric is unique in woven fabric is tunable stiffness, which is endowed by both the fiber material and the adopted weave pattern.
For bendable patch wearable device 2310, bendable patch wearable device 2310 may bend in a 1-dimensional linear bend depicted in the examples at row 2310a. Bendable patch wearable device 2310 may bend in a 1-dimensional parallel same side bend depicted in the examples at row 2310b. Bendable patch wearable device 2310 may bend in a 1-dimensional parallel different side bend depicted in the examples at row 2310c. Bendable patch wearable device 2310 may bend in a 2-dimensional angular bend depicted in the examples at row 2310d. Bendable patch wearable device 2310 may bend in a 2-dimensional curve bend depicted in the examples at row 2310e. Bendable patch wearable device 2310 may bend in a 2-dimensional dome bend depicted in the examples at row 2310f. Bendable patch wearable device 2310 may bend in a 2-dimensional saddle bend depicted in the examples at row 2310g.
In an example, the bending mechanism for bendable patch wearable device 2310 is translated to woven interfaces, with the basic actuation unit of bending comprising two types of woven regions. An SMA wire may be used for contraction in this form factor. In an example, the SMA wire is rated with a standard drive voltage of 20.7 V/m and a standard drive current of 340 mA, which would produce 150 gram force (“gf”) and 4% kinetic strain. Any suitable drive voltage and drive current may be used. In an example, a stiffer fabric is woven on the two sides to constrain deformation. In the continuing example, the SMA wire is anchored as a supplementary weft between tensioned warps. The central region is softer but resistant to wrinkles and shrinking. The corresponding section of SMA wire in the center floats either above or below the softer region. Since the stiffer regions on the sides restrain the SMA wire, shrinkage would concentrate at the flexible region in the middle, which pulls the softer part of the fabric on both ends like drawing a bow. The bendable patch wearable device 2310 would then be bent in a direction curving toward the SMA wire.
The shape memory effect of the SMA wire can be used to expand expandable patch wearable device 2410 from a flat 2-dimensional shape to a 3-dimensional structure. In an example, a double cloth weaving technique may be used to create the expandable structure of expandable patch wearable device 2410. The double cloth weaving technique separates the weaving plane into upper and lower layers, where the two planes can be woven fully in parallel or interact with each other through selvages or interlacing weft yarns. The basic actuation unit of expanding is defined as a bent joint of SMA actuators connecting the two layers of a double cloth patch through a VIAS interlacing arrangement. Since the default trained shape of the SMA wire is a straight line, the SMA wire would recover from a bent status when actuated, which expands and opens the folded double cloth structure, as depicted at row 2410a.
In an example, a Nickel Titanium (“NiTi”) wire may be used as the SMA wire for shape memory. A variety of warp/weft materials may be used to weave the double cloth expandable patch wearable device 2410. In an example, if the top and bottom layers of expandable patch wearable device 2410 need to be connected, a silk warp material in the connecting margin will allow expandable patch wearable device 2410 to be more flexible. A representative design of the expanding patch is a tubular shape, where the top and bottom layers are connected on both sides. As shown at row 2410b, the SMA joints are distributed evenly along the two edges of the tube.
In contrast to the bending and expanding mechanisms that deform the patch wearable device along a line, the shrinking mechanism creates a much more prominent shrinkage across the entire form factor of shrinkable patch wearable device 2510 by leveraging SMA springs. The basic actuation unit of shrinking involves looped copper wires for electrical connection and an SMA spring integrated into the weft in a plain weave.
In an example, SMA springs can generate a strong contraction force. Softer and more stretchable materials for both weft and warp materials are used in shrinkable patch wearable device. In an example, the SMA spring is first stretched before integration into the weave of shrinkable patch wearable device 2510. The SMA spring may be stretched to 7 coils/inch, or any other suitable length. The SMA spring can stand 3.4A current to achieve a 2-second actuation. The weaving starts with a loose plain weave structure suitable for integrating the SMA spring. Each round of the SMA springs clutch the weft and warp materials, and the structure may be tightened after integration of the SMA springs by increasing the beating intensity of consecutive wefts. In an example, the fabrication process comprises three steps: (1) perform a loose plain weave until arriving at the position for SMA spring integration; (2) create loops with a copper warp; and (3) install the SMA springs and tighten the plain weave.
