The present invention relates to a wet surface treatment apparatus.
General wet surface treatment represented by plating is performed as follows. A plurality of treatment tanks including a water washing tank, or anterior and posterior surface treatment tanks are arrayed in order of processes, and a surface treatment target member moves to the respective treatment tanks in sequence. Therefore, a wet surface treatment apparatus is lengthened in size long as a whole. In addition, due to immersion treatment, the treatment tank needs to be larger than the surface treatment target member. Consequently, a size of the wet surface treatment apparatus increases. Furthermore, when the surface treatment is partially performed, it is necessary to form a resist on a surface treatment target portion.
For example, as a wafer plating apparatus in the related art, PTL 1 (JP-A-6-57497) discloses the following plating apparatus. The plating apparatus includes a cup into which a plating solution is injected, multiple plating solution outflow hole radially disposed on an upper wall portion of the cup, a ring-shaped rubber sheet disposed on an upper surface of the cup, and a cathode electrode disposed on an upper surface of the rubber sheet in a state where an end portion is located outward as far as a predetermined distance from an inner peripheral end of the rubber sheet. In a state where a plating connection terminal disposed on a plating target surface of a wafer is brought into contact with the cathode electrode, a substantial periphery of the plating target surface is brought into close contact with the upper surface of the rubber sheet.
In addition, as an apparatus for decreasing a size of the wet surface treatment apparatus, PTL 2 (JP-A-2012-67362) proposes the following plating apparatus, for example. In order to continuously performing plating with a single treatment tank, the plating apparatus includes one treatment tank and a switching valve for causing only one or more pipes selected from a plurality of pipes to communicate with the treatment tank. In addition, as a method of partially performing the wet surface treatment, PTL 3 (JP-A-59-96289) proposes the following plating apparatus, for example. In order to partially performing the plating by ejecting a plating solution from a nozzle connected to a mask, the plating apparatus includes a mantle box having an exclusion port connected to the mask and an aspiration mechanism for bringing the inside of the nozzle and the mantle box into a negative pressure state.
PTL 1: JP-A-6-57497
PTL 2: JP-A-2012-67362
PTL 3: JP-A-59-96289
In a case where a large structure member or a structure member fixed onto the land is a surface treatment target, a surface treatment apparatus needs to be portable, and does not need to choose a shape of a surface treatment target member. However, the apparatuses disclosed in PTLS 1 to 3 are less likely to satisfy this requirement. That is, according to techniques disclosed in PTLS 1 to 3, the surface treatment apparatuses themselves are not movably used. The apparatuses are so-called in-line apparatuses. In addition, the apparatuses have an apparatus configuration adapted to the surface treatment target member having a shape and a size which are determined to a certain extent, and thus, the apparatuses cannot perform surface treatment on any desired portion of the large structure member or the structure member fixed onto the land.
PTL 2 attempts to decrease the size of the wet surface treatment apparatus by using a switching valve so as to employ one treatment tank. However, the surface treatment target member has to be installed inside the treatment tank. Consequently, the treatment tank needs to be larger in size than the surface treatment target member, and thus, the large structure member or the structure member fixed onto the land cannot be a plating treatment target.
In PTLS 1 and 3, a wafer or an IC chip is the plating treatment target. PTL 1 does not enable partial plating treatment. In addition, PTL 3 enables partial plating treatment by ejecting the plating solution from the nozzle connected to the mask. However, PTL 3 adopts an apparatus configuration on the assumption that a flat substrate is set as the surface treatment target member. Therefore, in order to obtain adhesion between the surface treatment target member and the mask, a surface of the surface treatment target member has to be flat, and it is necessary to press the mask or the surface treatment target member. Consequently, the wet surface treatment is less likely to be performed on an irregular surface, a curved surface, and a large surface area.
In view of the above-described circumstances, the present invention aims to provide a wet surface treatment apparatus which can perform surface treatment on a desired place of a surface treatment target member, irrespective of an installed place of the surface treatment target member, or a shape and a size of the surface treatment target member.
According to the present invention, in order to achieve the above-described object, there is provided a wet surface treatment apparatus including a tank that contains a treatment liquid, a nozzle that ejects the treatment liquid to a surface treatment target member, and a power source that supplies a current to the nozzle. The nozzle has a nozzle body which has a flow path of the treatment liquid, a nozzle cover in which one end is connected to a tip of the nozzle body and the other end comes into contact with the surface treatment target member, and a power feeder line which supplies the current from the power source to the nozzle body and the nozzle cover.
According to the present invention, it is possible to provide a wet surface treatment apparatus which can perform surface treatment on a desired place of a surface treatment target member, irrespective of an installed place of the surface treatment target member, or a shape and a size of the surface treatment target member.
Hereinafter, embodiments according to the present invention will be described with reference to the drawings.
However, the present invention is not limited to these embodiments. Improvements and modifications can be appropriately added to the present invention within the scope in which the gist of the invention is not changed.
The nozzle 4 has a nozzle body 4a and a nozzle cover 4b. The nozzle body 4a internally has a flow path of the treatment liquid. It is preferable that the nozzle cover 4b is flexible. In this manner, the nozzle cover 4b is installed so as to be in close contact with the surface treatment target member 7, and thus, the treatment liquid can be prevented from leaking. A configuration of the nozzle body 4a and the nozzle cover 4b will be described in detail later. A shape and a size of the nozzle 4 are not particularly limited. However, it is preferable that the shape and the size allow easy manual operation. If necessary, it is preferable to provide a function to switch the treatment liquid to the nozzle 4, a function to switch a polarity of the current, a function to adjust the amount of the current, and a function to adjust an ejection amount, thereby improving workability.
