Embodiments of the invention relate to the field of wireless power transfer; and more specifically, to designs and systems for capacitive power transfer using LCL-compensated topology and LC-compensated topology.
Inductive power transfer (IPT) has been widely applied in the charging of portable devices and electric vehicles, for example. The efficiency of an IPT system from the direct current (dc) source to the dc load has reached 96% with 7 kW output power, which is already comparable to that of the traditional plug-in charger. However, the drawback of IPT technology lies in its sensitivity to conductive objects, such as metal debris in the air-gap. The magnetic fields generate eddy current losses in the metals nearby the system, causing significant temperature increase, which is dangerous in practice.
Capacitive power transfer (CPT) technology is an alternative solution to replace the IPT system. It utilizes electric fields to transfer power, instead of magnetic fields. The electric fields can pass through metal barriers without generating significant power losses. Therefore, the CPT technology is suitable for the electric vehicle charging application, for example.
Another advantage of the CPT system is its low cost. In CPT systems, metal plates are used to form capacitors to transfer power, while in IPT systems, the coils are made of expensive Litz-wire. The aluminum plate is a cost-efficient option, which additionally has good conductivity and low weight.
However, most of the traditional CPT systems focus on low power or very short distance applications. In particular, the transferred distance is usually around 1 mm, which is far less than the ground clearance of electric vehicles, limiting the application of CPT technology for certain applications.
This limitation of current CPT systems comes from the circuit topologies working with the coupling capacitors, which are classified into two categories: non-resonant and resonant topologies. The non-resonant topology is a PWM converter, such as the SEPIC converter. The coupling capacitors work as power storage components to smooth the power in the circuit. Therefore, it requires large capacitances, usually in the 10's of nF range, and the transferred distance is less than 1 mm. The resonant topologies include the series resonance converter and the class-E converter, in which the coupling capacitors resonate with the inductors in the compensation circuit. The benefit is that the coupling capacitance can be reduced as long as the resonant inductance or switching frequency is high enough. However, the inductance is limited by its self-resonant frequency and the switching frequency is limited by the efficiency and power capability of the converter. Another problem is that the resonant topology is sensitive to the parameter variations caused by misalignment, which is not acceptable in some critical applications. All these topologies require either too large capacitance or too high switching frequency, which is difficult to realize. Therefore, better circuit topologies are desirable for the CPT system.
The double-sided LCLC-compensated circuit has been proposed for high power and large air gap applications. The transferred distance is 150 mm and the output power reaches 2.4 kW with an efficiency of 91%. Although the coupling capacitor is around 10's of pF, there is a 100 pF capacitor connected in parallel with the coupling plates, which reduces the resonant inductor to 100's of μH and the switching frequency to 1 MHz. Therefore, the resonances are not affected by parameter variations and misalignments. However, there are eight external components in the compensation network that increase the complexity of the system and are difficult to construct. Also, the two pairs of plates are horizontally separated by 500 mm to eliminate the coupling between the adjacent plates. Therefore, the plates take more space than is often desired.
As disclosed herein, a wireless power transfer system is described, including a vertical pair of an inner and an outer coupling capacitors. One plate from each of the outer coupling capacitor at least in part overlaps one plate of the inner coupling capacitor on a primary side and another plate from the outer coupling capacitor at least partially overlaps another plate of the inner coupling capacitor on a secondary side. Each plate of the outer coupling capacitor has a larger area than each plate of the inner coupling capacitor, and a distance between the primary and secondary sides is larger than distances between the plates of the inner and outer coupling capacitors on each of the primary and secondary sides, respective. According to certain embodiments, a power transfer unit is included and configured to transfer power capacitively through the vertical pair of coupling capacitors.
Another embodiment of the present disclosure is directed to a wireless power transfer system as described above, where a power transfer unit is configured to transfer power capacitively through the vertical pair of coupling capacitors, and the power transfer unit includes first and second inductors coupled to each plate of the outer coupling capacitor, respectively.
Various other features and advantages will become obvious to one of ordinary skill in the art in light of the following detailed description and drawings.
The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the disclosure, and together with the description serve to explain the principles of the disclosure.
In the following description, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In other instances, well-known circuits, structures and techniques have not been shown in detail in order not to obscure the understanding of this description. Those of ordinary skill in the art, with the included descriptions, will be able to implement appropriate functionality without undue experimentation.