The computing machine 2600 may be implemented as a conventional computer system, an embedded controller, a laptop, a server, a mobile device, a smartphone, a set-top box, a kiosk, a router or other network node, a vehicular information system, one or more processors associated with a television, a customized machine, any other hardware platform, or any combination or multiplicity thereof. The computing machine 2600 may be a distributed system configured to function using multiple computing machines interconnected via a data network or bus system.
The processor 2610 may be configured to execute code or instructions to perform the operations and functionality described herein, manage request flow and address mappings, and to perform calculations and generate commands. The processor 2610 may be configured to monitor and control the operation of the components in the computing machine 2600. The processor 2610 may be a general purpose processor, a processor core, a multiprocessor, a reconfigurable processor, a microcontroller, a digital signal processor (“DSP”), an application specific integrated circuit (“ASIC”), a graphics processing unit (“GPU”), a field programmable gate array (“FPGA”), a programmable logic device (“PLD”), a controller, a state machine, gated logic, discrete hardware components, any other processing unit, or any combination or multiplicity thereof. The processor 2610 may be a single processing unit, multiple processing units, a single processing core, multiple processing cores, special purpose processing cores, co-processors, or any combination thereof. The processor 2610 along with other components of the computing machine 2600 may be a virtualized computing machine executing within one or more other computing machines.
The system memory 2630 may include non-volatile memories such as read-only memory (“ROM”), programmable read-only memory (“PROM”), erasable programmable read-only memory (“EPROM”), flash memory, or any other device capable of storing program instructions or data with or without applied power. The system memory 2630 may also include volatile memories such as random access memory (“RAM”), static random access memory (“SRAM”), dynamic random access memory (“DRAM”), and synchronous dynamic random access memory (“SDRAM”). Other types of RAM also may be used to implement the system memory 2630. The system memory 2630 may be implemented using a single memory module or multiple memory modules. While the system memory 2630 is depicted as being part of the computing machine 2600, one skilled in the art will recognize that the system memory 2630 may be separate from the computing machine 2600 without departing from the scope of the subject technology. It should also be appreciated that the system memory 2630 may include, or operate in conjunction with, a non-volatile storage device such as the storage media 2640.
The storage media 2640 may include a hard disk, a floppy disk, a compact disc read only memory (“CD-ROM”), a digital versatile disc (“DVD”), a Blu-ray disc, a magnetic tape, a flash memory, other non-volatile memory device, a solid state drive (“SSD”), any magnetic storage device, any optical storage device, any electrical storage device, any semiconductor storage device, any physical-based storage device, any other data storage device, or any combination or multiplicity thereof. The storage media 2640 may store one or more operating systems, application programs and program modules such as module 2650, data, or any other information. The storage media 2640 may be part of, or connected to, the computing machine 2600. The storage media 2640 may also be part of one or more other computing machines that are in communication with the computing machine 2600 such as servers, database servers, cloud storage, network attached storage, and so forth.
The module 2650 may comprise one or more hardware or software elements configured to facilitate the computing machine 2600 with performing the various methods and processing functions presented herein. The module 2650 may include one or more sequences of instructions stored as software or firmware in association with the system memory 2630, the storage media 2640, or both. The storage media 2640 may therefore represent machine or computer readable media on which instructions or code may be stored for execution by the processor 2610. Machine or computer readable media may generally refer to any medium or media used to provide instructions to the processor 2610. Such machine or computer readable media associated with the module 2650 may comprise a computer software product. It should be appreciated that a computer software product comprising the module 2650 may also be associated with one or more processes or methods for delivering the module 2650 to the computing machine 2600 via the network 2680, any signal-bearing medium, or any other communication or delivery technology. The module 2650 may also comprise hardware circuits or information for configuring hardware circuits such as microcode or configuration information for an FPGA or other PLD.
