Some printing device implementations may maintain and/or clean their fluid ejection die nozzles by performing wipes thereof during idle times in which the nozzles are not being used for print operations. Such an implementation may allow a wipe material to dry between nozzle maintenance and/or clean operations. However, printing device implementations with a higher print output may prompt nozzle maintenance and/or clean operations to be performed at times other than during the idle times.
Maintenance and/or clean operations may, in some implementations, be scheduled for around every 120 pages having been printed using the nozzles of a fluid ejection die, referred to as a “die” herein. A fixed amount of wipe material may be available within the printing device and, therefore, the wipe material may be re-used multiple times to last the life of the printing device, e.g., around 150,000 pages.
When a die nozzle is wiped multiple times on a same spot, e.g., location, of an absorbent wipe material, e.g., a web of textile, the web may become saturated. The capillary draw of a fluid, e.g., residual dissolved coloring material (ink) and/or partially hardened ink, from the die nozzle may be decreased and/or air may be introduced into an opening of the die nozzle. When fluid, e.g., ink, is subsequently ejected from the opening of the die nozzle after the opening of the die nozzle has been wiped as part of the die nozzle maintenance and/or clean operation sequence, the residual fluid and/or the introduced air may block the die nozzle and reduce efficacy of the die nozzle maintenance and/or clean operation. The blocked die nozzles may affect ejection of fluid, e.g., a reduction in fluid volume and/or deviation in the direction of ejection, during a subsequent print operation, which may appear as print quality defects.
Printing device implementations with a high print output may have a protocol that directs performance of die nozzle maintenance and/or clean operations during a period of active printing, as opposed to an idle time, when reduced performance of the die nozzles is more likely to be seen on print output. The present disclosure is directed to a change in the sequence of fluid ejection from die nozzle openings and wiping of the die nozzle openings during maintenance and/or clean operations. Hence, the sequence described herein may include ejecting fluid, e.g., ejecting a droplet from an opening of a die nozzle, onto an absorbent wipe material, e.g., the web, while concurrently wiping the opening of the die nozzle.
For example, a printing device may be directed by a controller, e.g., by execution of stored instructions, to eject a droplet in a first direction from an opening in a die nozzle toward a location of an absorbent wipe material and to wipe the opening concurrently with the droplet being ejected from the opening. Such a die nozzle maintenance and/or clean operation may notably reduce occurrence of air being introduced into the die nozzle opening and/or reduction in performance of fluid ejection by the die nozzles compared to wiping the die nozzle and subsequently ejecting fluid from the die nozzle.
In the sequence described herein, the opening of the die nozzle may eject a droplet of fluid, e.g., of ink, while the opening of the die nozzle is in contact with the absorbent wipe material, e.g., web. In addition, the present disclosure describes that more than one droplet may be ejected on a same location of the web. For example, each successive ejection of a droplet on the same location incrementally increases the wetness of the location. Wiping the opening of the die nozzle with the web location concurrently with the droplets being ejected thereon while increasing the wetness. Wiping with the increasingly wet location may progressively contribute to reduction of air being introduced into the die nozzle openings. This is a paradigm shift in wiping relative to other printers because it is an unexpected result that adding wetness to an already wet web, via ejecting fluid more than once on the same location on the web, may reduce introduction of air into the die nozzle and/or may improve performance of subsequent print operations using the die nozzle.
The controller 102 may direct die nozzle maintenance and/or clean operations performed on dies positioned in a printhead 112 of the printing device 101. For example, a die 331 in the printhead 112 may be directed to eject a droplet of fluid through the opening 338 of the die nozzle 337, e.g., via activation of a fluid ejector, such as a thermal resistor, to form a bubble in proximate fluid. The droplet of fluid may be ejected toward a wipe material 109, e.g., an absorbent wipe material as also shown at 209 and described in connection with
The controller 102 may further direct ejection of a droplet from the opening 338 in each of a plurality of die nozzles 337 toward a location of the absorbent wipe material 109, e.g., a predetermined position on a surface of the absorbent wipe material. The controller 102 may further direct a wipe of the opening 338 in each die nozzle 337 by the location concurrently with the droplet being ejected from the opening 338, along with transit of the location past the opening in each die nozzle as the droplet is ejected from the opening. As such, the droplet may be at the location at a time that the opening is being wiped by the location.