The power source 8 supplies the current to the treatment liquid and the surface treatment target member 7 via the nozzle 4. Although not illustrated in
The treatment liquid (surface treatment liquid used for the surface treatment of the surface treatment target member 7) contained in the tank 11 is supplied to the nozzle 4 via a treatment liquid circulation tube (hereinafter, simply referred to as a “tube”) 9 and a circulation pump 10. In addition, in the treatment liquid ejected from the nozzle 4, the treatment liquid (waste liquid) which is not applied to the surface treatment target member 7 is contained again in the tank 11 via an outflow hole disposed in the nozzle cover 4b (to be described later), a tube 9′, and a circulation pump 10′. In this manner, the waste liquid is reused.
If necessary, the tank 11 may contain a plurality of different treatment liquids by being internally divided into a plurality of rooms. In this case, a desired treatment liquid can be selected by a switching valve 12, and can be fed to the nozzle 4. In addition, the collected treatment liquid can be collected into the desired room by a switching valve 12′. Each switching port of the switching valves 12 and 12′ is disposed depending on the number of rooms.
Next, the nozzle body 4a and the nozzle cover 4b which configure the nozzle 4 will be described.
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As a material of the nozzle cover 4b, a material having electrical insulating properties and chemical resistance is used, and a flexible material (elastic material) is used so that the nozzle cover 4b can come into close contact with the treatment target member 7 having various shapes (so as to ensure followability to a non-planar surface). For example, as the flexible material, a silicone resin or a fluorine resin is preferably used.
A material of the power feeder line 2 is not particularly limited. However, it is preferable to use metal or a metal alloy having low electrical resistivity. More specifically, Cu (copper) or Au (gold) is preferably used.
A material of the insoluble electrode 5 is not particularly limited. However, it is preferable to use a material which has low electrical resistance and which is stable chemically and electrochemically. Specifically, a layered electrode of Ti (titanium)/Pt (platinum) and Ti (titanium)/Ir (iridium), or C (graphite) is preferably used.
A material of a housing (portion covering the flow path of the treatment liquid) of the nozzle body 4a is not particularly limited. However, it is preferable to use a material having rigidity, chemical resistance, and electrical insulating properties. Specifically, polypropylene, polycarbonate, or fluorine resin is preferably used.
A material of the tubes 9 and 9′ is not particularly limited. However, it is preferable that the material has chemical resistance and is flexible. In addition, it is preferable that the tubes 9 and 9′ between the treatment liquid tank 11 and the switching valves 12 and 12′ are disposed depending on the number of rooms inside the treatment liquid tank 11.
The number of circulation pumps 10 and 10′ is not particularly limited. However, it is preferable to provide two or more circulation pumps in order to improve the circulating performance of the treatment liquid 6. For example, it is preferable to dispose the circulation pumps at two locations between the treatment liquid tank 11 and the nozzle 4, and between the outflow hole 3 of the nozzle cover 4b and the treatment liquid tank 11.
The treatment liquid tank 11 is not particularly limited. However, it is desirable that the treatment liquid tank 11 contains a cleaner used in a series of the surface treatment steps or the treatment liquid 6 including etching and washing solutions. A plurality of different treatment liquids are provided, thereby enabling one apparatus to continuously perform a series of the surface treatment steps on the surface treatment target member 7. In addition, a multilayered film can be formed. In addition, it is desirable that the volume of the treatment liquid tank 11 is set in accordance with a treatment area of the surface treatment target member 7.
The characteristics of the configuration of the wet surface treatment apparatus according to the first embodiment described above are as follows. (1) The treatment liquid 6 is ejected from the nozzle 4, thereby enabling partial wet surface treatment. (2) Even in a case where the surface treatment target member 7 has a non-planar shape, the flexible nozzle cover 4b and the power feeder line 2 exposed on the contact surface 4d of the nozzle cover 4b can ensure power feeding capacity. (3) The liquid supply pipe is unified by the switching valves 12 and 12′, thereby reducing the number of configuration components of the wet surface treatment apparatus. The respective configuration components are connected to each other using the flexible tubes 9 and 9′, thereby enabling the transportability of the wet surface treatment apparatus to be improved.
According to the above-described configurations of the wet surface treatment apparatus of the present invention, for example, even if the surface treatment target member 7 is a large structure member such as abridge girder and a power plant and is fixed onto the ground, the surface treatment can be performed on a desired site. Therefore, surface repair work can be easily carried out without disassembling the large structure member.
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As described above, the wet surface treatment apparatus according to the present invention is used. In this manner, irrespective of an installed place of the surface treatment target member, or a shape and a size of the surface treatment target member, the surface treatment can be performed on a desired place of the surface treatment target member. According to the above-described configuration, the transportation of the wet surface treatment apparatus is facilitated. For example, partial repair work using the wet surface treatment can be carried out for a non-planar member which is less likely to be transported, such as large infrastructure equipment installed out of doors.
The present invention is not limited to the above-described embodiments, and includes various modification embodiments. For example, the embodiments have been described above in detail in order to facilitate the understanding of the present invention, and the present invention does not necessarily include all of the described configurations. In addition, the configuration according to one embodiment can be partially substituted with the configuration of the other embodiment. In addition, the configuration of one embodiment can be added to the configuration of the other embodiment. In addition, additions, deletions, and substitutions of other configurations can be made for a partial configuration of the respective embodiments.
Number | Date | Country | Kind |
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2015-095359 | May 2015 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2016/057765 | 3/11/2016 | WO | 00 |