The present disclosure claims priority to and the benefit of Chinese Patent Application No. 202211053021.0 filed on Aug. 31, 2022, the disclosure of which is incorporated herein by reference in its entirety.
The present disclosure relates to the field of crystal rod slicing processing technologies, and more particularly to a wire net monitoring device and a monitoring system provided with the monitoring device.
The wire net state is one of the main conditions for the success of wafer processing. Due to the influence of wire net and wire bow, abnormal situations such as wire jumping or paralleling may occur during the slicing process. However, the wire jumping or paralleling may cause the wire net to be disconnected. If the wire net state is only monitored when the slicing is stopped, the abnormal state of the wire net may be enlarged. The abnormal state of the wire net cannot be known until the wire net is disconnected, which may lead to more waste chips, more waste wires of the wire net, and longer downtime. In addition, during the slicing process, a slicing room is in a closed dark state, and water mist is relatively large, therefore, it is difficult to continuously track and monitor the state of the wire net.
The present disclosure provides a wire net monitoring device and a monitoring system provided with the monitoring device, which solves the technical problem in the prior art that a state of the wire net cannot be continuously monitored in a sliced state.
In order to solve at least one of the above-mentioned technical problems, the technical solution adopted in the present disclosure is as follows.
A wire net monitoring device includes at least one monitor configured to monitor at least one wire net, a signal route of the at least one monitor is configured to monitor the at least one wire net near a side of a workpiece along a rotation direction of the at least one wire net, and the signal route of the at least one monitor crosses a contact surface between the at least one wire net and the workpiece.
In some embodiment of the present disclosure an included angle between the signal route of the at least one monitor and the contact surface between the at least one wire net and the workpiece is not greater than 90 degrees and not less than 20 degrees.
In some embodiment of the present disclosure, an included angle between the signal route of the at least one monitor and the contact surface between the at least one wire net and the workpiece is not greater than 45 degrees.
In some embodiment of the present disclosure, the at least one monitor is disposed on two sides of the workpiece and disposed opposite to each other, and the at least one monitor is configured to monitor a state of the at least one wire net on a corresponding side.
In some embodiment of the present disclosure, the wire net monitoring device includes a housing and an adjustment rod, wherein:
In some embodiment of the present disclosure, at least the housing toward which an emission port of the at least one monitor faces is set as a transparent surface;
In some embodiment of the present disclosure, the adjustment rod is suspended from a top of the housing and is located on a side of the housing away from the transparent surface.
In some embodiment of the present disclosure, a lower end of the adjustment rod is connected to a boss disposed on a top of the housing, and an end of the adjustment rod connected to the boss is configured as an arc surface structure.
In some embodiment of the present disclosure, arc holes arranged up and down opposite to each other are provided on the boss, and an arc of one of the arc holes matches an arc of an arc surface of the adjustment rod.
A monitoring system includes any one of the above the wire net monitoring devices.
The wire net monitoring device designed by the present disclosure can directly monitor the state of the wire net during the slicing process. The emission port of the monitor is oriented in the same direction as the rotation direction of the wire net, so that the wire net state can be monitored efficiently, accurately, and continuously in real time. This can comprehensively obtain abnormal basic data of the wire net, intervene in time, and avoid quality accidents. The present disclosure also proposes a monitoring system provided with the monitoring device.
