Wireless IC device and method of detecting environmental state using the device

Information

  • Patent Grant
  • 8680971
  • Patent Number
    8,680,971
  • Date Filed
    Friday, March 16, 2012
    12 years ago
  • Date Issued
    Tuesday, March 25, 2014
    10 years ago
Abstract
In a wireless IC device, an insulating material, which has an electrical characteristic that is varied with a change in an environmental state, is provided between a feed circuit board and an antenna to detect the environmental state from a state of a communication characteristic between the wireless IC device and an external reader apparatus.
Description
BACKGROUND OF THE INVENTION

1. Field of the Invention


The present invention relates to wireless IC devices. More particularly, the present invention relates to a wireless IC device capable of detecting an environmental state based on a state of a communication characteristic between the wireless IC device and an external reader apparatus. In addition, the present invention relates to a method of detecting an environmental state using the wireless IC device.


2. Description of the Related Art


In recent years, Radio Frequency Identification (RFID) technologies have been put into practical use and wireless IC devices having RFID integrated circuit (IC) chips mounted therein have been utilized for various individual identifications including merchandise control and employee ID cards.


Several methods are used for the RFID. For example, in wireless IC devices adopting passive methods, radio waves having certain frequencies transmitted from reader apparatuses (or reader-writer apparatuses) are received with antennas, RFID IC chips are driven by using the radio waves as power sources to extract information from the IC chips, the information is put on reflected waves from the wireless IC device to the reader apparatus, and the reflected waves including the information are transmitted to the reader apparatuses.


In addition, an approach has been made to use the RFID wireless IC devices for transmission of detection results in sensors that detect environmental states in recent years. For example, in a sensor system disclosed in Japanese Unexamined Patent Application Publication No. 2001-291181, a sensor detecting water leakage from pipes, a sensor detecting the humidity of the soil in a pot, or the like is combined with an RFID wireless IC device, radio waves from a reader apparatus are also used as a driving source for the sensor, the detection result in the sensor is put on reflected waves from the wireless IC device to the reader apparatus, and the reflected waves including the detection result in the sensor are transmitted to the reader apparatus.


However, since a minute change in an electrical characteristic based on a change in the environmental state is digitized and the data is transmitted by using communication components in the sensor system in related art disclosed in Japanese Unexamined Patent Application Publication No. 2001-291181, there is a problem in that the number of components is increased, which causes increases in cost and manufacturing complexity.


SUMMARY OF THE INVENTION

In view of the above problems, preferred embodiments of the present invention provide a wireless IC device including an RFID IC chip; a feed circuit board that has the IC chip mounted therein or thereon and that includes a feed circuit connected to the IC chip; and an antenna coupled to the feed circuit board. The wireless IC device communicates with an external reader apparatus via the antenna. An insulating material that has an electrical characteristic that is varied with a change in an environmental state to vary the coupling state between the feed circuit board and the antenna is provided between the feed circuit board and the antenna to detect the environmental state based on a state of a communication characteristic between the wireless IC device and the reader apparatus.


Since the wireless IC device according to a preferred embodiment of the present invention can be configured simply by providing the insulating material that has an electrical characteristic that is varied with a change in an environmental state between the feed circuit board and the antenna of an RFID wireless IC device, it is possible to configure a sensor system capable of detecting the environmental state in a non-contact manner from an external reader apparatus at a low cost without significantly increasing the number of components.


The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a plan view showing a wireless IC device according to a first preferred embodiment of the present invention.



FIG. 2 is a partial cross-sectional view showing the wireless IC device according to the first preferred embodiment of the present invention, taken along a line A-A′ in FIG. 1.



FIG. 3 is a graph showing communication characteristics (communicable distances) in a normal environment and at an environmental threshold in the wireless IC device according to the first preferred embodiment of the present invention.



FIG. 4 is a graph showing the relationship between the humidity and the communicable distance of the wireless IC device according to the first preferred embodiment of the present invention.



FIG. 5 is a graph showing the relationship between the temperature and the communicable distance of a wireless IC device according to a second preferred embodiment of the present invention.



FIG. 6 is a graph showing the relationship between the pressure and the communicable distance of a wireless IC device according to a third preferred embodiment of the present invention.





DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of the present invention will herein be described with reference to the attached drawings.


First Preferred Embodiment


FIG. 1 and FIG. 2 show a wireless IC device according to a first preferred embodiment of the present invention. FIG. 1 is a plan view of the wireless IC device. FIG. 2 is a partial cross-sectional view of the wireless IC device taken along a line A-A′ in FIG. 1.


Referring to FIGS. 1 and 2, reference numeral 1 denotes an RFID IC chip. The RFID IC chip 1 preferably includes a clock circuit, a logic circuit, a memory circuit, and so on, if needed, and stores necessary information, for example.


Reference numeral 2 denotes a feed circuit board. The feed circuit board 2 at least includes a feed circuit including electronic components included in the board and/or electronic components mounted on a surface of the board, although not shown in FIGS. 1 and 2. The IC chip 1 is mounted on the surface of the feed circuit board 2 by using bumps 3 and the IC chip 1 is connected to the feed circuit of the feed circuit board 2.


Reference numeral 4 denotes a covering resin. The covering resin 4 preferably is formed by, for example, arranging thermosetting resin on the feed circuit board 2 on which the IC chip 1 is mounted and hardening the thermosetting resin to protect the IC chip 1.


Reference numerals 5a and 5b denote antennas. The antennas 5a and 5b are made of a conductive material and have a certain pattern. The antennas 5a and 5b are preferably located on a surface of an insulating base 6 formed of, for example, a resin film. The antennas 5a and 5b are coupled to the feed circuit board 2 and are electromagnetically coupled to the feed circuit board 2 in the first preferred embodiment.


Reference numeral 7 denotes an insulating material featured in various preferred embodiments of the present invention. The insulating material 7 is preferably provided between the feed circuit board 2 and the antennas 5a and 5b. A material that has an electrical characteristic that is varied depending on a state of an environmental condition (including but not limited to humidity, temperature, pressure, for example) is preferably used as the insulating material 7.


In this wireless IC device, a radio wave having a certain frequency (for example, 900 MHz) transmitted from an external reader apparatus (or reader-writer apparatus) (not shown) is received with the antennas 5a and 5b, induced electromotive force is produced on the basis of the received radio wave in the feed circuit of the feed circuit board 2 electromagnetically coupled to the antennas 5a and 5b, the RFID IC chip 1 is driven with the electromotive force, and information is extracted from the IC chip 1. The extracted information is put on a reflected wave from the wireless IC device to the reader apparatus in the feed circuit and the reflected wave bearing the information is transmitted to the reader apparatus via the antennas 5a and 5b.


