This is a U.S. National Stage application of International Application No. PCT/JP2018/048031 filed Dec. 27, 2018, which claims benefit of priority from Japanese Patent Application No. 2017-253541 filed on Dec. 28, 2017. These references are incorporated herein by reference in their entirety.
The present invention relates to a welding structure, a wiring board with a metal piece, and a welding method.
In the related art, as shown in PTL 1, a welding method in which a first metal member and a second metal member are superimposed and an interface between the two members is irradiated with laser light has been known. After welding, the first metal member and the second metal member are fixed and electrically connected.
In this type of welding method, bonding strength and electric resistance need to be improved.
One or more embodiments of the present invention improve bonding strength and reduce electric resistance in a welding structure.
Patent Document 1
Japanese Unexamined Patent Application, First publication No. H 10-334956
A welding structure according to one or more embodiments of the present invention include a first metal member and a second metal member that are superimposed and welded together, in which the first metal member has a hole, the second metal member has a nugget portion that is solidified again (i.e., re-solidified) after being melted by heat, a peripheral portion of the hole in the first metal member covers the nugget portion, and a part of the nugget portion is exposed through the hole.
Here, in a cross-sectional view along an up-down direction in which the first metal member and the second metal member are superimposed, an interface between the nugget portion and the non-melted portion in the second metal member may include a protruding interface that protrudes toward the first metal member in the up-down direction.
A wiring board with a metal piece according to one or more embodiments of the present invention includes a flexible printed circuit having a wiring pattern, and a base and a coverlay sandwiching the wiring pattern; and a metal piece welded to the wiring pattern, in which the wiring pattern has a hole, the metal piece has a nugget portion that is solidified again after being melted by heat, a peripheral portion of the hole in the wiring pattern covers the nugget portion, and a part of the nugget portion is exposed through the hole.
The welding method according to one or more embodiments of the present invention includes a preparation step of superimposing a first metal member having copper as a main component and a hole formed thereon on an upper surface of a second metal member having aluminum as a main component; and an irradiation step of applying laser light near the hole from above to weld the first metal member and the second metal member, in which a trajectory of the laser light in the irradiation step is spiral across the hole, in a top view.
A welding method according to one or more embodiments of the present invention includes a preparation step of superimposing a first metal member having a hole on an upper surface of a second metal member; a fixing step of fixing the first metal member and the second metal member with a jig; and an irradiation step of applying laser light near the hole from above through a jig hole formed in the jig to weld the first metal member and the second metal member, in which in a top view, a trajectory of the laser light in the irradiation step is annular from a first point located outside the hole to a second point located inside the hole, and 0<R2<D1÷2<R1<D2÷2 is satisfied when a diameter of the hole is represented by D1, a diameter of the jig hole is represented by D2, a distance between a central axis of the hole and the first point is represented by R1, and a distance between the central axis and the second point is represented by R2.
In the welding method according to one or more embodiments, a main component of the first metal member may be copper, a main component of the second metal member may be aluminum, and the trajectory may be spiral in a top view.
According to one or more embodiments of the present invention, in a welding structure, bonding strength can be improved and electric resistance can be reduced.
Hereinafter, a welding method, a welding structure, and a wiring board with a metal piece according to one or more embodiments will be described with reference to the drawings. Note that the present invention is not limited to the following embodiments.
In one or more embodiments, a description will be given of a welding method or the like for welding the first metal member 11 of a thin film shape as shown in
A straight line that passes through the center of a hole 11a described later in the first metal member 11 and extends in the up-down direction is referred to as a central axis C (see
The first metal member 11 is formed in a thin film shape. The shape of the second metal member 20 is not particularly limited, but may be a film shape, a plate shape, a block shape, or the like. The materials of the first metal member 11 and the second metal member 20 are different from each other. The melting point of the first metal member 11 may be higher than the melting point of the second metal member 20. The first metal member 11 is formed of, for example, a metal (copper alloy) containing copper as a main component. The second metal member 20 is formed of, for example, a metal (aluminum alloy) containing aluminum as a main component.
Next, as shown in
Next, as shown in
0<R2<D1÷2<R1<D2÷2 (1)
By applying the laser light L, the first metal member 11 and the second metal member 20 are partially melted. Thereby, as shown in
Next, the welding structure 1 obtained by the above welding method will be described with reference to
By forming such a protruding interface 21a, separation (peeling) is less likely to occur at the interface between the non-melted portion 21 and the nugget portion 22, and the bonding strength can be increased. Further, the nugget portion 22 has a shape that partially enters the inside of the hole 11a of the first metal member 11 in the radial direction and is fitted into the hole 11a. Thereby, the bonding strength between the first metal member 11 and the second metal member 20 can be further increased.
A part of the nugget portion 22 is exposed through the hole 11a. Further, the nugget portion 22 partially enters below the first metal member 11. In other words, the peripheral portion of the hole 11a in the first metal member 11 covers the nugget portion 22 from above. In one or more embodiments, a portion of the first metal member 11 that covers the nugget portion 22 is called an overlap portion 11b. The reason why the overlap portion 11b is formed is that the melting point of the first metal member 11 is higher than the melting point of the second metal member 20. More specifically, as shown in
By forming the overlap portion 11b in this manner, the area of the interface where the first metal member 11 and the second metal member 20 are welded increases, and the welding strength can be further increased.