In some examples, the controller 102 may further direct that ejection of the droplet from the opening 338 toward the location of the absorbent wipe material 109 be coordinated with the transit of the absorbent wipe material causing the predetermined position on the surface of the absorbent wipe material to reach the opening 338 at the time of droplet ejection therefrom. The controller 102 may further direct that the opening 338 of each die nozzle 337 ejects a determined number of droplets during an ejection, e.g., in a range of from 1 to 100 droplets, for each nozzle maintenance and/or clean operation. The controller 102 may further direct that the location on the absorbent wipe material 109 performs a plurality of wipes, e.g., in a range of from 4 to 100 wipes, corresponding to the number of ejections from the opening on the location. As such, the location on the absorbent wipe material 109 may remain wet after a first ejection of fluid on the location during the performance of the subsequent plurality of ejections on the location and/or wipes by the location.
The controller 102 may further direct that openings 338 of the die nozzles 337 be uncapped prior to performance of a nozzle maintenance and/or clean operation and recapped after performance of the nozzle maintenance and/or clean operation, as described herein. The controller 102 may further direct performance of the nozzle maintenance and/or clean operation after openings 338 of the die nozzles 337 have remained capped for a period of time, e.g., in a range of from 2 minutes to 120 minutes since being capped.
In various examples, the wiping motion of the absorbent wipe material 109 may be to the left or to the right relative to the printhead 112 shown in
The compliant member 110 may be positioned at a stable position relative to the printhead 112 such that a length on the absorbent wipe material 109 is continuously positioned adjacent a die 331 in a row of dies, e.g., as shown in and described in connection with
The length of the compliant member 110 being pressed against the printhead may correspond to the length of the dies 331 in the direction parallel to the direction of transit. The length of the compliant member 110 and/or the absorbent wipe material 109 being pressed against the dies may, in some examples, be in a range of from two millimeters (mm) to 10 mm. The location on the absorbent wipe material 109 toward which the droplet is ejected from the opening 337 of the die nozzle 338 while the opening is concurrently in contact with and/or being wiped by the location may be within the length of the compliant member 110, as further described in connection with
The fiber structure 223 may be subject to hydro-entangling 225 to break apart, e.g., dissociate, the triangular slices into microfilaments and mix, e.g., entangle, the microfilaments. For example, high pressure jets 226 of a liquid, e.g., water, among other liquids, may be applied to the fiber structure 223 to dissociate the polyamide slices 227 from the polyester slices 228. The respective microfilaments may be entangled by the high pressure jets 226 into a textile layer, e.g., web, usable as the absorbent wipe material 209 described herein. Each of the polyamide and polyester microfilaments may, in some examples, have a diameter, e.g., a radius from the point of the slice to its opposite arc, in a range of from 4 um to 15 um.
The web may be used as the layer of absorbent wipe material shown at 109 and described in connection with
In some examples, the web described herein may be utilized in a “once-through” implementation. For example, a location on the web may be re-used by more than one droplet or more than one sequence of droplets being ejected from a single opening in a die nozzle or a plurality of die nozzle openings onto the particular web location, as described herein. However, in the once-through implementation, when the maintenance and/or clean operation on those die nozzle openings is completed, the web may progress, e.g., by being moved by the sled and/or rollers, such that an unused portion of the web may be used for a next maintenance and/or clean operation performed on the die nozzle openings. In some examples, the web may progress such that half a location that was wetted in a previous operation is half in a next location and half of the next location is unused. e.g., dry. The web may progress from one end to the other end in a same direction, e.g., as determined by the instructions provided by the controller 102 to the sled drive motor 104 for the wiping motion of the sled 107 and/or to the roller arrangement (not shown). In such a once-through implementation of the web, the web may have a length, parallel to the direction of transit of the absorbent wipe material past the plurality of die nozzles, in a range of from 1 meter (m) to 6 m.
The dimensions of each die may be a width in a range of from 10 mm to 100 mm perpendicular to a direction of transit of the absorbent wipe material past the plurality of die nozzles and a length in a range of 2 mm to 20 mm parallel to the direction of transit. The number of die nozzles per sequence 335, e.g., per different type of fluid and/or different ink color, may be in a range of from 200 to 5000 die nozzles. In various examples, one nozzle for a particular sequence, e.g., type of fluid and/or ink color, may be ejecting at a time, e.g., one nozzle in a single die or one nozzle in each of a plurality of dies, up through all nozzles corresponding to a particular sequence across the width of the plurality of die nozzles of the printhead ejecting substantially simultaneously, and any other grouping of the nozzles.