In the wireless IC device according to a preferred embodiment of the present invention, since the insulating material 7 that has an electrical characteristic that varies depending on a state of an environmental characteristic (including but not limited to humidity, temperature, pressure, etc., for example) is preferably provided between the feed circuit board 2 and the antennas 5a and 5b, the coupling state (the electromagnetic coupling state in the first preferred embodiment) between the feed circuit board 2 and the antennas 5a and 5b is varied depending on the environmental state. The variation in the coupling state between the feed circuit board 2 and the antennas 5a and 5b varies the communication characteristic between the wireless IC device and the reader apparatus. The environment around the wireless IC device is detected from the state of the communication characteristic between the wireless IC device and the reader apparatus in a preferred embodiment of the present invention.


In the first preferred embodiment, a material that has an electrostatic capacitance that is increased in response to an increase in the ambient humidity to vary the electromagnetic coupling between the feed circuit board 2 and the antennas 5a and 5b and to shift the communicable distance between the wireless IC device and the reader apparatus is preferably used as the insulating material 7. For example, epoxy resin in which cellulose is dispersed or epoxy resin in which polyvinyl alcohol is dispersed can be used as the insulating material 7.



FIG. 3 shows an exemplary relationship between the communicable distance between the wireless IC device and the reader apparatus and the humidity around the insulating material 7 at a specific frequency (for example, 900 MHz). Referring to FIG. 3, the communicable distance in a normal environment at a humidity of about 50% was equal to a meters while the communicable distance is decreased by about 40% to about 0.6 a meters at a humidity of about 90%, which is set as an environmental threshold. As a result, it is detected in the wireless IC device that the humidity is lower than about 90% if the communication between the wireless IC device and the reader apparatus is enabled at a communicable distance of about 0.6 a meters and that the humidity is not lower than about 90% if the communication between the wireless IC device and the reader apparatus is disabled at a communicable distance of about 0.6 a meters, for example.


The environmental threshold can be arbitrarily set. For example, when a humidity of about 70% is set as the environmental threshold, it can be detected whether the humidity is lower than about 70% based on whether the communication is enabled at a communicable distance that is actually measured in advance at a humidity of about 70%. For example, as shown in FIG. 4, when the communicable distance started to decrease around a humidity of about 55% or more and the communicable distance at a humidity of about 70% was about 80% of that at a humidity of about 55% or less, it can be detected that:


the humidity is lower than about 70% if the communicable distance was higher than about 80%;


the humidity is equal to about 70% (the environmental threshold) if the communicable distance was equal to about 80%; and


the humidity is higher than about 70% if the communicable distance was lower than about 80%.


The humidity environment was designed in this example so that the electromagnetic coupling is optimized on the basis of the electrostatic capacitance at a humidity lower than about 55%, for example, at a humidity of about 40% and, when the humidity is increased to about 60% or more, the electrostatic capacitance is increased to increase the electromagnetic coupling, the electromagnetic coupling level is shifted from the optimal value, and the communicable distance is decreased. However, the method of setting the humidity environment is not limited to that described above. For example, the humidity environment may be designed so that the electromagnetic coupling is optimized on the basis of the electrostatic capacitance at a humidity of about 70% and, when the humidity is increased to be close to about 70%, the electrostatic capacitance is increased to increase the electromagnetic coupling and the electromagnetic coupling is optimized to increase the communicable distance.


Although the communicable distance is used as the communication characteristic in the present preferred embodiment, it may be detected whether the environmental state reaches the environmental threshold on the basis of another communication characteristic, for example, the amount of shift of a center frequency. When the environmental state preferably is detected on the basis of the amount of shift of the center frequency, it is desirable to perform the measurement for the wireless IC device in various aspects in order to increase the precision and accuracy of the measurement.


As described above, with the wireless IC device according to the first preferred embodiment, it is possible to detect the ambient humidity of the wireless IC device in a non-contact manner from an external reader apparatus at a low cost without largely increasing the amount of components.


Second Preferred Embodiment

In a wireless IC device in a second preferred embodiment, the insulating material 7 in the first preferred embodiment is replaced with a material that has an electrostatic capacitance that is increased in response to an increase in temperature. For example, a material produced from mixing a resin material (epoxy, etc.) with filler (barium titanate system, etc.) that has a dielectric constant that is varied with temperature may be preferably used. In other words, an increase in the ambient temperature increases the electrostatic capacitance to increase the electromagnetic coupling between the feed circuit board 2 and the antennas 5a and 5b, thereby varying the communicable distance between the wireless IC device and a reader apparatus.


If a predetermined temperature is set as the environmental threshold and the communicable distance at the predetermined temperature is actually measured, it can be detected whether the temperature is higher than or equal to the environmental threshold on the basis of whether the communication is enabled at the measured communicable distance. For example, if the environmental threshold was set to about 100° C. when the communication was disabled at room temperature, the electromagnetic coupling was optimized and the communicable distance was near 100% at temperatures of about 100° C. to about 120° C., and the electromagnetic coupling was reduced to decrease the communicable distance at a temperature of about 120° C. or more, as shown in FIG. 5, it can be detected from the communicable distance that is almost equal to 100% that the temperature exceeds the environmental threshold and is equal to about 100° C. to about 120° C.


Third Preferred Embodiment

In a wireless IC device in a third preferred embodiment, the feed circuit board 2 is not electromagnetically coupled to the antennas 5a and 5b but is directly coupled to the antennas 5a and 5b. In addition, the insulating material 7 in the first preferred embodiment is replaced with a material that electrically conducts in response to application of a pressure higher than or equal to an environmental threshold and that does not electrically conduct in response to application of a pressure lower than the environmental threshold. For example, “Inastomer” (a product name) manufactured by INABA RUBBER CO., LTD. may be used as such a material. It can be detected that the pressure is higher than or equal to the environmental threshold that is set if the communication is enabled between the wireless IC device and a reader apparatus and the pressure is lower than the environmental threshold that is set if the communication is disabled therebetween.



FIG. 6 shows an exemplary relationship between the pressure and the communicable distance of a wireless IC device the communicable distance of which is varied with the pressure. This example demonstrates that the pressure exceeds about 200 kPa if the communicable distance is almost equal to 100% and the pressure is lower than or equal to about 100 kPa if the communication is disabled.


Although the first to third preferred embodiments of the present invention are described above, the present invention is not limited to the above preferred embodiments and various modifications and applications can be made.


