TREA

Wire bonding ceramic capillary

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Information

  • Patent Grant
  • D771168
  • Patent Number
    D771,168
  • Date Filed
    Friday, October 31, 2014
    11 years ago
  • Date Issued
    Tuesday, November 8, 2016
    9 years ago
  • US Classifications
    Field of Search
    • US
    • D15 144
    • D15 1442
    • D15 199
    • D08 30
    • D19 66
    • D19 200
    • 228 004500
    • 228 001100
    • 228 180500
    • CPC
    • B23K20/004
    • B23K20/005
    • B23K20/106
  • International Classifications
    • 1509
    • Term of Grant
      14Years
Information
Abstract
Description


FIG. 1 depicts a first perspective view of a wire bonding ceramic capillary.



FIG. 2 depicts a second perspective view thereof;



FIG. 3 depicts a top plan view thereof;



FIG. 4 depicts a side elevation view thereof; and,



FIG. 5 depicts a bottom plan view thereof.


The broken lines in the drawings illustrate environmental structure on the article and form no part of the claimed design.


Claims
  • The ornamental design for a wire bonding ceramic capillary, as shown and described.
US Referenced Citations (42)
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Foreign Referenced Citations (13)
Number Date Country
S62190343 Dec 1987 JP
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2014222729 Nov 2014 JP
201412448 Apr 2014 TW
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201429601 Aug 2014 TW
Non-Patent Literature Citations (20)
Entry
Office Action dated Oct. 6, 2015, issued in Japanese Design Application No. 2015-9731.
Search Report issued on Dec. 7, 2015 in Taiwanese Design Patent Application No. 104302295 (English Translation provided).
Decision of Grant issued on Jan. 26, 2016 in Japanese Design Application No. 2015-21935 with a listing of references considered.
Gaiser Precision Bonding Tools “Capillary Wire Bonding”, pp. 5-27, located at http://www.coorstek.com/markets/semiconductors—equipment/bonding-tools/capillaries.php, catalog published 2006.
Gaiser Precision Bonding Tools “Thermosonic Capillaries”, pp. 28-40, located at http://www.coorstek.com/markets/semiconductors—equipment/bonding-tools/capillaries.php, catalog published 2006.
Gaiser Precision Bonding Tools “Fine-Ptich Capillaries”, pp. 41-59, located at http://www.coorstek.com/markets/semiconductors—equipment/bonding-tools/capillaries.php, catalog published 2006.
Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304081 (English translation).
Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304080 (English translation).
Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304143 (English translation).
Information about Other Patent Applications, see section 6 of the accompanying Information Disclosure Statement Letter, which concerns Other Patent Applications.
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016867.
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016912.
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-017097.
Decision to Grant dated Apr. 19, 2016 issued in Japanese Patent Application No. 2016-008039.
Search Report dated May 13, 2016 issued in Taiwan Application No. 104305492.
Search Report issued in Taiwan Design Patent Application No. 105302375, dated Jul. 12, 2016.
Search Report issued in Taiwan Design Patent Application No. 105302376, dated Jul. 12, 2016.
Search Report issued in Taiwan Design Patent Application No. 105302377, dated Jul. 12, 2016.
Decision to Grant dated Aug. 23, 2016 issued in Japanese Patent Application No. 2016-008037.
Decision to Grant dated Aug. 23, 2016 issued in Japanese Patent Application No. 2016-008038.