The input/output (“I/O”) interface 2660 may be configured to couple to one or more external devices, to receive data from the one or more external devices, and to send data to the one or more external devices. Such external devices along with the various internal devices may also be known as peripheral devices. The I/O interface 2660 may include both electrical and physical connections for operably coupling the various peripheral devices to the computing machine 2600 or the processor 2610. The I/O interface 2660 may be configured to communicate data, addresses, and control signals between the peripheral devices, the computing machine 2600, or the processor 2610. The I/O interface 2660 may be configured to implement any standard interface, such as small computer system interface (“SCSI”), serial-attached SCSI (“SAS”), fiber channel, peripheral component interconnect (“PCI”), PCI express (PCIe), serial bus, parallel bus, advanced technology attached (“ATA”), serial ATA (“SATA”), universal serial bus (“USB”), Thunderbolt, FireWire, various video buses, and the like. The I/O interface 2660 may be configured to implement only one interface or bus technology. Alternatively, the I/O interface 2660 may be configured to implement multiple interfaces or bus technologies. The I/O interface 2660 may be configured as part of, all of, or to operate in conjunction with, the system bus 2620. The I/O interface 2660 may include one or more buffers for buffering transmissions between one or more external devices, internal devices, the computing machine 2600, or the processor 2610.
The I/O interface 2660 may couple the computing machine 2600 to various input devices including mice, touch-screens, scanners, electronic digitizers, sensors, receivers, touchpads, trackballs, cameras, microphones, keyboards, any other pointing devices, or any combinations thereof. The I/O interface 2660 may couple the computing machine 2600 to various output devices including video displays, speakers, printers, projectors, tactile feedback devices, automation control, robotic components, actuators, motors, fans, solenoids, valves, pumps, transmitters, signal emitters, lights, and so forth.
The computing machine 2600 may operate in a networked environment using logical connections through the network interface 2670 to one or more other systems or computing machines across the network 2680. The network 2680 may include WANs, LANS, intranets, the Internet, wireless access networks, wired networks, mobile networks, telephone networks, optical networks, or combinations thereof. The network 2680 may be packet switched, circuit switched, of any topology, and may use any communication protocol. Communication links within the network 2680 may involve various digital or an analog communication media such as fiber optic cables, free-space optics, waveguides, electrical conductors, wireless links, antennas, radio-frequency communications, and so forth.
The processor 2610 may be connected to the other elements of the computing machine 2600 or the various peripherals discussed herein through the system bus 2620. It should be appreciated that the system bus 2620 may be within the processor 2610, outside the processor 2610, or both. Any of the processor 2610, the other elements of the computing machine 2600, or the various peripherals discussed herein may be integrated into a single device such as a system on chip (“SOC”), system on package (“SOP”), or ASIC device.
Examples may comprise a computer program that embodies the functions described and illustrated herein, wherein the computer program is implemented in a computer system that comprises instructions stored in a machine-readable medium and a processor that executes the instructions. However, it should be apparent that there could be many different ways of implementing examples in computer programming, and the examples should not be construed as limited to any one set of computer program instructions. Further, a skilled programmer would be able to write such a computer program to implement an example of the disclosed examples based on the appended flow charts and associated description in the application text. Therefore, disclosure of a particular set of program code instructions is not considered necessary for an adequate understanding of how to make and use examples. Further, those skilled in the art will appreciate that one or more aspects of examples described herein may be performed by hardware, software, or a combination thereof, as may be embodied in one or more computing systems. Moreover, any reference to an act being performed by a computer should not be construed as being performed by a single computer as more than one computer may perform the act.
The examples described herein can be used with computer hardware and software that perform the methods and processing functions described herein. The systems, methods, and procedures described herein can be embodied in a programmable computer, computer-executable software, or digital circuitry. The software can be stored on computer-readable media. Computer-readable media can include a floppy disk, RAM, ROM, hard disk, removable media, flash memory, memory stick, optical media, magneto-optical media, CD-ROM, etc. Digital circuitry can include integrated circuits, gate arrays, building block logic, field programmable gate arrays (“FPGA”), etc.
The systems, methods, and acts described in the examples presented previously are illustrative, and, alternatively, certain acts can be performed in a different order, in parallel with one another, omitted entirely, and/or combined between different examples, and/or certain additional acts can be performed, without departing from the scope and spirit of various examples. Accordingly, such alternative examples are included in the scope of the following claims, which are to be accorded the broadest interpretation so as to encompass such alternate examples.
Although specific examples have been described above in detail, the description is merely for purposes of illustration. It should be appreciated, therefore, that many aspects described above are not intended as essential elements unless explicitly stated otherwise. Modifications of, and equivalent components or acts corresponding to, the disclosed aspects of the examples, in addition to those described above, can be made by a person of ordinary skill in the art, having the benefit of the present disclosure, without departing from the spirit and scope of examples defined in the following claims, the scope of which is to be accorded the broadest interpretation so as to encompass such modifications and equivalent structures.