For example, if data indicating, for example, the location where the wireless IC device is installed and the type of a sensor (a humidity sensor in the first preferred embodiment, a temperature sensor in the second preferred embodiment, and a pressure sensor in the third preferred embodiment) is stored in advance in an RFID IC chip that is mounted and the data is read out by the reader apparatus concurrently with detection of the environmental state, it is possible to facilitate subsequent data processing without incorrect or inaccurate recognition of the detection result.


In addition, adjacently providing multiple kinds of wireless IC devices including the humidity sensor and the temperature sensor allows various environmental states to be easily detected with the same measurement system.


While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.

Claims
  • 1. A wireless IC device comprising: an RFID IC chip;a feed circuit board that has the IC chip mounted therein or thereon and that includes a feed circuit connected to the IC chip; andan antenna coupled to the feed circuit board; whereinthe wireless IC device communicates with an external reader apparatus via the antenna; andan insulating material that has an electrical characteristic that varies with a change in an environmental state to vary a coupling state between the feed circuit board and the antenna is provided between the feed circuit board and the antenna such that the environmental state is detected based on a state of a communication characteristic between the wireless IC device and the reader apparatus.
  • 2. The wireless IC device according to claim 1, wherein the environmental state is one of humidity, temperature, and pressure.
  • 3. The wireless IC device according to claim 1, wherein the feed circuit board is electromagnetically coupled to the antenna.
  • 4. The wireless IC device according to claim 1, wherein the communication characteristic is a communicable distance between the wireless IC device and the reader apparatus.
  • 5. A method of detecting an environmental state using a wireless IC device that includes an IC chip, a feed circuit board that has the IC chip mounted therein or thereon and that includes a feed circuit connected to the IC chip, and an antenna coupled to the feed circuit board; and communicates with an external reader apparatus via the antenna, wherein an insulating material that has an electrical characteristic that varies with a change in an environmental state to vary a coupling state between the feed circuit board and the antenna is provided between the feed circuit board and the antenna to enable detection of the environmental state based on a state of a communication characteristic between the wireless IC device and the reader apparatus.
Priority Claims (1)
Number Date Country Kind
2009-223420 Sep 2009 JP national
US Referenced Citations (137)
Number Name Date Kind
3364564 Kurtz et al. Jan 1968 A
4794397 Ohe et al. Dec 1988 A
5232765 Yano et al. Aug 1993 A
5253969 Richert Oct 1993 A
5337063 Takahira Aug 1994 A
5374937 Tsunekawa et al. Dec 1994 A
5399060 Richert Mar 1995 A
5491483 D'Hont Feb 1996 A
5528222 Moskowitz et al. Jun 1996 A
5757074 Matloubian et al. May 1998 A
5854480 Noto Dec 1998 A
5903239 Takahashi et al. May 1999 A
5936150 Kobrin et al. Aug 1999 A
5955723 Reiner Sep 1999 A
5995006 Walsh Nov 1999 A
6104611 Glover et al. Aug 2000 A
6107920 Eberhardt et al. Aug 2000 A
6172608 Cole Jan 2001 B1
6181287 Beigel Jan 2001 B1
6190942 Wilm et al. Feb 2001 B1
6249258 Bloch et al. Jun 2001 B1
6259369 Monico Jul 2001 B1
6271803 Watanabe et al. Aug 2001 B1
6335686 Goff et al. Jan 2002 B1
6362784 Kane et al. Mar 2002 B1
6367143 Sugimura Apr 2002 B1
6378774 Emori et al. Apr 2002 B1
6406990 Kawai Jun 2002 B1
6448874 Shiino et al. Sep 2002 B1
6452563 Porte Sep 2002 B1
6462716 Kushihi Oct 2002 B1
6542050 Arai et al. Apr 2003 B1
6600459 Yokoshima et al. Jul 2003 B2
6634564 Kuramochi Oct 2003 B2
6664645 Kawai Dec 2003 B2
6763254 Nishikawa Jul 2004 B2
6812707 Yonezawa et al. Nov 2004 B2
6828881 Mizutani et al. Dec 2004 B2
6837438 Takasugi et al. Jan 2005 B1
6861731 Buijsman et al. Mar 2005 B2
6927738 Senba et al. Aug 2005 B2
6963729 Uozumi Nov 2005 B2
7088249 Senba et al. Aug 2006 B2
7088307 Imaizumi Aug 2006 B2
7112952 Arai et al. Sep 2006 B2
7119693 Devilbiss Oct 2006 B1
7129834 Naruse et al. Oct 2006 B2
7248221 Kai et al. Jul 2007 B2
7250910 Yoshikawa et al. Jul 2007 B2
7276929 Arai et al. Oct 2007 B2
7317396 Ujino Jan 2008 B2
7405664 Sakama et al. Jul 2008 B2
7446660 Posamentier Nov 2008 B2
7551058 Johnson et al. Jun 2009 B1
7570169 Li et al. Aug 2009 B2
20020011967 Goff et al. Jan 2002 A1
20020015002 Yasukawa et al. Feb 2002 A1
20020044092 Kushihi Apr 2002 A1
20020067316 Yokoshima et al. Jun 2002 A1
20020093457 Hamada et al. Jul 2002 A1
20030006901 Kim et al. Jan 2003 A1
20030020661 Sato Jan 2003 A1
20030045324 Nagumo et al. Mar 2003 A1