References in the specification to “one embodiment,” “an embodiment,” “an example embodiment,” etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to implement such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
In the following description and claims, the terms “coupled” and “connected,” along with their derivatives, may be used. It should be understood that these terms are not intended as synonyms for each other. “Coupled” is used to indicate that two or more elements, which may or may not be in direct physical or electrical contact with each other, co-operate or interact with each other. “Connected” is used to indicate the establishment of communication between two or more elements that are coupled with each other.
The embodiments set forth below represent information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure.
Embodiments described herein disclose a compact 4-plate structure for high power CPT applications. In this structure, all the plates are vertically arranged to save space, as shown in
Plate Structure
According to an exemplary embodiment, one principle may be to maintain the area of the plates to transfer sufficient power. The length of P1 and P3 is l1, the length of P2 and P3 is l2, the distance of P1-P2 and P3-P4 is dc, and the distance of P2-P4 is d, which is the air gap between the primary and secondary side. The thickness of all the plates is the same in the depicted example, for simplicity.
For the horizontal structure, the rotary misalignment, which is the mismatch between the primary and secondary plates, can reduce the output power. However, in the depicted vertical structure, the rotation in the horizontal plane does not cause much mismatch, and the coupling capacitors remain nearly unchanged. Also, the asymmetric structure reduces the voltage stress on the large plate, compared to the small one.
Circuit Model of the Plates
There is coupling capacitance between each two plates, as shown in
In
where I1 and I2 are the current injected into the plates from the primary and secondary sides, respectively, ω=πfsw and fsw is the frequency of the input and output ac sources.
The plates are modeled as a two-port network with V1, V2 as the input and I1, I2 as the output variables. There are four equations in (1), and any three of them are independent. The relationship between voltage and current can be derived from the equations in (1). Considering the first two equations in (1), VP3 and VP4 can be eliminated, as shown in (2).
Since V1=VP1 and V2=VP3−Vp4, the relationship between V1, I1, and V2 can be expressed as,
Similarly, using the other two equations in (1), the relationship between V2, I2, and V1 can be expressed as:
From (3) and (4), the capacitances C1, C2, and CM can be defined as:
Therefore, (3) and (4) can be rewritten as:
Move I1 and I2 to the left-hand side, and the relationship between the current and voltage is shown as (7).
According to (7), the simplified equivalent model of coupling capacitors with behavior sources is shown in
Equation (7) is further written as (8). Then, the equivalent model of the capacitors is simplified to a π shape, as shown in
Similar to that of the coils, the capacitive coupling coefficient kc of the plates is defined with the parameters from (5), as shown in (9).
From the simplified model in
For the vertical structure shown in
Since the plates work as a single capacitor to resonate with the inductor in the circuit, it is important to calculate the equivalent input capacitances of the plates.
The transfer function between the input and output voltage is also an important parameter to determine the amount of transferred power. The voltage transfer function from the primary to the secondary side is defined as H1,2 and the voltage transfer function from the secondary to the primary is defined as H2,1. They can be expressed as in (11).
The plate model in
Using equation (1), the voltage between P1 and P3 is expressed as (13).
Exemplary Plate Dimensions Design
Using the circuit model of the plates, the dimensions of the plates can be determined for the electric vehicle charging application, as an exemplary embodiment. The purpose of dimension design is to calculate all the capacitances in (5) and analyze the behavior of the plates. Since the plate structure is designed to be symmetric from the primary to the secondary side, C is defined as C=C1=C2.
Considering the space limitation, the length l1 of P1 and P3 could be set to 914 mm, for example. The air gap can be set to be 150 mm, for example. Therefore, there are only two parameters, dc and l2, that need to be designed. The plate ratio rp is defined as rp=l2/l1.
Since the cross coupling is usually small, it can be neglected at the beginning stage of plates design. The empirical formula of parallel plates can be used to estimate the capacitance based on the system dimensions to accelerate the design process. This estimation can provide a reasonable range of the dimensions. Then, the finite element analysis (FEA) by Maxwell can be used to accurately determine the final dimensions and the corresponding circuit model of the plates.
