Claims
- 1. A weld bonding method for bonding metal surfaces together with adhesion both by an adhesive and by resistance spot welding through the adhesive, comprising the steps of:
- preparing the adhesive by admixing a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more conductive additives selected from the group consisting of metal, metal oxide, metal carbide, metal nitride, metal boride and metal silicide, said additive being in the form of a powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of at least 0.5 .mu.m and a particle size of 30 .mu.m or less;
- applying the adhesive to at least one of the metal surfaces to be bonded;
- then spreading the applied adhesive;
- then placing the metal surfaces together with the spread adhesive therebetween;
- then spot welding the metal surfaces together; and then heating the metal surfaces to cure the adhesive whereby the additive improves conductivity to enhance the strength of the spot welds.
- 2. A weld bonding method according to claim 1, wherein said conductive metal includes Fe, Sn and Al or an alloy thereof.
- 3. A weld bonding method according to claim 1, wherein said conductive metal oxide includes oxides of Mn, Fe, Zr and Ti.
- 4. A weld bonding method according to claim 1, wherein said conductive metal carbide includes carbides of Ti, Zr, V, Nb, Ta, Mo and W.
- 5. A weld bonding method according to claim 1, wherein said conductive metal nitride includes nitrides of Ti, Zr, V, Nb, Ta and Cr.
- 6. A weld bonding method according to claim 1, wherein said conductive metal boride includes borides of Ti, Zr, Nb, Ta, Cr, Mo, W and La.
- 7. A weld bonding method according to claim 1, wherein said conductive metal silicide includes silicides of Ti, Zr, Nb, Ta, Cr, Mo, W and Fe.
- 8. A weld bonding method according to claim 1 wherein the applied adhesive is spread to a thickness of 0.2 mm or less prior to placing the metal surfaces together.
Priority Claims (1)
Number |
Date |
Country |
Kind |
265379 |
Oct 1994 |
JPX |
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Parent Case Info
This application is a continuation of application Ser. No. 08/549,317, filed Oct, 27, 1995, now abandoned.
US Referenced Citations (4)
Continuations (1)
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Number |
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549317 |
Oct 1995 |
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