20030169153 Muller Sep 2003 A1
20040001027 Killen et al. Jan 2004 A1
20040026519 Usami et al. Feb 2004 A1
20040056823 Zuk et al. Mar 2004 A1
20040066617 Hirabayashi et al. Apr 2004 A1
20040217915 Imaizumi Nov 2004 A1
20040219956 Iwai et al. Nov 2004 A1
20040227673 Iwai et al. Nov 2004 A1
20040252064 Yuanzhu Dec 2004 A1
20050092836 Kudo May 2005 A1
20050099337 Takei et al. May 2005 A1
20050125093 Kikuchi et al. Jun 2005 A1
20050134460 Usami Jun 2005 A1
20050134506 Egbert Jun 2005 A1
20050138798 Sakama et al. Jun 2005 A1
20050140512 Sakama et al. Jun 2005 A1
20050232412 Ichihara et al. Oct 2005 A1
20050236623 Takechi et al. Oct 2005 A1
20050275539 Sakama et al. Dec 2005 A1
20060001138 Sakama et al. Jan 2006 A1
20060032926 Baba et al. Feb 2006 A1
20060044192 Egbert Mar 2006 A1
20060055531 Cook et al. Mar 2006 A1
20060055601 Kameda et al. Mar 2006 A1
20060071084 Detig et al. Apr 2006 A1
20060109185 Iwai et al. May 2006 A1
20060145872 Tanaka et al. Jul 2006 A1
20060158380 Son et al. Jul 2006 A1
20060170606 Yamagajo et al. Aug 2006 A1
20060214801 Murofushi et al. Sep 2006 A1
20060220871 Baba et al. Oct 2006 A1
20060244568 Tong et al. Nov 2006 A1
20060244676 Uesaka Nov 2006 A1
20060267138 Kobayashi Nov 2006 A1
20070004028 Lair et al. Jan 2007 A1
20070018893 Kai et al. Jan 2007 A1
20070040028 Kawamata Feb 2007 A1
20070052613 Gallschuetz et al. Mar 2007 A1
20070057854 Oodachi et al. Mar 2007 A1
20070069037 Kawai Mar 2007 A1
20070132591 Khatri Jun 2007 A1
20070164414 Dokai et al. Jul 2007 A1
20070200782 Hayama et al. Aug 2007 A1
20070229276 Yamagajo et al. Oct 2007 A1
20070247387 Kubo et al. Oct 2007 A1
20070252700 Ishihara et al. Nov 2007 A1
20070252703 Kato et al. Nov 2007 A1
20070285335 Bungo et al. Dec 2007 A1
20070290928 Chang et al. Dec 2007 A1
20080024156 Arai et al. Jan 2008 A1
20080070003 Nakatani et al. Mar 2008 A1
20080087990 Kato et al. Apr 2008 A1
20080143630 Kato et al. Jun 2008 A1
20080169905 Slatter Jul 2008 A1
20080184281 Ashizaki et al. Jul 2008 A1
20080272885 Atherton Nov 2008 A1
20090002130 Kato Jan 2009 A1
20090009007 Kato et al. Jan 2009 A1
20090021352 Kataya et al. Jan 2009 A1
20090021446 Kataya et al. Jan 2009 A1
20090065594 Kato et al. Mar 2009 A1
20090109102 Dokai et al. Apr 2009 A1
20090160719 Kato et al. Jun 2009 A1
20090201116 Orihara Aug 2009 A1
20090224061 Kato et al. Sep 2009 A1
20090231106 Okamura Sep 2009 A1
20090262041 Ikemoto et al. Oct 2009 A1
20090266900 Ikemoto et al. Oct 2009 A1
20090278687 Kato Nov 2009 A1
20090321527 Kato et al. Dec 2009 A1
20100103058 Kato et al. Apr 2010 A1
20100182210 Ryou et al. Jul 2010 A1
20110031320 Kato et al. Feb 2011 A1
20110063184 Furumura et al. Mar 2011 A1
Foreign Referenced Citations (440)
Number Date Country
2 279 176 Jul 1998 CA
10 2006 057 369 Jun 2008 DE
0 694 874 Jan 1996 EP
0 848 448 Jun 1998 EP
0 948 083 Oct 1999 EP
0 977 145 Feb 2000 EP
1 010 543 Jun 2000 EP
1 085 480 Mar 2001 EP
1 160 915 Dec 2001 EP
1 170 795 Jan 2002 EP
1 193 793 Apr 2002 EP
1 227 540 Jul 2002 EP
1 280 232 Jan 2003 EP
1 280 350 Jan 2003 EP
1 343 223 Sep 2003 EP
1 357 511 Oct 2003 EP
1 547 753 Jun 2005 EP
1 548 872 Jun 2005 EP
1 626 364 Feb 2006 EP
1 701 296 Sep 2006 EP
1 703 589 Sep 2006 EP
1 742 296 Jan 2007 EP
1 744 398 Jan 2007 EP
1 841 005 Oct 2007 EP
1 865 574 Dec 2007 EP
1 887 652 Feb 2008 EP
1 976 056 Oct 2008 EP
1 988 491 Nov 2008 EP
1 988 601 Nov 2008 EP
1 993 170 Nov 2008 EP
2 009 738 Dec 2008 EP
2 012 258 Jan 2009 EP
2 096 709 Sep 2009 EP
2 148 449 Jan 2010 EP
2 251 934 Nov 2010 EP
2 305 075 Mar 1997 GB
2461443 Jan 2010 GB
50-143451 Nov 1975 JP
61-284102 Dec 1986 JP
62-127140 Aug 1987 JP
02-164105 Jun 1990 JP
02-256208 Oct 1990 JP
3-171385 Jul 1991 JP
03-503467 Aug 1991 JP
03-262313 Nov 1991 JP
04-150011 May 1992 JP
04-167500 Jun 1992 JP
04-096814 Aug 1992 JP
04-101168 Sep 1992 JP
04-134807 Dec 1992 JP
05-327331 Dec 1993 JP
6-53733 Feb 1994 JP
06-077729 Mar 1994 JP
06-177635 Jun 1994 JP
6-260949 Sep 1994 JP
07-183836 Jul 1995 JP
08-055725 Feb 1996 JP
08-056113 Feb 1996 JP
8-87580 Apr 1996 JP
08-088586 Apr 1996 JP
08-88586 Apr 1996 JP
08-176421 Jul 1996 JP
08-180160 Jul 1996 JP
08-279027 Oct 1996 JP
08-307126 Nov 1996 JP
08-330372 Dec 1996 JP
09-014150 Jan 1997 JP
09-035025 Feb 1997 JP
9-93029 Apr 1997 JP
09-093029 Apr 1997 JP
09-245381 Sep 1997 JP
09-252217 Sep 1997 JP
09-270623 Oct 1997 JP
09-284038 Oct 1997 JP
9-512367 Dec 1997 JP
10-069533 Mar 1998 JP
10-69533 Mar 1998 JP
10-505466 May 1998 JP
10-171954 Jun 1998 JP
10-173427 Jun 1998 JP
10-193849 Jul 1998 JP
10-193851 Jul 1998 JP
10-293828 Nov 1998 JP
10-334203 Dec 1998 JP
11-025244 Jan 1999 JP
11-039441 Feb 1999 JP
11-075329 Mar 1999 JP
11-085937 Mar 1999 JP
11-88241 Mar 1999 JP
11-102424 Apr 1999 JP
11-103209 Apr 1999 JP
11-149536 Jun 1999 JP
11-149537 Jun 1999 JP
11-149538 Jun 1999 JP
11-175678 Jul 1999 JP
11-219420 Aug 1999 JP
11-220319 Aug 1999 JP
11-282993 Oct 1999 JP
11-328352 Nov 1999 JP
11-331014 Nov 1999 JP