The plurality of staggered dies, e.g., each having a plurality of sequences 335-1-N of die nozzles, may extend in a direction perpendicular to the direction of transit such that an end of a first die, e.g., die 331-2-1, in a first row overlaps 333-2 with a first end of a second die, e.g., die 331-2-2, in a second row in a direction parallel to the direction of transit. A second end of the second die, e.g., die 331-2-2, may overlap with an end of a third die, e.g., die 331-3-1, in the first row in the direction parallel to the direction of transit. The overlap 333-2 of the staggered dies in the first row with the dies in the second row may be in a range of from 1 mm to 10 mm, with a corresponding overlap of the die nozzles in the die in the first row with the die nozzles in the die in the second row. In some examples, the die nozzles in the first row and the die nozzles in the second row may be aligned in the overlap 333-2 in the direction parallel to the direction of transit. The number of rows of dies is shown to be two rows for clarity, although the number of rows is not so limited.
In some examples, each die in the first row, e.g., die 331-1-1, may overlap 333-2 with a die in the second row, e.g., die 331-1-2, as a pair of dies. The number of such pairs of dies may be in a range of from 5 pairs to 50 pairs. A first sequence 335 of die nozzles in a first die, e.g., die 331-1-1, and a corresponding first sequence 335 of die nozzles in a paired second die, e.g., die 331-1-2, may be separated in the direction parallel to the direction of transit by a distance 336 in a range of from 3 mm to 30 mm, along with other corresponding sequences 335-1-N. The distance 336 of separation may depend upon the number of sequences 335-1-N of die nozzles in each die, among other considerations.
Individual lengths of the plurality of dies, in the direction parallel to the direction of transit, may fit within a length, e.g., as shown at 443 and described in connection with
In various examples, the plurality of sequences 335-1-N of die nozzles in each die may correspond to a plurality of fluid colors, e.g., different colored inks for each sequence 335 of die nozzles. As such, the four sequences in each die 331 illustrated in
Droplets of the plurality of fluid colors may be ejected toward a same location of the absorbent wipe material 209. For example, a plurality of openings 338, e.g., one for each of the KCMY die nozzles at corresponding positions in the sequences 335 in die 331-2-1, may be aligned in the direction parallel to the direction of transit of the absorbent wipe material to enable at least one droplet from each to be serially ejected toward the same location during transit of the absorbent wipe material in the particular direction. Alternatively or in addition, a plurality of openings 338, e.g., one for each of the KCMY die nozzles at corresponding positions in the overlap 333-2 in sequences 335 in dies 331-2-1 and 331-2-2, may be aligned in the direction parallel to the direction of transit to enable at least one droplet from each to be serially ejected toward the same location. As used herein, to perform a function serially is intended to mean performing the function, e.g., ejecting a droplet, wiping an opening of a die nozzle with a location of an absorbent wipe material, etc., at a time that the opening and/or the droplet contacts and/or reaches, e.g., lands on, impacts, etc., the absorbent wipe material. The time for performing the function may depend on a timing, e.g., dependent on a rate, of transit of the absorbent wipe material past a particular opening.
As such, when there is no alignment 441 of droplet ejection relative to reaching a location corresponding to a position 443 of the compliant member, e.g., compliant member 110 shown in and described in connection with
By no alignment 441 of the droplet ejection relative to the position 443 of the compliant member, there may be a broad length 447 of the patches 445 on the absorbent wipe material 209 parallel to the direct of transit 444 relative to the narrower length at the position 443 of the compliant member 110, e.g., a length in a range of from 2 to 10 mm. Without alignment, there is a broad length 447 over which droplets from openings 338 of all dies 331 are ejected in order to have at least some of droplets correspond to the position 443 of the compliant member 110. However, without such alignment, all of the fluid colors corresponding to the subpatches 446-1-N do not reach the position 443 on the absorbent wipe material 209 corresponding to the compliant member 110. As such, an ability of the compliant member 110 to press the absorbent wipe material 209 against the openings 338 of the die nozzles 337 concurrent with ejection of the droplet therefrom may be compromised by no alignment of the fluid ejection with a location on the absorbent wipe material 209.
