Wire bundle support platform

Information

  • Patent Grant
  • D573325
  • Patent Number
    D573,325
  • Date Filed
    Friday, February 1, 2008
    17 years ago
  • Date Issued
    Tuesday, July 15, 2008
    16 years ago
  • US Classifications
    Field of Search
    • US
    • D34 38
    • D09 456
    • 108 051110
    • 108 051300
    • 108 055300
    • 108 056100
    • 108 057100
    • 248 346020
    • 211 059400
    • 206 391000
  • International Classifications
    • 0908
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a perspective view showing the front, top and right sides of a wire bundle support platform embodying the new design;



FIG. 2 is a front elevation view thereof;



FIG. 3 is a rear elevation view thereof;



FIG. 4 is a right side elevation view thereof, the left side being a mirror image of the right side as shown;



FIG. 5 is a top plan view thereof; and,



FIG. 6 is a bottom plan view thereof.


Claims
  • The ornamental design for a wire bundle support platform, as shown.
US Referenced Citations (13)
Number Name Date Kind
2849027 Tetyak Aug 1958 A
3507415 Mankey Apr 1970 A
4382733 Rodgers May 1983 A
D345845 Strzegowski, Jr. Apr 1994 S
5307931 Gillispie et al. May 1994 A
5413052 Breezer et al. May 1995 A
D381180 Schueneman et al. Jul 1997 S
5669315 Model Sep 1997 A
5788933 Peddicord Aug 1998 A
D432284 Lux, Jr. Oct 2000 S
6823803 Preisler Nov 2004 B2
D511404 O'Dell et al. Nov 2005 S
D532179 Guidroz Nov 2006 S
Divisions (1)
Number Date Country
Parent 29256052 Mar 2006 US
Child 29303138 US