11-346114 Dec 1999 JP
11-515094 Dec 1999 JP
2000-21128 Jan 2000 JP
2000-021639 Jan 2000 JP
2000-022421 Jan 2000 JP
2000-059260 Feb 2000 JP
2000-085283 Mar 2000 JP
2000-090207 Mar 2000 JP
2000-132643 May 2000 JP
2000-137778 May 2000 JP
2000-137779 May 2000 JP
2000-137785 May 2000 JP
2000-148948 May 2000 JP
2000-172812 Jun 2000 JP
2000-209013 Jul 2000 JP
2000-222540 Aug 2000 JP
2000-510271 Aug 2000 JP
2000-242754 Sep 2000 JP
2000-243797 Sep 2000 JP
2000-251049 Sep 2000 JP
2000-261230 Sep 2000 JP
2000-276569 Oct 2000 JP
2000-286634 Oct 2000 JP
2000-286760 Oct 2000 JP
2000-311226 Nov 2000 JP
2000-321984 Nov 2000 JP
2000-349680 Dec 2000 JP
2001-10264 Jan 2001 JP
2001-028036 Jan 2001 JP
2001-043340 Feb 2001 JP
3075400 Feb 2001 JP
2001-66990 Mar 2001 JP
2001-76111 Mar 2001 JP
2001-084463 Mar 2001 JP
2001-101369 Apr 2001 JP
2001-505682 Apr 2001 JP
2001-168628 Jun 2001 JP
2001-188890 Jul 2001 JP
2001-240046 Sep 2001 JP
2001-240217 Sep 2001 JP
2001-256457 Sep 2001 JP
2001-257292 Sep 2001 JP
2001-514777 Sep 2001 JP
2001-291181 Oct 2001 JP
2001-319380 Nov 2001 JP
2001-331976 Nov 2001 JP
2001-332923 Nov 2001 JP
2001-339226 Dec 2001 JP
2001-344574 Dec 2001 JP
2001-351083 Dec 2001 JP
2001-351084 Dec 2001 JP
2001-352176 Dec 2001 JP
2001-358527 Dec 2001 JP
2002-024776 Jan 2002 JP
2002-026513 Jan 2002 JP
2002-32731 Jan 2002 JP
2002-042076 Feb 2002 JP
2002-063557 Feb 2002 JP
2002-505645 Feb 2002 JP
2002-076750 Mar 2002 JP
2002-76750 Mar 2002 JP
2002-111363 Apr 2002 JP
2002-150245 May 2002 JP
2002-157564 May 2002 JP
2002-158529 May 2002 JP
2002-175508 Jun 2002 JP
2002-183690 Jun 2002 JP
2002-185358 Jun 2002 JP
2002-204117 Jul 2002 JP
2002-522849 Jul 2002 JP
2002-230128 Aug 2002 JP
2002-232221 Aug 2002 JP
2002-246828 Aug 2002 JP
2002-252117 Sep 2002 JP
2002-259934 Sep 2002 JP
2002-280821 Sep 2002 JP
2002-298109 Oct 2002 JP
2002-308437 Oct 2002 JP
2002-319008 Oct 2002 JP
2002-319009 Oct 2002 JP
2002-319812 Oct 2002 JP
2002-362613 Dec 2002 JP
2002-366917 Dec 2002 JP
2002-373029 Dec 2002 JP
2002-373323 Dec 2002 JP
2002-374139 Dec 2002 JP
2003-006599 Jan 2003 JP
2003-016412 Jan 2003 JP
2003-022912 Jan 2003 JP
2003-026177 Jan 2003 JP
2003-030612 Jan 2003 JP
2003-44789 Feb 2003 JP
2003-046318 Feb 2003 JP
2003-58840 Feb 2003 JP
2003-067711 Mar 2003 JP
2003-069335 Mar 2003 JP
2003-076947 Mar 2003 JP
2003-76963 Mar 2003 JP
2003-78333 Mar 2003 JP
2003-078336 Mar 2003 JP
2003-085501 Mar 2003 JP
2003-085520 Mar 2003 JP
2003-87008 Mar 2003 JP
2003-87044 Mar 2003 JP
2003-099184 Apr 2003 JP
2003-099720 Apr 2003 JP
2003-099721 Apr 2003 JP
2003-110344 Apr 2003 JP
2003-132330 May 2003 JP
2003-134007 May 2003 JP
2003-155062 May 2003 JP
2003-158414 May 2003 JP
2003-168760 Jun 2003 JP
2003-179565 Jun 2003 JP
2003-187207 Jul 2003 JP
2003-187211 Jul 2003 JP
2003-187507 Jul 2003 JP
2003-188338 Jul 2003 JP
2003-188620 Jul 2003 JP
2003-198230 Jul 2003 JP
2003-209421 Jul 2003 JP
2003-216919 Jul 2003 JP
2003-218624 Jul 2003 JP
2003-233780 Aug 2003 JP
2003-242471 Aug 2003 JP
2003-243918 Aug 2003 JP
2003-249813 Sep 2003 JP
2003-529163 Sep 2003 JP
2003-288560 Oct 2003 JP
2003-309418 Oct 2003 JP
2003-317060 Nov 2003 JP
2003-331246 Nov 2003 JP
2003-332820 Nov 2003 JP
2003-536302 Dec 2003 JP
2004-040597 Feb 2004 JP
2004-505481 Feb 2004 JP
2004-082775 Mar 2004 JP
2004-88218 Mar 2004 JP
2004-93693 Mar 2004 JP
2004-096566 Mar 2004 JP
2004-096618 Mar 2004 JP
2004-126750 Apr 2004 JP
2004-127230 Apr 2004 JP
2004-140513 May 2004 JP
2004-163134 Jun 2004 JP
2004-213582 Jul 2004 JP
2004-519916 Jul 2004 JP
2004-234595 Aug 2004 JP
2004-253858 Sep 2004 JP
2004-527864 Sep 2004 JP
2004-280390 Oct 2004 JP
2004-282403 Oct 2004 JP
2004-287767 Oct 2004 JP
2004-295297 Oct 2004 JP
2004-297249 Oct 2004 JP
2004-297681 Oct 2004 JP
2004-304370 Oct 2004 JP
2004-319848 Nov 2004 JP
2004-326380 Nov 2004 JP
2004-334268 Nov 2004 JP
2004-336250 Nov 2004 JP
2004-343000 Dec 2004 JP
2004-362190 Dec 2004 JP
2004-362341 Dec 2004 JP
2004-362602 Dec 2004 JP
2005-5866 Jan 2005 JP
2005-18156 Jan 2005 JP
2005-033461 Feb 2005 JP
2005-124061 May 2005 JP
2005-128592 May 2005 JP
2005-129019 May 2005 JP
2005-135132 May 2005 JP
2005-136528 May 2005 JP
2005-137032 May 2005 JP
3653099 May 2005 JP
2005-165839 Jun 2005 JP
2005-167327 Jun 2005 JP
2005-167813 Jun 2005 JP
2005-190417 Jul 2005 JP
2005-191705 Jul 2005 JP
2005-192124 Jul 2005 JP
2005-210676 Aug 2005 JP
2005-210680 Aug 2005 JP
2005-217822 Aug 2005 JP
2005-229474 Aug 2005 JP
2005-236339 Sep 2005 JP
2005-244778 Sep 2005 JP
2005-252853 Sep 2005 JP
2005-275870 Oct 2005 JP
2005-284352 Oct 2005 JP
2005-284455 Oct 2005 JP
2005-293537 Oct 2005 JP
2005-295135 Oct 2005 JP
2005-311205 Nov 2005 JP
2005-321305 Nov 2005 JP
2005-322119 Nov 2005 JP
2005-335755 Dec 2005 JP
2005-340759 Dec 2005 JP
2005-345802 Dec 2005 JP
2005-346820 Dec 2005 JP
2005-352858 Dec 2005 JP
2006-13976 Jan 2006 JP
2006-013976 Jan 2006 JP
2006-025390 Jan 2006 JP
2006-031766 Feb 2006 JP
2006-033312 Feb 2006 JP