In the drawings:
The present disclosure will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
This embodiment proposes a wire net monitoring device 10, which is mainly configured to monitor a working state of the wire net 30 when a workpiece 20 is processed by multi-wire cutting. The structure of the wire net monitoring device 10 is shown in
Further, the emission port of the monitor 11 monitors the wire net 30 on the side close to the workpiece 20 along the rotation direction of the wire net 30. That is, the monitor 11 moves along a longitudinal direction of the workpiece 20 and is arranged on one side in the direction in which the wire net 30 rotates. As shown in
Further, the included angle α between the signal route of the monitor 11 and the contact surface between the wire net 30 and the workpiece 20 is not greater than 90 degrees and not less than 20 degrees. The signal route of the monitor 11 can be arranged perpendicular to the contact surface between the wire net 30 and the workpiece 20 or can be arranged at an acute angle with the contact surface between the wire net 30 and the workpiece 20, so that the signal route of the monitor 11 cannot be interfered. If the included angle α is greater than 90 degrees, the signal route of the monitor 11 needs to be irradiated obliquely from the side of the workpiece 20 outward. This is not only detrimental to the installation of the wire net monitoring device 10, but also the workpiece 20 may block the irradiation of the signal route. Moreover, the position of the wire net 30 monitored by the monitor 11 is far away from the side where the workpiece 20 is located, so that the state of the wire net 30 cannot be accurately monitored. Since the monitor 11 is far away from the position of the workpiece 20, the measured result is not a bow value when the wire net 30 is jumped or paralleled, and even when a wire is broken, it is not easy to be observed. If the included angle α is less than 20 degrees, the signal route of the monitor 11 may be placed close to the contact surface between the wire net 30 and the workpiece 20. The monitor 11 monitors that the area of the wire net 30 is limited, and the measured bow value is not the maximum bow value in each area. This is not conducive to the observation of the state of the wire net 30. In addition, since a cooling mechanism (not shown in the figure) for cleaning the wire net 30 is provided on both sides of the workpiece 20, its location also affects the irradiation of the wire net monitoring device 10. Preferably, the included angle α between the signal route of the monitor 11 and the contact surface between the wire net 30 and the workpiece 20 is not greater than 45 degrees. This not only monitors a wide area of radiation, but also may not be interfered by other institutions. This monitors the bow value of each area in the wire net 30 more accurately and stably.
Further, the wire net monitoring device 10 can monitor the state of the wire net 30 on one side of the workpiece 20, as shown in
Preferably, the monitors 11 are arranged on both sides of the workpiece and disposed opposite to each other. The monitors 11 monitor the state of the wire net 30 on the corresponding side when the wire net 30 switches between forward rotation and counter rotation. That is, the monitor 11 on the left only monitors the state of the wire net 30 when it rotates in the forward direction. The monitor 11 on the right only monitors the state of the wire net 30 during counter rotation. In addition, the counter-rotating wire net 30 is counter-rotating relative to the signal path of the monitor 11 on the right. The silicon mud and cutting fluid can be kept away from the monitor 11 on the right side along its direction of rotation, thereby ensuring the accuracy of the monitor 11 monitoring the wire net 30.
Further, the monitor 11 is a sensor capable of detecting and identifying the position and height of the wire net 30, which may be a laser sensor. This type of monitor 11 continuously and uninterruptedly monitors the position of the wire net 30 in each area. Especially in the slicing room where the light is dark during slicing, the position detection of the wire net 30 can be completed without being affected by the amount of water mist. The monitor 11 can be fixed at a certain position to detect the wire net 30 and can also move back and forth along the length direction of the wire net 30 to detect the wire net 30.
Taking the monitor 11 as a laser sensor as an example, during operation, the monitor 11 can detect position information of the wire net 30 in each wire groove through laser pulses during the slicing process. The transmitted signal is transmitted to the reflective object wire net 30 and then reflected back to the monitor 11 by the wire net 30, and then the detection signal of the wire net 30 in each wire groove can be collected. The monitor 11 then transmits the detection signal to an external central unit for analysis and processing (not shown in the figure) for processing, so as to convert the collected detection signal into a digital signal, l, and then analyze and optimize to obtain a curve image that can be used to characterize the state of the wire net. Therefore, the graph of time-bow value and the graph of area-bow value can be visually monitored. Such drawings can be converted based on the obtained test data, and the graphs of each graph are omitted here. From the graph, it can be directly determined whether the state of the wire net 30 is normal, that is, whether there are abnormal problems such as wire jumping, paralleling or disconnection, etc., which is effective and covers the whole process. Of course, when the cutting feed reaches the preset threshold, the monitor 11 can still detect the bows of all the cutting wires in the wire net 30. The formed bow curve diagram is compared with the bow curve diagram during standard through-cutting, and it can also be determined whether the workpiece 20 has been cut through. In this way, the risk of misjudgment or missed judgment caused by monitoring the wire net by taking pictures with a camera in the prior art can be avoided. Further, it is not affected by the light intensity, not only has strong practical effect but also has high judgment accuracy and can monitor the working state of the wire net 30 in real time.