In contrast, the lower portion of
As such, with alignment 442, ejection from the openings in all the nozzles of the dies, and pairs of dies, may reach the position 443 on the absorbent wipe material 209 corresponding to the compliant member 110. In addition, such alignment may reduce formation of the subpatches 446-1-N, e.g., corresponding to different fluid colors, formed when no alignment 441 is performed. For example, all fluid colors of droplets from the dies, and pairs of dies, may reach the position 443 on the absorbent wipe material 209 corresponding to the compliant member 110. The length of the position 443 of the compliant member 110 is shown in the lower portion of
A length 448 of the patches 445-1-1, 445-1-2, . . . , 445-3-1 on the absorbent wipe material 209 may be slightly broader than the position 443 of the compliant member 110 due to, for example, timing and/or tolerance differences between ejecting of droplets from different dies 331 and/or sequences 335 of die nozzles. However, such inaccuracies may be corrected with compensatory timing adjustments.
The processing resource 542 may include a number of central processing units (CPUs), microprocessors, and/or other hardware devices suitable for retrieval and execution of instructions stored in the MRM 544. As an alternative or in addition to retrieving and executing instructions, the processing resource 542 may include electronic circuits including a number of electronic components for performing the functionality of one or more of the instructions in the MRM 544. With respect to the executable instruction representations described and shown herein, e.g., boxes in
The processing resource 542 may execute instructions stored on the MRM 544. The MRM 544 may be any type of volatile or non-volatile memory or storage. The MRM 544 may be any electronic, magnetic, optical, or other physical storage device that stores executable instructions. Thus, MRM 544 may be, for example, Random Access Memory (RAM), an Electrically-Erasable Programmable Read-Only Memory (EEPROM), Flash memory, Read-Only Memory (ROM), a hard disk, a storage drive, an optical disc, and the like, or a combination thereof. MRM 544 may be disposed within system 540, as shown in
The MRM 544 may store instructions executable by the processing resource 542. For example, the MRM 544 may store instructions 546 to eject a droplet in a first direction from an opening in a die nozzle toward a location of an absorbent wipe material. The MRM 544 also may store instructions 548 to wipe the opening concurrently with the droplet being ejected from the opening.
In some examples, the MRM 544 may store instructions to transit the location on an adjacent surface of the absorbent wipe material past the opening concurrently with the droplet being ejected from the opening and the opening being wiped by the location. The adjacent surface may be positioned substantially perpendicular to the first direction. For example, the die nozzle may be in a die in the printhead 112 shown in
The MRM 544 may store instructions to eject the droplet from the opening concurrently with the location on the absorbent wipe material being in contact with the opening. The MRM 544 may store instructions to eject a droplet from an opening in each of a plurality of die nozzles serially on a same location of the absorbent wipe material concurrently with the opening being wiped by the same location on the absorbent wipe material. The MRM 544 may store instructions to eject a droplet serially from each of a plurality of aligned openings, e.g., where the openings may be aligned between different sequences 335 of nozzles in a same die and/or aligned between openings of nozzles in an overlap 333 between staggered dies, toward the location of the absorbent wipe material. The MRM 544 may store instructions to transit the absorbent wipe material in a direction of alignment of the plurality of aligned openings location such that the droplet from each of the plurality of aligned openings serially reaches and is serially wiped by the same location on the absorbent wipe material.
In some examples, the method 650 may include transiting the absorbent wipe material past the openings in the first and second die nozzles such that the first and second droplets serially reach the location of the absorbent wipe material. In some examples, the method 650 may include ejecting the first droplet of a first fluid color from the opening in the first die nozzle, ejecting the second droplet of a second fluid color from the opening in the second die nozzle, and transiting the absorbent wipe material past the openings in the first and second die nozzles such that the droplets of the first and second fluid colors serially reach the same location of the absorbent wipe material.