2006-39902 Feb 2006 JP
2006-039947 Feb 2006 JP
2006-42059 Feb 2006 JP
2006-42097 Feb 2006 JP
2006-053833 Feb 2006 JP
2006-67479 Mar 2006 JP
2006-72706 Mar 2006 JP
2006-074348 Mar 2006 JP
2006-80367 Mar 2006 JP
2006-92630 Apr 2006 JP
2006-102953 Apr 2006 JP
2006-107296 Apr 2006 JP
2006-513594 Apr 2006 JP
2006-148462 Jun 2006 JP
2006-148518 Jun 2006 JP
2006-151402 Jun 2006 JP
2006-174151 Jun 2006 JP
2006-195795 Jul 2006 JP
2006-203187 Aug 2006 JP
2006-203852 Aug 2006 JP
2006-217000 Aug 2006 JP
2006-232292 Sep 2006 JP
2006-237674 Sep 2006 JP
2006-246372 Sep 2006 JP
2006-270212 Oct 2006 JP
2006-270681 Oct 2006 JP
2006-270766 Oct 2006 JP
2006-285911 Oct 2006 JP
2006-287659 Oct 2006 JP
2006-295879 Oct 2006 JP
2006-302219 Nov 2006 JP
2006-309401 Nov 2006 JP
2006-311239 Nov 2006 JP
2006-323481 Nov 2006 JP
2006-339964 Dec 2006 JP
2007-007888 Jan 2007 JP
2007-13120 Jan 2007 JP
2007-18067 Jan 2007 JP
2007-019905 Jan 2007 JP
2007-28002 Feb 2007 JP
2007-040702 Feb 2007 JP
2007-043535 Feb 2007 JP
2007-048126 Feb 2007 JP
2007-65822 Mar 2007 JP
2007-79687 Mar 2007 JP
2007-81712 Mar 2007 JP
2007-096768 Apr 2007 JP
2007-102348 Apr 2007 JP
2007-116347 May 2007 JP
2007-122542 May 2007 JP
2007-150642 Jun 2007 JP
2007-150868 Jun 2007 JP
2007-159083 Jun 2007 JP
2007-159129 Jun 2007 JP
2007-166133 Jun 2007 JP
2007-172369 Jul 2007 JP
2007-172527 Jul 2007 JP
2007-228325 Sep 2007 JP
2007-233597 Sep 2007 JP
2007-266999 Oct 2007 JP
2007-272264 Oct 2007 JP
2007-287128 Nov 2007 JP
2007-295557 Nov 2007 JP
2007-312350 Nov 2007 JP
2007-324865 Dec 2007 JP
2008-033716 Feb 2008 JP
2008-042910 Feb 2008 JP
2008-72243 Mar 2008 JP
2008-083867 Apr 2008 JP
2008-097426 Apr 2008 JP
4069958 Apr 2008 JP
2008-103691 May 2008 JP
2008-107947 May 2008 JP
2008-513888 May 2008 JP
2008-148345 Jun 2008 JP
2008-519347 Jun 2008 JP
2008-160874 Jul 2008 JP
2008-167190 Jul 2008 JP
2008-197714 Aug 2008 JP
2008-535372 Aug 2008 JP
2008-207875 Sep 2008 JP
2008-217406 Sep 2008 JP
2008-288915 Nov 2008 JP
2009-017284 Jan 2009 JP
2009-25870 Feb 2009 JP
2009-27291 Feb 2009 JP
2009-044715 Feb 2009 JP
3148168 Feb 2009 JP
2009-110144 May 2009 JP
2009-182630 Aug 2009 JP
2010-009196 Jan 2010 JP
2010-081571 Apr 2010 JP
4609604 Jan 2011 JP
9100176 Mar 1992 NL
9100347 Mar 1992 NL
9833142 Jul 1998 WO
9967754 Dec 1999 WO
0010122 Feb 2000 WO
0195242 Dec 2001 WO
0248980 Jun 2002 WO
02061675 Aug 2002 WO
02097723 Dec 2002 WO
03079305 Sep 2003 WO
2004036772 Apr 2004 WO
2004070879 Aug 2004 WO
2004072892 Aug 2004 WO
2005073937 Aug 2005 WO
2005091434 Sep 2005 WO
2005115849 Dec 2005 WO
2006045682 May 2006 WO
2006048663 May 2006 WO
2006114821 Nov 2006 WO
2007083574 Jul 2007 WO
2007083575 Jul 2007 WO
2007086130 Aug 2007 WO
2007094494 Aug 2007 WO
2007097385 Aug 2007 WO
2007102360 Sep 2007 WO
2007105348 Sep 2007 WO
2007119310 Oct 2007 WO
2007125683 Nov 2007 WO
2007138857 Dec 2007 WO
2008007606 Jan 2008 WO
2008081699 Jul 2008 WO
2008126458 Oct 2008 WO
2008133018 Nov 2008 WO
2008140037 Nov 2008 WO
2008142957 Nov 2008 WO
2009011144 Jan 2009 WO
2009011376 Jan 2009 WO
2009011400 Jan 2009 WO
2009011423 Jan 2009 WO
2009081719 Jul 2009 WO
2009110381 Sep 2009 WO
Non-Patent Literature Citations (141)
Entry
Official Communication issued in International Patent Application No. PCT/JP2009/069486, mailed on Mar. 2, 2010.
Kato: “Radio IC Device”; U.S. Appl. No. 13/080,775, filed Apr. 6, 2011.
Kato et al.: “Antenna and Wireless IC Device”; U.S. Appl. No. 13/083,626, filed Apr. 11, 2011.
Official Communication issued in International Patent Application No. PCT/JP2009/070617, mailed on Mar. 16, 2010.
Nagai, “Mounting Technique of RFID by Roll-To-Roll Process”, Material Stage, Technical Information Institute Co., Ltd, vol. 7, No. 9, 2007, pp. 4-12.
Dokai et al.: “Wireless IC Device”; U.S. Appl. No. 13/088,480, filed Apr. 18, 2011.
Kato et al.: “High Frequency Device and Wireless IC Device”, U.S. Appl. No. 13/094,928, filed Apr. 27, 2011
Dokai et al.: “Wireless IC Device”, U.S. Appl. No. 13/099,392, filed May 3, 2011.
Kato et al.: “Radio Frequency IC Device”; U.S. Appl. No. 13/163,803, filed Jun. 20, 2011.
Official Communication issued in International Patent Application No. PCT/JP2010/050170, mailed on Apr. 13, 2010.
Official Communication issued in International Patent Application No. PCT/JP2010/051205, mailed on May 11, 2010.
Kato: “Wireless IC Device, Wireless IC Module and Method of Manufacturing Wireless IC Module”; U.S. Appl. No. 13/169,067, filed Jun. 27, 2011.
Kato et al.: “Antenna and Wireless IC Device”; U.S. Appl. No. 13/190,670, filed Jul. 26, 2011.
Shiroki et al.: “RFIC Chip Mounting Structure”; U.S. Appl. No. 13/223,429, filed Sep. 1, 2011.
Official Communication issued in International Patent Application No. PCT/JP2010/056559, mailed on Jul. 27, 2010.
Taniguchi et al.: “Antenna Device and Radio Frequency IC Device”; U.S. Appl. No. 13/232,102, filed Sep. 14, 2011.
Official Communication issued in International Patent Application No. PCT/JP2010/053496, mailed on Jun. 1, 2010.
