The broken lines in the figures depict portions of the wire bonding wedge tool that form no part of the claimed design.
The broken lines in the figures depict portions of the wire bonding wedge tool that form no part of the claimed design.
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Entry |
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Search Report issued on Dec. 7, 2015 in Taiwanese Design Patent Application No. 104302295 (English Translation provided). |
Decision of Grant issued on Jan. 26, 2016 in Japanese Design Application No. 2015-21935. |
Office Action dated Oct. 6, 2015, issued in Japanese Design Application No. 2015-9731. |