In some examples, the method 650 may include staggering a first die and a second die, e.g., dies 331-2-1 and 331-2-2 in
The present disclosure describes ejecting fluid from an opening of a die nozzle onto a location of an absorbent wipe material, e.g., a web, while concurrently wiping the opening. In this sequence, the opening may be ejecting fluid onto the location of the web while the opening is in contact with the location doing the wipe of the opening. This sequence may be repeatedly performed whereby the same location on the web has fluid ejected thereon a plurality of times, e.g., serially, followed by wiping the respective opening using the same location on the web, Results from performance of this sequence show a notable decrease in nozzle outages, e.g., from being blocked and/or misaligned, etc., relative to the openings of the nozzles being wiped first and subsequently having fluid ejected therefrom.
It is an unexpected result that ejecting more fluid onto an already wet web, as described herein, may reduce a possibility of, for example, introducing air defects into an opening of a die nozzle. The sequence described herein for wiping an opening of a die nozzle while ejecting fluid from the opening has an electrical potential being applied to the fluid ejector of the die nozzle. This may result in a substantially higher temperature during wiping of the opening than when wiping with no electrical potential being applied to the fluid ejector and ejecting fluid from the opening following the wipe. Thus, it is also an unexpected result that ejecting fluid onto the web using a heated opening of the die nozzle correlates with the reduction of air defects relative to a wipe of an opening of a die nozzle that has not been heated. In addition, wiping the heated nozzle may improve removal of dried fluid, e.g., ink, and/or binder residue from the opening and/or edges of the die nozzle and/or die.
The sequence described herein of ejecting fluid from the opening of the die nozzle onto a location of the web while concurrently wiping the opening with the location may have a number of advantages relative to other nozzle maintenance and/or clean operations. For example, the sequence may increase a usable time for the web material by wiping a plurality of times at a single location of the web. This increase in usable time for the web material may increase a serviced page count for the web, allow for increased frequency of wiping for better customer print quality, and/or enable a cost and/or size reduction for a same expectation of usable time for the web material, among other possible advantages.
By allowing for wetter wiping, the sequence described herein may contribute to a number of advantages. The sequence may help reduce a dried fluid, e.g., ink, residue that may block the openings in the nozzles, e.g., relative to wiping with a drier web. The sequence may enable thinner web materials to be used in order to be saturated more quickly with ejected fluid. The thinner web materials may be more compact and/or may allow for longer webs to be fitted into a particular implementation, which may result in a longer service time for the thinner web materials.
The sequence described herein may allow for a reduction of fluid, e.g., ink, usage during a nozzle maintenance and/or clean operation. For example, the volume of fluid used during the ejection of fluid from the opening onto the location of the web while concurrently wiping the opening with the location, as described herein, may be notably reduced, e.g., relative to implementations that wipe the opening of the die nozzle and subsequently eject droplets from the opening into a spittoon.
In the foregoing detailed description of the present disclosure, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration how examples of the disclosure may be practiced. These examples are described in sufficient detail to enable those of ordinary skill in the art to practice the examples of this disclosure, and it is to be understood that other examples may be utilized and that process, electrical, and/or structural changes may be made without departing from the scope of the present disclosure.
The figures herein follow a numbering convention in which the first digit corresponds to the drawing figure number and the remaining digits identify an element or component in the drawing. Elements shown in the various figures herein can be added, exchanged, and/or eliminated so as to provide a number of additional examples of the present disclosure. In addition, the proportion and the relative scale of the elements provided in the figures are intended to illustrate the examples of the present disclosure, and should not be taken in a limiting sense. As used herein, “a number of” an element and/or feature can be inclusive of one or a plurality of such elements and/or features, as appropriate to the context.
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/US2016/055475 | 10/5/2016 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2018/067138 | 4/12/2018 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
5103244 | Gast et al. | Apr 1992 | A |
5847727 | VanLiew et al. | Dec 1998 | A |
6017110 | Jackson | Jan 2000 | A |
6244685 | Yamada et al. | Jun 2001 | B1 |
20080024537 | Park | Jan 2008 | A1 |
20080266342 | Steinfield | Oct 2008 | A1 |
20090128593 | Jorba et al. | May 2009 | A1 |
20100283809 | Bastani et al. | Nov 2010 | A1 |
20110102500 | Miyazawa | May 2011 | A1 |
20110128321 | Sole Pons et al. | Jun 2011 | A1 |
20150158302 | Shinoto et al. | Jun 2015 | A1 |
20160023457 | Hatao | Jan 2016 | A1 |
Number | Date | Country | |
---|---|---|---|
20200031129 A1 | Jan 2020 | US |