Ikemoto: “Wireless IC Tag, Reader-Writer, and Information Processing System”; U.S. Appl. No. 13/329,354, filed Dec. 19, 2011.
Kato et al.: “Antenna and Antenna Module”; U.S. Appl. No. 13/334,462, filed Dec. 22, 2011.
Official Communication issued in International Patent Application No. PCT/JP2010/069418, mailed on Feb. 8, 2011.
Official Communication issued in International Patent Application No. PCT/JP2010/063082, mailed on Nov. 16, 2010.
Ikemoto: “Communication Terminal and Information Processing System”; U.S. Appl. No. 13/412,772, filed Mar. 6, 2012.
“Antenna Engineering Handbook”, The Institute of Electronics and Communication Engineers, Mar. 5, 1999, pp. 20-21.
Official Communication issued in International Patent Application No. PCT/JP2010/066714, mailed on Dec. 14, 2010.
Nomura et al.: “Antenna and Wireless IC Device”, U.S. Appl. No. 13/419,454, filed Mar. 14, 2012.
Official communication issued in counterpart International Application No. PCT/JP2008/071502, mailed Feb. 24, 2009.
Kato et al.: “Wireless IC Device and Manufacturing Method Thereof,” U.S. Appl. No. 12/432,854, filed Apr. 30, 2009.
Official communication issued in counterpart International Application No. PCT/JP2008/058168, mailed Aug. 12, 2008.
Official communication issued in counterpart International Application No. PCT/JP2008/062886, mailed Oct. 21, 2008.
Kato et al.: “Wireless IC Device,” U.S. Appl. No. 12/469,896, filed May 21, 2009.
Ikemoto et al.: “Wireless IC Device,” U.S. Appl. No. 12/496,709, filed Jul. 2, 2009.
Official communication issued in counterpart International Application No. PCT/JP2008/062947, mailed Aug. 19, 2008.
Official communication issed in counterpart International Application No. PCT/JP2008/056026, mailed Jul. 1, 2008.
Ikemoto.: “Wireless IC Device and Electronic Apparatus,” U.S. Appl. No. 12/503,188, filed Jul. 15, 2009.
Official communication issued in counterpart International Application No. PCT/JP2008/055567, mailed May 20, 2008.
Official communication issued in counterpart International Application No. PCT/JP2008/051853, mailed Apr. 22, 2008.
Official communication issued in counterpart International Application No. PCT/JP2008/057239, mailed Jul. 22, 2008.
Kimura et al.: “Wireless IC Device,” U.S. Appl. No. 12/510,338, filed Jul. 28, 2009.
Kato et al.: “Wireless IC Device,” U.S. Appl. No. 12/510,340, filed Jul. 28, 2009.
Kato: “Wireless IC Device,” U.S. Appl. No. 12/510,344, filed Jul. 28, 2009.
Kato et al.: “Wireless IC Device,” U.S. Appl. No. 12/510,347, filed Jul. 28, 2009.
English translation of NL9100176, published on Mar. 2, 1992.
English translation of NL9100347, published on Mar. 2, 1992.
Kato et al.: “Antenna”; U.S. Appl. No. 11/928,502, filed Oct. 30, 2007.
Kato et al.: “Wireless IC Device”, U.S. Appl. No. 12/211,117, filed Sep. 16, 2008.
Kato et al.: “Antenna”, U.S. Appl. No. 11/688,290, filed Mar. 20, 2007.
Kato et al.: “Electromagnetic-Coupling-Module-Attached Article”; U.S. Appl. No. 11/740,509, filed Apr. 26, 2007.
Kato et al.: “Product Including Power Supply Circuit Board”; U.S. Appl. No. 12/234,949, filed Sep. 22, 2008.
Kato et al.: “Data Coupler”; U.S. Appl. No. 12/252,475, filed Oct. 16, 2008.
Kato et al.; “Information Terminal Device”; U.S. Appl. No. 12/267,666, filed Nov. 10, 2008.
Kato et al.: “Wireless IC Device and Wireless IC Device Composite Component”; U.S. Appl. No. 12/276,444, filed Nov. 24, 2008.
Dokai et al.: “Optical Disc”; U.S. Appl. No. 12/326,916, filed Dec. 3, 2008.
Dokai et al.: “System for Inspecting Electromagnetic Coupling Modules and Radio IC Devices and Method for Manufacturing Electromagnetic Coupling Modules and Radio IC Devices Using the System”; U.S. Appl. No. 12/274,400; filed on Nov. 20, 2008.
Kato: “Wireless IC Device”; U.S. Appl. No. 11/964,185, filed Dec. 26, 2007.
Kato et al.: “Radio Frequency IC Device”; U.S. Appl. No. 12/336,629, filed Dec. 17, 2008.
Kato et al.: “Wireless IC Device and Component For Wireless IC Device”, U.S. Appl. No. 12/339,198, filed Dec. 19, 2008.
Ikemoto et al.: “Wireless IC Device”, U.S. Appl. No. 11/851,651, filed Sep. 7, 2007.
Kataya et al.: “Wireless Ic Device and Electronic Device”; U.S. Appl. No. 11/851,661, filed Sep. 7, 2007.
Dokai et al.: “Antenna and Radio IC Device”; U.S. Appl. No. 12/350,307, filed Jan. 8, 2009.
Official Communication issued in International Patent Application No. PCT/JP2008/063025, mailed on Aug. 12, 2008.
Kato et al.: “Wireless IC Device,” U.S. Appl. No. 12/603,608, filed Oct. 22, 2009.
Kato et al.: “Wireless IC Device,” U.S. Appl. No. 12/688,072, filed Jan. 15, 2010.
Official Communication issued in International Patent Application No. PCT/JP2009/053693, mailed on Jun. 9, 2009.
Kato: “Composite Antenna,” U.S. Appl. No. 12/845,846, filed Jul. 29, 2010.
Official Communication issued in International Patent Application No. PCT/JP2009/053690, mailed on Jun. 2, 2009.