Further, the housing 12 is a flat structure, which is adapted to the structure of the monitor 11. On the top of the housing 12 there is also an adjustment rod 14 configured to adjust the direction of the light beam of the monitor 11. The monitor 11 is built in the housing 12 and fixedly connected with the housing 12. The adjustment rod 14 is placed outside the top of the housing 12 and is hinged to a boss 15 on the top of the housing 12.
In the housing 12, except that the emission port close to the monitor 11 is set as a transparent structure, other wall surfaces may also be set as transparent structures or non-transparent structures. The housing 12 is a closed structure, which not only prevents dust and water, but also prevents cleaning liquid from accumulating into it. The housing 12 can be made of materials with high temperature resistance, moisture resistance and electrical interference resistance.
Further, at least the housing 12 facing the emission port of the monitor 11 is set as a transparent surface 13. Preferably, the transparent surface 13 is arranged perpendicular to the contact surface between the wire net 30 and the workpiece 20. This facilitates the cleaning mechanism disposed opposite to the transparent surface 13 to directly clean the transparent surface 13 of the housing 12, so as to quickly clean the cutting fluid or silicon mud adhering to the transparent surface 13. This makes the water liquid after cleaning to be blown dry quickly, completes the drying of the outer wall surface of the transparent surface 13, thereby ensuring the cleaning effect of the environment of the monitor 11 when it is working.
Further, the adjustment rod 14 is suspended from the top of the housing 12 and is located on a side of the housing 12 away from the transparent surface 13. The arc surface of the adjustment rod 14 is configured along the length direction of the top of the housing 12 and abuts against the top of the housing 12. This controls the housing 12 to rotate along the arc surface end of the adjustment rod 14 with a connection point between the adjustment rod 14 and the boss 15 as the center of the circle, so as to adjust the position of the housing 12 so that the emission port of the monitor 11 is tilted toward the wire net or vertically configured.
Further, the lower end of the adjustment rod 14 is connected to the boss 15 arranged on the top of the housing 12. One end of the adjustment rod 14 connected to the boss 15 is configured as an arc surface structure, and the other end is arranged vertically and connected with other fixed blocks. The connection point between the adjustment rod 14 and the boss 15 is located at the end of the housing 11 away from the emission port of the monitor 11. The boss 15 is hinged to the adjustment rod 14. The end of the adjustment rod 14 close to the housing 12 has a circular arc surface structure, which can facilitate the adjustment of the position angle of the housing 12 relative to the wire net 30 to adjust the positions of the emission port and the receiving port of the monitor 11. After the adjustment of the monitor 11 is completed, the adjustment rod 14 is connected to the boss 15 through a screw rod, so that the position angle of the monitor 11 relative to the wire net 30 is adjusted, and the monitor 11 is completely fixed in the housing 12.
As shown in
A monitoring system is provided with the wire net monitoring device 10 described in any one of the above.
The wire net monitoring device designed by the present disclosure can directly monitor the state of the wire net during the slicing process. The emission port of the monitor is oriented in the same direction as the rotation direction of the wire net, so that the wire net state can be monitored efficiently, accurately, and continuously in real time. This can comprehensively obtain abnormal basic data of the wire net, intervene in time, and avoid quality accidents. The present disclosure also proposes a monitoring system provided with the monitoring device.
The embodiments of the present disclosure have been described in detail above. The content described is only a preferred embodiment of the present disclosure and cannot be considered as limiting the implementation scope of the present disclosure. All equal changes and improvements made according to the claims of the present disclosure should still belong to the scope covered by the present disclosure.
Number | Date | Country | Kind |
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202211053021.0 | Aug 2022 | CN | national |
Filing Document | Filing Date | Country | Kind |
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PCT/CN2023/110410 | 7/31/2023 | WO |