The present disclosure relates to a wireless communication device.
A wireless communication device, which may be mounted on a vehicle or the like and executes wireless communication through an antenna, has a portion that generates heat through communication processing.
The present disclosure describes a wireless communication device including an antenna, a communication module for executing wireless communication, and a shield case.
Objects, features and advantages of the present disclosure will become more apparent from the following detailed description made with reference to the accompanying drawings. In the drawings:
In a situation where a wireless communication device dissipates heat, it is common to bring a heat source into contact with a member having a large heat capacity to conduct heat.
However, communication devices mounted on vehicles have been demanded to be miniaturized due to space restrictions. In general, in a device sign procedure, functional components are arranged firstly, and heat dissipation countermeasure are performed after the arrangement of functional components. Therefore, heat conductive members or heat dissipating members are added later, and it is necessary to consider enlarging the product size depending on the parts to which these members are added.
A wireless communication device according to an aspect of the present disclosure includes: an antenna that is disposed on an antenna board; a communication module that executes wireless communication; and a shield case that stores the communication module inside the shield case. The antenna board is disposed to be in thermal contact with the shield case. According to such a configuration, the heat generated by the communication processing through the communication module is conducted to the antenna board through the shield case. Therefore, it is possible that the antenna board and the antenna provide contribution to heat dissipation. As the antenna board and the shield case are stacked, the wireless communication device can be miniaturized by efficiently forming a three dimensional structure.
In the wireless communication device according to the above aspect of the present disclosure, the heat dissipation efficiency can be further enhanced by adopting a ceramic antenna having enhanced heat conductivity as the antenna.
The following describes multiple embodiments with reference to the drawings. Hereinafter, in the respective embodiments, substantially the same configurations are denoted by identical symbols, and repetitive description will be omitted.
As illustrated in
As illustrated in
The shield case 5 is connected to a circuit ground of the NAD 3. A ground at the antenna side is disposed on the antenna board 6, and the antenna board 6 and the shield case 5 are electrically connected. Therefore, the ground at the antenna side and the circuit ground of the NAD 3 are connected. Along with this arrangement, the antenna board 6 and the shield case 5 are thermally connected, the heat generated by the communication processing through the NAD 3 is conducted in a path from the circuit ground, the shield case 5, the antenna board 6, the ground at the antenna side and the patch antenna 7 in order, and is then dissipated.
The wireless communication device 1 is stored inside, for example, a shark fin (not shown) arranged on a roof of the vehicle.
As illustrated in
As described above, according to the present embodiment, the wireless communication device 1 includes the patch antenna 7 formed on the antenna board 6, the NAD 3 connected to the patch antenna 7 for executing the wireless communication and the shield case 5 for storing the NAD 3 inside the shield case 5. The antenna board 3 is arranged to be in thermal contact with the shield case 5.
Since the heat generated by the communication processing through the NAD 3 is conducted to the antenna board 6 through the shield case 5, it is possible that the antenna board 6 and the patch antenna 7 provide contribution to heat dissipation. As the antenna board 6 and the shield case 5 are stacked, it is possible to efficiently form a three-dimensional structure and miniaturize the wireless communication device 1. Since a ceramic antenna with enhanced heat conductivity is adopted as the patch antenna 7, it is possible to enhance the efficiency of heat dissipation.
Hereinafter, the same components as those of the first embodiment are denoted by the same reference numerals, and descriptions of the same components will be omitted, and different portions will be described. As illustrated in
As shown in
According to the second embodiment as described above, since the antenna board 32 includes the antenna shield 33 disposed at the surface of the antenna board 32 opposing the shield case 5, it is possible to dissipate heat efficiently.
As illustrated in
Fourth to seventh embodiments described in the following illustrate a situation where the patch antenna 7 in the wireless communication device 31 according to the second embodiment is replaced by an antenna with different structure. In the fourth embodiment shown in
The antenna element 53 includes a connecting conductive plate 53a, a first radiating conductor plate 53b, a second radiating conductive plate 53c, and a feeding pin 53d. The connecting conductive plate 53a has one end connected to the antenna shield 52 perpendicularly. The first and second radiating conductive plates 53b, 53c are bent and extended at the right angle from the other end of the connecting conductive plate 53a, and sandwich a rectangular notch portion between the first and second radiating conductive plates 53b, 53c. The feeding pin 53 has one end connected to the feeding point at the rear surface side of the antenna shield 52, and has the other end penetrating through the hole of the antenna shield 52 and connected to the first radiating conductive plate 53b. The antenna shield 52 is electrically connected to the shield case 5.
In the fifth embodiment shown in
In the sixth embodiment illustrated in
Foot patterns 61a and 61b are disposed at a lower side of the antenna board 59, and are respectively at both sides of the antenna board 59 with the linear pattern 60a in between. The foot patterns 61a, 61b are also connected to the antenna shield 58 by, for example, soldering. A signal source 62 is connected between the foot pattern 61a and the linear pattern 60a. The antenna shield 58 is also the ground of the pattern antenna 57, and is electrically connected to the shield case 5.
In a seventh embodiment illustrated in
The antenna shield 64 is also the ground of the dielectric holding antenna 63, and is electrically connected to the shield case 5. Multiple screw holes 64a, which are for connecting and fixing to the shield case 5 with screws (not shown), are formed at the antenna shield 64. Additionally, multiple screw holes 66a, which are also for connecting and fixing to the dielectric 65, are formed at the antenna element 66. Since the dielectric holding antenna 63 has the dielectric 65 having a relatively large heat capacity, the heat generated by the communication processing through the NAD 3 can be dissipated efficiently.
The patch antenna 7 is not limited to the ceramic antenna.
The communication module is not limited to NAD 3. Further, the peripheral circuit of NAD 3 may be appropriately modified according to the individual design. In the second embodiment, the LNA 34 may be mounted on the same surface as the patch antenna 7. A fan 35 may be provided if necessary. The wireless communication device is not limited to be equipped into a vehicle. The configuration of the first and third embodiments may be applied to the fourth to seventh embodiments.
Although the present disclosure has been described in accordance with the examples, it is understood that the present disclosure is not limited to such examples or structures. The present disclosure encompasses various modifications and variations within the scope of equivalents. In addition, various combinations and forms, and further, other combinations and forms including only one element, or more or less than these elements are also within the scope and the scope of the present disclosure.
Number | Date | Country | Kind |
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2019-011163 | Jan 2019 | JP | national |
2020-007528 | Jan 2020 | JP | national |
The present application is a continuation application of International Patent Application No. PCT/JP2020/002339 filed on Jan. 23, 2020, which designated the U.S. and claims the benefit of priority from Japanese Patent Application No. 2019-11163 filed on Jan. 25, 2019 and Japanese Patent Application No. 2020-7528 filed on Jan. 21, 2020. The entire disclosures of all of the above applications are incorporated herein by reference.
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Number | Date | Country | |
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Number | Date | Country | |
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Parent | PCT/JP2020/002339 | Jan 2020 | US |
Child | 17381864 | US |