In addition, the inner diameter of the hole 11a after welding (hereinafter, referred to as a hole diameter D1′ after welding) is larger than the hole diameter D1. This is because the portion of the first metal member 11 near the hole 11a is melted and mixed with the second metal member 20 to form the eutectic portion A. The eutectic portion A is formed over the inner peripheral surface of the hole 11a and the lower surface of the overlap portion 11b. The eutectic portion A may be thin because it is brittle and has low strength. In one or more embodiments, the thickness of the eutectic portion A can be easily controlled by adjusting the dimensions P, R1, R2, D1, or the like.
The welding structure 1 according to one or more embodiments can be applied to a wiring board 2 with a metal piece as shown in
As shown in
As described above, the wiring pattern 11 and the metal piece 20 are partially superimposed, and the wiring pattern 11 and the metal piece 20 are welded by using the bonding method shown in
Next, the effect of the presence or absence of the hole 11a on the bonding strength and the electric resistance will be described using an example.
In the present example, the wiring board 2 with a metal piece as shown in
In the present example, the trajectory T of the laser light L is formed in a spiral shape as shown in
The laser output in Table 1 shows the ratio to the maximum output, and is set to 70% to 80% in the present example. The scanning speed when the laser light L traces the trajectory T is 600 mm/s. The jig hole diameter D2 is 1 mm. The first metal member 11 is a copper foil having a thickness of 0.035 mm. In the “with holes” sample, a total of ten holes 11a arranged as shown in
Under the above conditions, the hole diameter D1′ after welding (see
“Resistance value” shown in Table 1 is a result of measuring the electric resistance between points P1 and P2 shown in
As shown in Table 1, the sample without holes has an average resistance value of 0.35 mΩ and the sample with holes has an average resistance value of 0.23 mΩ. Thus, the electric resistance can be reduced by about 34% by forming the hole 11a in advance.
“Bonding strength” shown in Table 1 is a result of measuring the bonding strength of each sample using a tensile tester as shown in
As shown in Table 1, the sample without holes has an average bonding strength of 2.76 kgf, and the sample with holes has an average bonding strength of 3.47 kgf. Thus, by forming the hole 11a in advance, the bonding strength can be improved by about 26%. This is because the welding structure shown in
As described above, the welding method according to one or more embodiments includes the preparation step of superimposing the first metal member 11 having the hole 11a formed thereon on the upper surface of the second metal member 20, and the irradiation step of applying laser light L near the hole 11a from above to weld the first metal member 11 and the second metal member 20. Then, in a top view, the trajectory T of the laser light L in the irradiation step is annular from the first point X1 located outside the hole 11a to the second point X2 located inside the hole 11a (across the hole 11a). Thereby, the welding structure 1 as shown in
In the welding structure 1, the peripheral portion of the hole 11a covers the nugget portion 22 of the second metal member 20. Thereby, the area of the interface where the first metal member 11 and the second metal member 20 are bonded increases, and the bonding strength can be improved. Further, as shown in the example, the electric resistance between the first metal member 11 and the second metal member 20 can be reduced.
Further, as shown in
Further, since the melting point of the first metal member 11 is higher than the melting point of the second metal member 20, the second metal member 20 melts faster than the first metal member 11, so that the overlap portion 11b of the first metal member 11 is easily formed.
The thickness of the eutectic portion A can be easily controlled by adjusting the welding parameters P, R1, R2, D1, or the like, because the trajectory T of the laser light L is spiral in a top view.
Further, by applying the welding method or the welding structure 1 as described above to the wiring board 2 with a metal piece, the bonding strength between the wiring pattern 11 and the metal piece 20 is increased, and the electric resistance between the wiring pattern 11 and the metal piece 20 can be reduced.
It should be noted that the technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.
For example, the welding method and the welding structure 1 of the above-described embodiments may be used for applications other than the wiring board 2 with a metal piece.
Further, the trajectory T of the laser light L may be directed from the radial inside (the second point X2) of the hole 11a to the radial outside (the first point X1).
Further, the trajectory T may be substantially annular as a whole, for example, by making the trajectory radial about the central axis C.
Although the disclosure has been described with respect to only a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that various other embodiments may be devised without departing from the scope of the present invention. Accordingly, the scope of the invention should be limited only by the attached claims.
1 Welding structure
2 Wiring board with metal piece
10 Flexible printed circuit
11 First metal member (wiring pattern)
11
a Hole
12 Coverlay
13 Base
20 Second metal member (metal piece)
22 Nugget portion
21
a Protruding interface
Number | Date | Country | Kind |
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JP2017-253541 | Dec 2017 | JP | national |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/JP2018/048031 | 12/27/2018 | WO |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2019/131828 | 7/4/2019 | WO | A |
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Entry |
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International Search Report issued in corresponding International Application No. PCT/JP2018/048031, dated Mar. 26, 2019 (3 pages). |
Office Action issued in counterpart Chinese Patent Application No. CN 201880061937.6 dated Aug. 12, 2021 (8 pages). |
Number | Date | Country | |
---|---|---|---|
20200306882 A1 | Oct 2020 | US |