Various embodiments are described herein. It should be noted that the specific embodiments are not intended as an exhaustive description or as a limitation to the broader aspects discussed herein. One aspect described in conjunction with a particular embodiment is not necessarily limited to that embodiment and can be practiced with any other embodiment(s). Reference throughout this specification to “one embodiment,” “an embodiment,” “an example embodiment,” or other similar language means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention described herein. Thus, appearances of the phrases “in one embodiment,” “in an embodiment,” “an example embodiment,” or other similar language in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments, as would be apparent to a person having ordinary skill in the art and the benefit of this disclosure. Furthermore, while some embodiments described herein include some, but not other, features included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention. For example, in the appended claims, any of the claimed embodiments can be used in any combination.
Example 1 is a wearable system, comprising a textile structure configured to be affixed to a location on a user, the textile structure comprising: a functional device embedded within the textile structure and enabled to provide a response function, a sensor embedded within the textile structure, and a conductor embedded within the textile structure connecting the functional device and the sensor; and a circuit configured to receive an input from the sensor and to output a signal to the functional device to initiate the response function.
Example 2 includes the subject matter of Example 1, the textile structure further comprising an adhesive layer configured to affix the textile structure to the location on the user.
Example 3 includes the subject matter of Examples 1 or 2, wherein the adhesive layer comprises a polyvinyl alcohol adhesive.
Example 4 includes the subject matter of Example 1, the textile structure further comprising a processor coupled to the circuit, the processor configured to: receive the input from the sensor; and output the signal to the functional device to initiate the response function.
Example 5 includes the subject matter of any of Examples 1-4, the textile structure further comprising a memory coupled to the circuit.
Example 6 includes the subject matter of any of Examples 1-5, the processor further configured to: process data; provide power to the wearable system; and wirelessly connect to external devices.
Example 7 includes the subject matter of any of Examples 1-6, the processor further configured to: receive the input from the sensor; based on the input from the sensor, determine a relative location of the textile structure affixed on the user; and transmit, to an external computing system, the relative location.
Example 8 includes the subject matter of any of Examples 1-7, the processor configured to communicate with the external computing system via a radio frequency identification (“RFID”) signal.
Example 9 includes the subject matter of any of Examples 1-8, the processor configured to determine the relative location of the textile structure by determining one or more of a spatial location, configuration, position, or orientation of the textile structure affixed on the user.
Example 10 includes the subject matter of Example 1, the textile structure further comprising a power source providing power to the wearable system.
Example 11 includes the subject matter of any of Examples 1-10, the power source comprising an energy harvester and a near-field communication (“NFC”) coil to wirelessly power the wearable system.
Example 12 includes the subject matter of any of Examples 1-11, the power source comprising a battery and an energy harvester to power the wearable system.
Example 13 includes the subject matter of Example 1, wherein the functional device comprises a haptic feedback component.
Example 14 includes the subject matter of any of Examples 1-13, wherein the haptic feedback component comprises a shape-memory alloy actuator configured to apply a force, a vibration, a thermal sensation, or a motion as the response function.
Example 15 includes the subject matter of Example 1, wherein the functional device comprises a stiffness component.
Example 16 includes the subject matter of any of Examples 1-15, the stiffness component comprising a shape memory alloy configured to enable variable-stiffness as the response function.
Example 17 includes the subject matter of Example 1, wherein the functional device comprises a thermochromic display.
Example 18 includes the subject matter of any of Examples 1-17, the thermochromic display comprising a woven arrangement of thermochromic yarns configured to change color as the response function.
Example 19 includes the subject matter of Example 1, wherein the functional device comprises an audio device.
Example 20 includes the subject matter of Example 1, wherein the sensor comprises a capacitive touch sensor.
Example 21 includes the subject matter of Example 1, wherein the sensor comprises a strain sensor.
Example 22 includes the subject matter of Example 1, wherein the sensor comprises a pressure sensor.
Example 23 includes the subject matter of any of Examples 1-22, the pressure sensor comprising two electrodes separated by a piezoresistor for piezoresistive sensing.
Example 24 includes the subject matter of Example 1, wherein the sensor comprises a biosensor.
