Wire bundling support

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Information

Patent Grant
D425779

References
Source

Patent Number
D425,779
Date Filed
Tuesday, June 29, 1999
25 years ago
Date Issued
Tuesday, May 30, 2000
24 years ago

Inventors
- Toshinobu Nakamura
Original Assignees
- Shinagawa Shoko Co., Ltd.
Examiners
- Baynham; Holly
Agents
- Frishauf, Holtz, Goodman, Langer & Chick, P.C.

US Classifications
- D08 - Tools and hardware
Field of Search
- US
- D08 356
- 024 16 PB
- 248 681
- 248 56
- 248 744
International Classifications
- 0805
- Term of Grant
  14Years

Information

Abstract

Description

Claims

The ornamental design for a wire bundling support device, as shown and described.

US Referenced Citations (2)

Number	Name	Date	Kind
3516631	Santucci	Jun 1970
4609171	Matsui	Sep 1986