The present invention relates to the field of cleaning devices. This invention generally relates to replaceable wipe pads for use with floor cleaning mop heads in wet applications, and specifically to wet wipe pads that attach to mop heads that utilize a ‘hook-and-loop’ mechanism for attaching the wipe pad to the mop head.
As shown in
In such existing designs, the physical construction of the removable wipe pad 200 is such that multiple layers of the surface material 210, typically made of polyester (or P.E.), are sewn or glued together to assemble the wipe pad. However, although these existing wipe pads may be able to attach to the mop head 10 via the hook-and-loop mechanisms in a dry environment. One of the drawbacks or shortcomings of the known design is that the wipe pad strips 222, 224 having the ‘loops’ do not able to attach well (or satisfactorily remain attached) to the mop head strips 122, 124 having the ‘hooks’ in situations when the mop is used to clean wet floors and the wipe pad gets wet. As such, when existing wipe pads are used to clean wet floor or in other wet application, either the strips on the wipe pad do not attach well to the strips on the mop head, or the strips on the wipe pad become detached and fall off the mop head.
Another known cleaning device has a cleaning pad support platen defining a support cleaning surface region that is arranged to releasably receive and secure a conventional cleaning pad using hook-and-loop fasteners on the platen. The cleaning pad includes a relatively non-abrasive cleaning surface. A scrub device with a relatively more abrasive surface is attached to the cleaning pad. One or more such scrub devices may be attached to the same cleaning pad surface to cover part or all of the cleaning pad surface. The abrasive scrub devices may have different dimensions to cover different areas of the cleaning pad non-abrasive surface to provide enhanced scrubbing action as desired. The abrasive scrub devices may be provided with different abrasion surfaces having different abrasive values and may be removed to expose the full non-abrasive cleaning surface for non-abrasive cleaning. Also known are hand held devices having multiple layer scrubbing pads for attaching to a rigid hand held handle. Such devices are unduly expensive and difficult to manufacture as a disposable wipe pad.
In view of the foregoing, there is a need for, and what was heretofore unavailable, are replaceable wipe pads for use with floor cleaning mop heads that attach to mop heads using a ‘hook-and-loop’ mechanism without sewing or gluing such that the wipe pad remains attached to the mop head in wet conditions. There is a further need for mop head wipe pads that are economically manufactured, simple to use and can easily and removably attach itself, to the mop head, wherein the wipe pad has good liquid absorbency and is able to be used in wet mopping applications without the wipe pad falling off the mop head or coming loose from the mop head. The present invention fulfills these and other needs.
Briefly, and in general terms, the present invention is directed to replaceable wipe pads for use with floor cleaning mop heads in wet applications that utilize a ‘hook-and-loop’ mechanism for attaching the wipe pad to the mop head. The wet wipe pad of the present invention is designed to be connected or attached to floor mop heads that utilize a hook-and-loop mechanism for attaching the wipe pad to the mop head, such as the existing mop head shown in
The composition of materials used in manufacturing the wipe pad of the present invention is designed to absorb and hold liquid (for example, water) while performing the function of cleaning or mopping of floors and other surfaces. The physical construction of the wipe pad is designed to use no glue or sewing for assembling of the pad. Rather, the wipe pad of the present invention may be assembled and manufactured using ultrasound and embossing and pressing equipment that are known to those skilled in the art of designing such cleaning devices and similar multi-layered products. In addition, the wipe pad may include multiple logo-embossed areas formed by ultrasound pressing to provide for additional connectivity of the various layers of the wipe pad together.
The wipe pad of the present invention includes a first substantially rectangular cleaning pad (layer), a second substantially rectangular attachment pad (layer), and a third substantially rectangular absorption pad (layer) disposed between the first pad and the second pad. The attachment pad is configured with a first and second strip of fibers (linking ribbon) extending from the first end to the second end of the attachment pad. The cleaning pad is attached to the attachment pad by ultrasound. The first strip of fibers and the second strip of fibers are attached to the attachment pad by ultrasound such that several attachment segments are formed within both strips of fibers. The cleaning pad is formed from polyester and viscose, the attachment pad is formed from polypropylene, and the third pad is formed from wood pulp or viscose (or other suitable absorption material). Each of the first pad, the second pad and the third pad may include at least one embossed portion
The present invention further contemplates a method for manufacturing a wipe pad. The manufacturing process includes forming a first rectangular cleaning pad from polyester and viscose, forming a second substantially rectangular attachment pad from polypropylene, and forming a third substantially rectangular absorption pad from wood pulp or viscose (or other suitable liquid absorption material). The absorption pad is positioned between the cleaning pad and the attachment pad, and known ultrasound manufacturing techniques are used to attach the cleaning pad to the attachment pad. Similarly, a first linking ribbon and second linking ribbon are attached to the second pad using ultrasound. The linking ribbons may be formed with a wave pattern using ultrasound manufacturing processes known to one of ordinary skill in the art.