Example 25 includes the subject matter of any of Examples 1-24, the biosensor configured to detect one or more of a temperature, blood pressure, or pulse of the user.
Example 26 includes the subject matter of Example 1, wherein the sensor comprises an inertial movement unit.
Example 27 includes the subject matter of any of Examples 1-26, the inertial movement unit comprising a machine learning core to pre-process data and configured to measure one or more of an acceleration, orientation, and angular movement rate.
Example 28 includes the subject matter of Example 1, wherein the textile structure comprises a woven textile comprising one or more layers of interlaced materials with electrical connections between adjoining layers of the interlaced materials forming one or more electrical vertical interconnect access structures (“VIAS”) within the textile structure.
Example 29 includes the subject matter of any of Examples 1-28, the functional device being embedded within a particular layer of the one or more layers of interlaced materials.
Example 30 includes the subject matter of any of Examples 1-29, the sensor being embedded within a particular layer of the one or more layers of interlaced materials.
Example 31 includes the subject matter of any of Examples 1-30, the interlaced materials comprising a plain weave structure.
Example 32 includes the subject matter of any of Examples 1-31, the interlaced materials comprising a tapestry weave structure.
Example 33 includes the subject matter of any of Examples 1-32, the interlaced materials comprising a double weave structure.
Example 34 includes the subject matter of any of Examples 1-33, the interlaced materials comprising a lace weave structure.
Example 35 includes the subject matter of any of Examples 1-34, the interlaced materials comprising a weft material and a warp material, the weft material comprising a conductive material and the warp material comprising a non-conductive material.
Example 36 includes the subject matter of any of Examples 1-35, the interlaced materials comprising a weft material and a warp material, the warp material comprising a conductive material and the weft material comprising a non-conductive material.
Example 37 includes the subject matter of any of Examples 1-36, the warp material comprising a non-conductive textile material, an optical fiber, a thermochromic fiber, or a shape-memory alloy fiber.
Example 38 includes the subject matter of any of Examples 1-37, the textile structure further comprising: a plurality of functional devices; and a plurality of sensors, wherein the plurality of functional devices and the plurality of sensors interface between the one or more layers of interlaced materials using the one or more VIAS as the conductor.
Example 39 includes the subject matter of Example 1, wherein the textile structure comprises a knitted textile comprising one or more freeform integrated channels.
Example 40 includes the subject matter of any of Examples 1-39, wherein the one or more freeform integrated channels comprise one or more shape memory alloy (“SMA”) micro-springs.
Example 41 includes the subject matter of any of Examples 1-40, where the one or more SMA micro-springs are skin-shifting actuators when attached to a skin location of a user.
Example 42 includes the subject matter of any of Examples 1-41, wherein the one or more SMA micro-springs are self-shifting actuators when in close contact to a skin location of a user.
Example 43 includes the subject matter of Example 1, wherein the textile structure comprises a laced structure.
Example 44 includes the subject matter of Example 1, wherein the wearable system comprises configured as a patch, a bandage, a ring, a band, a garment, or a wearable textile.
Example 45 is a method, comprising: by a processor of a wearable device comprising a textile structure: receiving an input from one or more sensors of the wearable device; based on the input, determining a responsive function to be performed by one or more functional components of the wearable device; and transmitting, to each of the one or more functional components, instructions to perform the responsive function.
Example 46 includes the subject matter of Example 45, further comprising: by the processor of the wearable device comprising the textile structure: receiving data from one or more sensors of the wearable device; based on the received data, determining a position of the wearable device relative to a user of the wearable device; and transmitting, to an external computing system, the position of the wearable device.
Example 47 includes the subject matter of Example 45 or 46, wherein the processor communicates with the external computing system via a radio frequency identification (“RFID”) signal.
Example 48 includes the subject matter of any of Examples 45-47, wherein the processor determines the position of the wearable device by determining one or more of a spatial location, configuration, or orientation of the one or more sensors of the wearable device.
Example 49 is an affixable system, comprising: a textile structure configured to be affixed to a location, the textile structure comprising: one or more channels, one or more functional devices embedded within the one or more channels and configured to provide a response function, a sensor embedded within the textile structure, and a conductor embedded within the textile structure; and a circuit board connected to the one or more functional devices and the sensor by the conductor and the configured to receive an input from the sensor and to output a signal to the functional device to initiate the response function.