The FEA simulation provides a capacitance matrix with all the six mutual capacitors in
According to certain embodiments, the self-capacitance should be large enough to reduce the inductor's value and volume. At the same time, the coupling coefficient should be large enough to maintain the system power as well. Therefore, considering
The misalignment ability of the plates is also analyzed in Maxwell. When there is a rotation of the secondary plates in the horizontal plane as shown in
Double-Sided LCL Compensation Topology
A double-sided LCL compensation circuit may be implemented to work with the plates, as shown in
In one embodiment, Lf1 and Cf1 work as a low-pass filter at the front end. Similarly, Lf2 and Cf2 work as a low-pass filter at the back end. Therefore, there is no high-order harmonics current injected into the plates. The fundamental harmonics approximation (FHA) method is used to analyze the working principle of the system.
The output current depends on the input voltage. Since Lf1 and L2 are treated as open circuit, VCf1=Vin, VCf2=V2. The transfer function between the primary and secondary voltages in (11) is used to calculate the voltage and current. Therefore, the output current is calculated in (15).
There can be a full-brige rectifier at the secondary side, so the output voltage and current are in phase.
The input current depends on the output voltage. Since L1 and Lf2 are open circuit, then VCf1=V1, VCf2=Vout. Considering the equivalent capacitance Cin,sec in (10) and the voltage transfer function H2,1 in (11), the input current can be calculated as:
Equation (18) shows that ILf1 is 90° lagging Vout, and (15) shows that ILf2 is 90° lagging Vin. Since Vout and ILf2 are in phase, ILF1 is 180° lagging Vin. The input current direction is opposite to that of ILf1, so it is in phase with Vin. Therefore, the input power is expressed as:
A comparison of (16) and (19) shows that when the parasitic resistances are neglected, the input and output power are the same, which also supports the previous assumption.
Equation (19) shows that the system power is propotional to the mutual capacitance CM, the filter capacitances Cf1,2, the voltage Vin and Vout, and the switching frequency fsw. According to the plate design in Section II, the capacitive coupling coefficient kC is usually much smaller than 10%, so (1−kC2)≈1. Therefore, the system power can be simplified as:
Considering the input dc voltage Vs and the output battery voltage Vb in
In the high power CPT system, the voltage stress on the circuit component, especially the metal plates, is an important concern. The voltage on inductors Lf1,2, L1,2 and capacitors Cf1,2 can be calculated using the current flowing through them. The voltage between each two plates can be calculated according to (12), (13), (15), and (18), which are shown in exemplary Table II.
In accordance with one exemplary design, according to equations (14), (17), and (19), all the circuit parameters can be designed, for exemplary purposes, as shown in Table III.
Because of the symmetry of the plate structure, the other circuit parameters can also be designed to be symmetric. Considering the limitation of the semiconductor devices, the switching frequency can be 1 MHz. Further, L2 can be larger than L1 to provide soft-switching condition to the input inverter.
The power transfer density is also an important specification to evaluate the CPT system. For the LCL-compensated system, its power transfer density can be calculated as,
For an exemplary LCLC-compensated system, for example, the space between the two pairs of plates should be considered, so its power transfer density is calculated as,
The power transfer density of the inductive power transfer system can also be compared. For exemplary LCC compensated IPT systems, power transfer density is calculated as,
As a result, it shows that the power transfer density of these two CPT systems is comparable, and the IPT system has much higher power transfer density than the CPT system.
Alternative Embodiment
According to one embodiment, a corresponding IPT-CPT system topology is described and can be shown as in
It is important to note the coupling polarity of L1 and L2. The connection in
An H-bridge MOSFET inverter can be used at the input side and an H-bridge diode rectifier can be connected at the output side to the load. Silicon carbide (SiC) MOSFETs (C2M0080120D), for example, can be used in the inverter. The circuit in
The input-side inverter can generate a square-wave voltage excitation, and can inject power into the resonant tank. The output-side rectifier converts the output ac current into dc form and supplies the battery (not shown). Therefore, both the input and output voltage can include high-order harmonic components. However, the LC compensation network serves as low pass filter, therefore, the fundamental harmonics approximation (FHA) can be used to analyze a working principle, as shown in
The circuit in
where the switching frequency is fsw, and Cp1 is the input capacitance of the coupling capacitor from the primary side. Equation (25) shows that Lf2 and Cf2 form a parallel resonance, and the impedance is infinite. There is no current flow through the inductor L2. Also, L1, Cf1 and Cp1 form another parallel resonance. There is no current flow through the inductor Lf1. The current on Lf1 is also the input current to the resonant tank. So, the input current is independent of the input voltage, which means the circuit can work as a current source to the input.