Other features and advantages of the invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, which illustrate, by way of example, the features of the invention.
As shown in the drawings for purposes of illustration, the present invention is directed to a cleaning device. The wet wipe pad of the present invention is designed to be connected or attached to floor mop heads that utilize a hook-and-loop mechanism for attaching the wipe pad to the mop head, such as the existing mop head shown in
Turning now to the drawings, in which like reference numerals represent like or corresponding aspects of the drawings, and with particular reference to
As also shown in
The cleaning layer 300, 520 of the wipe pad 500 may be formed from a combination of materials that enables the wipe pad to act as a wet wipe and absorb liquid when the wipe pad touches a floor or other surface to be cleaned. The material of the cleaning layer is selected to enable the cleaning layer to attach to other layers of the wipe pad with ultrasound equipment. In one embodiment, the cleaning pad material includes an absorption material such as viscose (for example, fifteen to twenty-five percent and preferably twenty percent by weight) and a non-woven polyester (for example, seventy to ninety percent and preferably eighty percent) with a weight in the range of fifty to seventy grams-per-square-meter (GSM) and preferably sixty GSM. Alternative and suitable materials for absorption in the cleaning pad include products that provide adequate absorption of liquids while achieving the objectives of the present invention to provide economical, relatively lightweight and easy to manufacture wipe pads. Alternative materials for non-woven polyester include products that are compatible with the absorption material, are economical and are responsive to an ultrasound manufacturing process.
Referring now to
With further reference to
In distinction from other existing wipe pads, the linking ribbon of the present invention does not connect to the body of the wipe pad by glue or sewing/stitching, and instead it is secured to the body of the pad by use of ultrasound technique and equipment. Moreover, each linking ribbon is made of very thin and fine threads so as to create the most and best effective connection with the strip of attachment ‘hooks’ on the mop head. The wave-like pattern is formed using multiple ultrasound pressed area lines 482, 484, 486, 492, 494, 496 in the linking ribbon. In this unique manner of construction and assembly, when the linking ribbon and wipe pad of the present invention come into contact with liquid (for example, water) and become wet, the connection between the segmented linking tape on the wipe pad and the strip of attachment ‘hooks’ on the mop head holds well such that the wipe pad does not come apart from the mop head unexpectedly. Therefore, unlike existing wipe pads, the design and construction of the present invention allows the wipe pad to remain securely attached to the mop head in wet applications.
As shown in
In an embodiment of the present invention and by way of example only, the wipe pad weighs fourteen grams. In such an example, the pad is thirteen centimeters (cm) wide by forty cm long (approximately five inches by sixteen inches). The thickness of that wipe pad is 1.5 millimeters (mm), and the linking ribbon is two cm wide. In accordance with the present invention, however, the wipe pad may be made in various sizes, shapes to accommodate a particular mop head and its intended use.
Referring now to
As shown in
The attachment layer 800 is configured with at least one strip of linking fibers (threads) 872, 874 extending along the longitudinal length of the layer (see
The wipe pad 900 is shown with an absorption pad 950 disposed between the cleaning layer 700 and the attachment layer 800 (see
Those skilled in the art of manufacturing mechanical devices such as the disclosed cleaning device can determine, without undue experimentation, the appropriate dimensions, geometries, materials, and other features of the wipe pad. Other embodiments in accordance with the present invention (for example, but not limited to, use with various mop heads or a hand-held apparatus) may be employed as is known to those skilled in the art of designing and/or manufacturing of cleaning devices. Similarly, those skilled in the art will understand from the disclosure herein that various modifications to the components (cleaning layer, attachment layer, absorption pad and linking ribbon or fibers) of the wipe pad can be made without departing from the scope of the invention. More specifically, the present invention is not limited to any particular method of forming (manufacturing) the wipe pad and it components.
While certain aspects of the invention have been illustrated and described herein in terms of its use as a wipe pad for use with a mop head, modifications and improvements to the disclosed apparatus may be made without departing from the scope of the invention. Accordingly, the scope of the invention is not intended to be limited by, for example, but not limited to, the details of the drawings and the appended claims.
This application claims the benefit of U.S. Provisional Application Ser. No. 61/754,767, filed Jan. 21, 2013, the content of which is hereby incorporated herein by reference.