Example 50 includes the subject matter of Example 49, wherein the location is substantially cylindrical in shape.
Example 51 includes the subject matter of Example 49, wherein the location is associated with one or more of a user, an agricultural object, or a substantially cylindrical object.
Example 52 includes the subject matter of Example 49, the textile structure further comprising an adhesive layer configured to affix the textile structure to the location.
Example 53 includes the subject matter of Example 49, wherein the textile structure is affixed to the location by slipping over an object associated with the location.
Example 54 includes the subject matter of Example 49, wherein the textile structure comprises a knitted structure.
Example 55 includes the subject matter of Example 49, wherein the circuit board comprises a printed circuit board (“PCB”).
Example 56 includes the subject matter of Example 49, wherein the one or more functional devices are haptic feedback components.
Example 57 includes the subject matter of any of Examples 49-56, wherein the haptic feedback components are shape memory alloy (“SMA”) micro-springs.
Example 58 includes the subject matter of any of Examples 49-57, wherein the haptic feedback components are configured to apply one or more of a compression, a pinch, a brush, or a twist as the response function based on the input from the sensor.
Example 59 includes the subject matter of Example 49, wherein the sensor comprises a capacitive touch sensor.
Example 60 includes the subject matter of Example 49, wherein the one or more channels are configured in a linear shape.
Example 61 includes the subject matter of Example 49, wherein the one or more channels are configured in a free-form curve shape.
Example 62 includes the subject matter of Example 49, wherein the one or more channels are configured in a closed curve shape.
Example 63 includes the subject matter of Example 49, wherein the one or more channels intersect.
Example 64 includes the subject matter of Example 49, wherein the textile structure comprises a sleeve.
Example 65 includes the subject matter of any of Examples 49-64, wherein the sleeve is configured to affix to a cylindrical object by slipping over the cylindrical object.
Example 66 includes the subject matter of any of Examples 49-65, the sleeve comprising a latching mechanism such that the sleeve can be affixed to a cylindrical object.
Example 67 includes the subject matter of Example 49, wherein the one or more functional devices are pneumatic actuators.
Example 68 includes the subject matter of any of Examples 49-67, wherein the pneumatic actuators are configured to lengthen as the response function based on the input from the sensor.
Example 69 includes the subject matter of any of Examples 49-68, the textile structure configured for motion relative to the location that the textile structure is affixed in response to a lengthening of the pneumatic actuators.
Example 70 includes the subject matter of any of Examples 49-69, the textile structure configured to apply a normal force to a surface of the location that the textile structure is affixed while in motion.
Example 71 includes the subject matter of any of Examples 49-70, wherein the pneumatic actuators are connected to a pressure source.
Example 72 includes the subject matter of any of Examples 49-71, wherein the textile structure comprises a knitted structure comprising a base layer and an inner layer.
Example 73 includes the subject matter of any of Examples 49-72, the base layer comprising an elastic material conformable to the location that the textile structure is affixed.
Example 74 includes the subject matter of any of Examples 49-73, the inner layer comprising one or more rows of curved scales, wherein the one or more rows of curved scales are configured to engage with a surface of the location to which the textile structure is affixed such that the textile structure moves relative to the surface in response to a lengthening of the pneumatic actuators.
Example 75 includes the subject matter of Example 49, wherein the one or more functional devices are fluidic yarn actuators.
Example 76 includes the subject matter of Example 49, wherein the sensor comprises a microphone.
Example 77 includes the subject matter of Example 49, wherein the sensor comprises a water sensor.
Example 78 includes the subject matter of Example 49, wherein the sensor comprises a velocity sensor.
This application claims the benefit of and priority to U.S. Provisional Patent Application No. 63/185,908, filed May 7, 2021 entitled “Woven On-Skin Electronic Devices And Methods Of Fabricating The Same”, and U.S. Provisional Patent Application No. 63/213,647, filed Jun. 22, 2021 entitled “Woven On-Skin Electronic Devices And Methods Of Fabricating The Same”, the contents of which are incorporated by reference in their entireties herein.
Filing Document | Filing Date | Country | Kind |
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PCT/US22/28340 | 5/9/2022 | WO |
Number | Date | Country | |
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63185908 | May 2021 | US | |
63213647 | Jun 2021 | US |