where Cp2 is the input capacitance of the coupling capacitor from the secondary side. Equation (26) shows that Lf1 and Cf1 form a parallel resonance. L2, Cf2 and Cp2 form another parallel resonance. There is no current flow through inductors L1 and Lf2. The current on Lf2 is also the output current to the load. The output current is therefore independent of the output voltage, and the resonant circuit works as a current source to the output.
System Power Calculation
First, the circuit in
The parallel resonance of Lf, Cf1 and Cp1 is considered, so the voltage on each component can be expressed as below.
The voltage on Cp1 is also the voltage on the capacitor C1. So the voltage on C2 can be expressed as:
Considering the expression (25), the voltage on C2 can be further simplified as:
Since L1 and L2 are magnetically coupled and there is current flow through L1, there is also a voltage difference between the two terminals of L2. The dot end connection in
M12 is the mutual inductance, which is written as,
M12=k√{square root over (L1·L2)}, (31)
where k is the coupling coefficient. With the expression of (29) and (30), the voltage on Cf2 can be expressed as:
Equation (32) indicates that the polarity connection of L2 has to be the same as shown in
The voltage on Cf2 is the same as the voltage on Lf2, so the output side current I2 can be expressed as:
Considering the parallel resonance between Lf2 and Cf2 and the expression (25), (33) can be simplified as:
As an H-bridge diode rectifier can be used in
In expression (35), the first term is determined by the capacitive power transfer, and the second term is determined by the inductive power transfer:
Equation (34) indicates that the output current (−I2) leads the input voltage V1 by 90°. In the H-bridge diode rectifier, the output current (−I2) and the output voltage V2 are in phase. Therefore, the output voltage V2 is leading the input voltage V1 by 90°.
Second,
This equation shows that the output voltage V2 is leading the input current I1 by 90°. Since the previous analysis proves that the output voltage V2 is also leading the input voltage V1 by 90°, the input voltage V1 and current I1 are in phase with each other. Therefore the input power can be expressed as:
Pin=|V1|·|I1|·cos(φV
Expression (39) shows that unity power factor can be realized at the input side and there is no reactive power injected into the resonant tank. Therefore, there is no extra conduction loss induced by the circulating reactive current, and the efficiency of the resonant circuit can be very high.
Combining (37) and (38), the input power is further expressed as:
Comparing (35) and (39), it shows that the input power is the same as the output power, which is consistent with the previous assumption that the losses in all the components are neglected. According to reference [30], the relationship between C1, C2, and Cs satisfies C1>>Cs and C2>>Cs. So (35) and (39) can be further simplified as:
Inductive Coupler Design
The switching frequency may be specified at the beginning of the coupler design. From equation (36), PCPT is proportional to the coupling capacitor Cs, which can be in the pF range, so the switching frequency has to be increased to the MHz level to achieve the desired power transfer by the capacitors. Since the inductive couplers (aka “coils”) share the same frequency as the capacitive couplers (plates), the switching frequency may be limited to reduce the skin effect. As a result, the frequency is set to 1 MHz, for exemplary purposes.
Exemplary dimensions of the coils are shown in
The coupling coefficient k and self-inductance Ls of the coils are simulated in Maxwell, and shown in
In the IPT-CPT combined system, the coils can resonate with the metal plates. Therefore, the coil size potentially cannot be decided without considering the dimension of the plates. The balancing of the output power of the IPT and CPT system is also an important specification, according to certain embodiments.
This exemplary embodiment utilizes both inductive and capacitive coupling to transfer power. It may be helpful to determine the power ratio of each part, which is the percentage of their contributions. Since the IPT and CPT coupler have similar physical size, they can be designed to transfer the same order of magnitude of power to the load. According to (25), the power ratio of inductive power to capacitive power can be defined as:
Considering (25), (26), and (31), (41) can be simplified as:
Since L1=L2 and C1=C2, (42) can be further rewritten:
Since L1, Cf1, and Cp1 form a parallel resonance, the inductor L1 can be replaced by the capacitor Cf1 and Cp1.
