The present invention relates to the field of terminals, more specifically to the field of terminals that can be mounted on a circuit board.
Terminals have been provided for connecting to circuit boards. The designs can be configured to be soldered or press-fit into vias provided in the board. For applications where robustness has greater value, the designs tend to be focused more on terminal designs that can be soldered to the circuit board. Two basic designs are possible, one that is provided with a housing, and one that is provided without a housing. A housing provides a number of benefits but tends to be more costly. Consequentially, certain applications might be better served by a terminal-only design. Existing designs, however, tend to not provide a low profile. Thus, certain individuals would appreciate further improvements to terminal design and wire to board connectors.
A terminal is disclosed that can be secured to wire that is composed of an insulation layer wrapped around a conductor and the terminal includes a first crimp portion and a second crimp portion. The first crimp portion is configured to engage the insulation layer and the conductor. The second crimp portion is configured to engage the conductor with the insulation layer removed. The first and second crimps can each include a pair of wings that are folded toward each other so that, when the terminal is secured to the wire, the wings securely grip the corresponding regions of the wire. Two legs are positioned between the first and second crimp portions with individual legs positioned on opposite sides of the terminal or both legs positioned on the same side of the terminal. The legs are configured to be soldered to a circuit board and include tails that can be configured with eye-of-the-needle construction or any other convention tail construction that is desirable for soldering to the circuit board. Thus, a wire can be electrically connected to the circuit board in a low-profile manner.
The present invention is illustrated by way of example and not limited in the accompanying figures in which like reference numerals indicate similar elements and in which:
The detailed description that follows describes exemplary embodiments and is not intended to be limited to the expressly disclosed combination(s). Therefore, unless otherwise noted, features disclosed herein may be combined together to form additional combinations that were not otherwise shown for purposes of brevity.
The terminal includes a variety of benefits, as can be appreciated from the attached figures. As shown in
As best shown in
One benefit of the design is that the crimp 30 engages the insulation layer, which provides additional structural benefits as the combination of the insulation layer 58 and the conductor 55 is stronger than the conductor 55 by itself. Another benefit of the depicted design is that the two legs 40 engage the circuit board 5 between the first crimp 20 and the second crimp 30, thus helping to ensure external forces applied to the wire do not materially impact the first crimp 20 (thus helping to protect the electrical connection between the wire and the terminal). The balanced construction of the two tails 40 on opposite sides of the base 15 further helps distribute forces to the circuit board, which is expected in practice to help protect the connection between the terminal 10 and the supporting circuit board 5. In an embodiment, the terminal 10 can be configured so that the second crimp 30 is seated directly on the circuit board 5 while the first crimp 20 is positioned slightly above the circuit board 5.
As can be appreciated the legs 40 have tails 44 that extend in a direction A that is substantially perpendicular to a direction B, defined by the surface of the circuit board as illustrated in
It should be noted that the base 15 can be configured so that the second crimp 30 is positioned directly on the circuit board while the first crimp 20 is elevated with respect to the board. Using the circuit board 5 to provide further support for the terminal 10 is expected to help further ensure the terminal 10 is not inadvertently removed from the circuit board 5. Thus, the base 15 can provide a level from which the first and second crimps extend, however the larger size of the second crimp 30, along with the depicted orientation of the legs 40, will cause it contact a supporting circuit board first and will help provide additional support for the terminal. Thus, the depicted embodiment allows a wire to be electrically connected to a supporting circuit board in a low-profile manner.
Essentially, as depicted in
As previous stated, the terminal 110 provides a low profile arrangement to minimize the height the terminal 110 extending from the circuit board. As depicted, the terminal maintains a low profile configuration, and also when in operation, upon mounting to a circuit board maintains a close spacing between terminals when arranged in a side-by-side array. As best shown in
The disclosure provided herein describes features in terms of preferred and exemplary embodiments thereof. Numerous other embodiments, modifications and variations within the scope and spirit of the appended claims will occur to persons of ordinary skill in the art from a review of this disclosure.
This application claims priority to U.S. patent application Ser. No. 14/443,682, filed May 19, 2015, which is a national phase of International Patent Application No. PCT/US2013/072012, filed Nov. 26, 2013, which, in turn, claims priority to each of U.S. Provisional Application No. 61/730,385, filed Nov. 27, 2012 and U.S. Provisional Application No. 61/825,666, filed May 21, 2013. All of the foregoing applications are incorporated herein by reference in their entirety.
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Number | Date | Country |
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10-2010-0011827 | Feb 2010 | KR |
M356307 | May 2009 | TW |
Number | Date | Country | |
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20160233599 A1 | Aug 2016 | US |
Number | Date | Country | |
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61730385 | Nov 2012 | US | |
61825666 | May 2013 | US |
Number | Date | Country | |
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Parent | 14443682 | US | |
Child | 15132370 | US |