The present invention relates to devices that bend wire into desired shapes.
Wire benders are devices that bend wire into desired 2-dimensional or 3-dimensional shapes. Early wire benders provided a mechanism that allowed a user to manually bend wire into desired shapes. See for example U.S. Pat. Nos. 4,091,845 and 5,809,824. More recently, motorized wire benders have been developed that use a moving pin under motor control to bend wire, some even operating under computer control. See for example U.S. Pat. No. 5,088,310. Drawbacks of such devices, however, include excessive expense, complexity and size. Additionally, such devices are difficult to set up and operate for each desired wire shape.
There is a need for a wire bender device design that is simple and relatively inexpensive and easy to operate, so that wire shapes can be effectively and efficiently created.
The aforementioned problems and needs are addressed by a wire bending device that includes a housing have a top plate, wherein the top plate includes a curved slot, a first pair of opposing wheels positioned over the top plate for feeding wire, and a bend head. The bend head includes an aperture configured to pass the wire fed from the first pair of opposing wheels, and first and second bend surfaces positioned adjacent to the curved slot and the aperture. A cam member is disposed below the top plate, wherein the cam member includes a first vertically sloping cam surface, and a second vertically sloping cam surface. A rotatable pulley is disposed between the cam member and the top plate, and includes first and second holes. A first pin has a first end slidably engaged with the first cam surface, a middle portion extending through the first hole, and a second end. A second pin has a first end slidably engaged with the second cam surface, a middle portion extending through the second hole, and a second end. A motor is configured to rotate the pulley in opposing first and second rotational directions. The pulley rotating in the first rotational direction causes the first pin first end to slide along the first cam surface so that the first pin second end rises vertically through the curved slot and then travels along the curved slot for engaging with and bending the wire passing through the aperture against the first bend surface. The pulley rotating in the second rotational direction causes the second pin first end to slide along the second cam surface so that second pin second end rises vertically through the curved slot and then travels along the curved slot for engaging with and bending the wire passing through the aperture against the second bend surface.
Other objects and features of the present invention will become apparent by a review of the specification, claims and appended figures.
The present invention is a desktop sized wire bender that converts drawn curves into bent wire having 2-dimensional or 3-dimensional shapes. The wire bender 1 is shown in
The top plate 12 serves as a work surface on which the wire manipulation components are positioned. These components include two pairs of feed wheels, with each pair including two wheels 14a and 14b that pinch and manipulate the wire fed therebetween. Wire guides 16 are aligned with the gap between the feed wheels 14a and 14b, and include apertures 18 through which the wire can be fed (to guide the wire in the proper direction).
A bend head 20 is aligned with the wire guides 16. The bend head 20 is better shown in
Pin 28 travels (translates) in an arch shape path, as best shown in
Starting at a first end 30a of the slot 30, the pin 28 travels along slot 30 until it engages and pushes on wire 26 (wrapping the wire around bend surface 24a) until the desired bend shape is achieved in the wire. At that point, pin 28 retreats partially or fully back to the first slot end 30a, whereby the wire is advanced to the next target location of the wire to be bent. To implement bends in the opposite direction, a second pin 32 begins at the second end 30b of the slot 30, and travels along slot 30 until it engages and pushes on wire 26 (wrapping the wire around bend surface 24b) until the desired bend shape is achieved in the wire. At that point, pin 32 retreats partially or fully back to the second slot end 30b. Pins 28 and 32 are a fixed distance apart in slot 30, and rotate together during operation. As pin 28 approaches the first end 30a of the slot, pin 28 retracts below the surface of top plate 12 so as to not interfere with the operation of second pin 32. Likewise, as pin 32 approaches the second end 30b of the slot, pin 32 retracts below the surface of top plate 12 so as to not interfere with the operation of first pin 28.
Pins 28 and 32 are spaced apart by a fixed distance, and translate in the arced path clockwise and counterclockwise together. As the pins move clockwise, pin 28 drops vertically as its flange 42 slides along the dropping track 36, while pin 32 rises vertically as its flange 44 slides along rising track 38. The opposite occurs as the pins move in the counterclockwise direction. Therefore, starting with the positioning in
Also shown in
Referring back to
Feed wheels 14b are preferably mounted on a spring loaded plate 67 relative to feed wheels 14a. As shown in
The wire bender 1 is preferably operated under the control of a microprocessor 72 located inside housing 10. Alternately and/or additionally, an external computer or controller can be used to control the operation of the wire bender 1. Software running on the microprocessor 72 and/or external computer or controller can provide the user the ability to control the wire bender 1 without complex coding or programming using a convenient user interface screen. An exemplary user interface screen 80 is illustrated in
The interface includes a calibration screen 86 (see
It is to be understood that the present invention is not limited to the embodiment(s) described above and illustrated herein, but encompasses any and all variations falling within the scope of the appended claims. For example, references to the present invention herein are not intended to limit the scope of any claim or claim term, but instead merely make reference to one or more features that may be covered by one or more of the claims. Materials, processes and numerical examples described above are exemplary only, and should not be deemed to limit the claims.
Hardware, software and/or firmware can be used to implement any of the logic steps and/or processes discussed above. It should further be appreciated that such logic steps or processes can be implemented as computer-executable instructions stored on a non-transitory computer readable medium, such a CD or DVD (including re-writable CDs and DVDs), flash or other non-volatile memory, ROM, EEPROM, disc drive, solid state drive, etc. When the program code is loaded into and executed by a machine, such as a computer or dedicated processer, the machine becomes an apparatus for practicing the invention. The present invention can also be embodied in the form of program code, for example, whether stored in a storage medium, loaded into and/or executed by a machine, or transmitted over some transmission medium, such as over electrical wiring or cabling, through fiber optics, or via electromagnetic radiation, wherein, when the program code is loaded into and executed by a machine, such as a computer or processor, the machine becomes an apparatus for practicing the invention. When implemented on a general-purpose processor, the program code segments combine with the processor to provide a unique device that operates analogously to specific logic circuits.
It should be noted that, as used herein, the terms “over” and “on” both inclusively include “directly on” (no intermediate materials, elements or space disposed therebetween) and “indirectly on” (intermediate materials, elements or space disposed therebetween). Likewise, the term “adjacent” includes “directly adjacent” (no intermediate materials, elements or space disposed therebetween) and “indirectly adjacent” (intermediate materials, elements or space disposed there between), “mounted to” includes “directly mounted to” (no intermediate materials, elements or space disposed there between) and “indirectly mounted to” (intermediate materials, elements or spaced disposed there between), and “electrically coupled” includes “directly electrically coupled to” (no intermediate materials or elements there between that electrically connect the elements together) and “indirectly electrically coupled to” (intermediate materials or elements there between that electrically connect the elements together). For example, forming an element “over a substrate” can include forming the element directly on the substrate with no intermediate materials/elements therebetween, as well as forming the element indirectly on the substrate with one or more intermediate materials/elements therebetween.
This application claims the benefit of U.S. Provisional Application No. 62/057,935, filed on Sep. 30, 2014 and PCT Patent Application No. US2015/053197 filed on Sep. 30, 2015, which are incorporated herein by reference.
Filing Document | Filing Date | Country | Kind |
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PCT/US2015/053197 | 9/30/2015 | WO | 00 |
Number | Date | Country | |
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62057935 | Sep 2014 | US |