It is known that Cf1>>Cp1, so (44) is approximated as:
The capacitor ratio between C1 and Cs can be defined as kC=Cs/C1. Therefore, the power ratio can be written as:
In order to get significant power transfer through CPT coupling, the maximum power ratio can be set to be 3.0, according to one example. The coil length is set to be 300 mm and the coupling coefficient is 0.130. Substitution of Vin, Vout, k, Cs, and Pin to (25), (26), (39), and (44), shows that C1 determines the percentage contribution of IPT and CPT, and also the inductance value L1. Considering the space limitation for the coil, according to certain possible applications, its inductance L1 should not be too large, in some embodiments, so the minimum power ratio can be set at 2.0, for example. Therefore, the acceptable power ratio could be between 2.0 to 3.0, in the current example.
Exemplary dimensions of various components are provided below in Table IV. The normalized values of coupling capacitor Cs and inductive coupling coefficient k at different misalignment conditions are shown in
It should be noted that all of the dimensions and variables are defined herein for exemplary purposes only, in order to aid in the understanding of the circuitry and overall systems. The exemplary dimensions are not intended to limit the scope of the disclosure in any way, and one of ordinary skill in the art would realize that various alternative values could be input instead.
As one practical application of the systems described herein, the primary and secondary sides of capacitive coupler designs as described herein may be incorporated into a roadway and an electric vehicle (EV), respectively, in order to charge a battery in the EV, for example. A capacitive-coupled roadway power electric vehicle system 100 is presented in
Referring to
In one embodiment, the roadway power EV system 100 has one power source 160 for each power sending segment. Each power sending segment can power one or more EVs 130. The power requirement of each segment is decided by the number of vehicles 130 capacitively coupled to the segment. In other embodiments, a power source may power multiple road segments.
As shown in
The EV 130 can also include the secondary side of power transfer unit 250 coupled to P3 and P4. Power transfer unit 250 can include all components depicted, for example, on the right side of the dashed line in
Moreover, power transfer unit 170, 250 could include coupling coils L1 and L2, respectively, in order to provide additional indicative power along with the capacitive power, as described herein.
Methods described herein may be implemented as software and executed by a general purpose computer. For example, such a general purpose computer may include a control unit/controller or central processing unit (“CPU”), coupled with memory, EPROM, and control hardware. The CPU may be a programmable processor configured to control the operation of the computer and its components. For example, CPU may be a microcontroller (“MCU”), a general purpose hardware processor, a digital signal processor (“DSP”), an application specific integrated circuit (“ASIC”), field programmable gate array (“FPGA”) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general-purpose processor can be a microprocessor, but in the alternative, the processor can be any processor, controller, or microcontroller. A processor can also be implemented as a combination of computing devices, for example, a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration. Such operations, for example, may be stored and/or executed by memory unit.
While not specifically shown, the general computer may include additional hardware and software typical of computer systems (e.g., power, cooling, operating system) is desired. In other implementations, different configurations of a computer can be used (e.g., different bus or storage configurations or a multi-processor configuration). Some implementations include one or more computer programs executed by a programmable processor or computer. In general, each computer may include one or more processors, one or more data-storage components (e.g., volatile or non-volatile memory modules and persistent optical and magnetic storage devices, such as hard and floppy disk drives, CD-ROM drives, and magnetic tape drives), one or more input devices (e.g., mice and keyboards), and one or more output devices (e.g., display consoles and printers).
While the invention has been described in terms of several embodiments, those skilled in the art will recognize that the invention is not limited to the embodiments described, can be practiced with modification and alteration within the spirit and scope of the appended claims. The description is thus to be regarded as illustrative instead of limiting.
This application claims the filing date of previously filed provisional applications 62/311,921, entitled “Inductive and Capacitive Combined Wireless Power Transfer System for Electric Vehicle Charging Applications,” and 62/311,918, entitled “4-Plate Overlapping Structure for Capacitive Power Transfer,” both filed Mar. 23, 2016, and are incorporated herein by reference.
Filing Document | Filing Date | Country | Kind |
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PCT/US2017/023687 | 3/22/2017 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
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WO2017/165577 | 9/28/2017 | WO | A |
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