Kato et al.: “Radio Frequency IC Device and Radio Communication System,” U.S. Appl. No. 12/859,340, filed Aug. 19, 2010.
Official Communication issued in International Patent Application No. PCT/JP2009/055758, mailed on Jun. 23, 2009.
Kato et al.: “Wireless IC Device,” U.S. Appl. No. 12/859,880, filed Aug. 20, 2010.
Official Communication issued in International Patent Application No. PCT/JP2009/057482, mailed on Jul. 21, 2009.
Kataya et al.: “Wireless IC Device, Electronic Apparatus, and Method for Adjusting Resonant Frequency of Wireless IC Device,” U.S. Appl. No. 121861,945, filed Aug. 24, 2010.
Kato: “Wireless IC Device and Electromagnetic Coupling Module,” U.S. Appl. No. 12/890,895, filed Sep. 27, 2010.
Official Communication issued in International Patent Application No. PCT/JP2009/059410, mailed on Aug. 4, 2009.
Kato et al.: “Wireless IC Device” U.S. Appl. No. 12/902,174, filed Oct. 12, 2010.
Official Communication issued in International Patent Application No. PCT/JP2009/059259, mailed on Aug. 11, 2009.
Official Communication issued in corresponding Japanese Patent Application No. 2010-506742, mailed on Apr. 6, 2010.
Official Communication issued in International Patent Application No. PCT/JP2009/056698, mailed on Jul. 7, 2009.
Official communication issued in Japanese Application No. 2007-531524, mailed on Sep. 11, 2007.
Official communication issued in Japanese Application No. 2007-531525, mailed on Sep. 25, 2007.
Official communication issued in Japanese Application No. 2007-531524, mailed on Dec. 12, 2007.
Official communication issued in European Application No. 07706650.4, mailed on Nov. 24, 2008.
Mukku-Sha, “Musen IC Tagu Katsuyo-no Subete” “(All About Wireless IC Tags”), RFID, pp. 112-126.
Dokai et al.: “Wireless IC Device and Component for Wireless IC Device”; U.S. Appl. No. 11/624,382; filed on Jan. 18, 2007.
Dokai et al.: “Wireless IC Device, and Component for Wireless IC Device”; U.S. Appl. No. 11/930,818, filed Oct. 31, 2007.
Kato et al.: “Wireless IC Device”; U.S. Appl. No. 12/042,399, filed Mar. 5, 2008.
Official communication issued in related U.S. Appl. No. 12/042,399; mailed on Aug. 25, 2008.
Official Communication issued in International Patent Application No. PCT/JP2009/066336, mailed on Dec. 22, 2009.
Official Communication issued in corresponding Japanese Patent Application No. 2010-509439, mailed on Jul. 6, 2010
Official Communication issued in corresponding Japanese Patent Application No. 2011-032311, mailed on Mar. 29, 2011.
Official Communication issued in corresponding Japanese Patent Application No. 2009-525327, drafted on Sep. 22, 2010.
Official Communication issued in corresponding Japanese Patent Application No. 2011-032311, mailed on Aug. 2, 2011.
Official Communication issued in corresponding Japanese Patent Application No. 2011-032312, mailed on Aug. 2, 2011.
Official Communication issued in corresponding Japanese Patent Application No. 2011-032311, mailed on Aug. 23, 2011.
Kato et al.: “Wireless IC Device Component and Wireless IC Device”; U.S. Appl. No. 13/241,823, filed Sep. 23, 2011.
Kato et al.: “Antenna Device and Method of Setting Resonant Frequency of Antenna Device”; U.S. Appl. No. 13/272,365, filed Oct. 13, 2011.
Official Communication issued in International Patent Application No. PCT/JP2010/056812, mailed on Jul. 13, 2010.
Dokai et al.: “Optical Disc”, U.S. Appl. No. 13/295,153, filed Nov. 14, 2011.
Official Communication issued in International Patent Application No. PCT/JP2010/057668, mailed on Aug. 17, 2010.
Osamura et al.: “Radio Frequency IC Device and Method of Manufacturing the Same”; U.S. Appl. No. 13/308,575, filed Dec. 1, 2011.
Official Communication issued in International Patent Application No. PCT/JP2010/069417, mailed on Dec. 7, 2010.
Kato: “Wireless IC Device and Coupling Method for Power Feeding Circuit and Radiation Plate”; U.S. Appl. No. 13/325,273, filed Dec. 14, 2011.
Official Communication issued in International Application No. PCT/JP2007/066007, mailed on Nov. 27, 2007.
Dokai et al.: “Wireless IC Device and Component for Wireless Ic Device”; U.S. Appl. No. 12/359,690, filed Jan. 26, 2009.
Dokai et al.: “Test System For Radio Frequency IC Devices and Method of Manufacturing Radio Frequency IC Devices Using The Same”, U.S. Appl. No. 12/388,826, filed Feb. 19, 2009.
Official Communication issued in International Application No. PCT/JP2008/061955, mailed on Sep. 30, 2008.
Official Communication issued in International Application No. PCT/JP2007/066721, mailed on Nov. 27, 2007.
Official Communication issued in International Application No. PCT/JP2007/070460, mailed on Dec. 11, 2007.
Kato et al.: “Wireless IC Device”; U.S. Appl. No. 12/390,556, filed Feb. 23, 2009.
Kato et al.: “Inductively Coupled Module and Item With Inductively Coupled Module”; U.S. Appl. No. 12/398,497, filed Mar. 5, 2009.
Official Communication issued in International Patent Application No. PCT/JP2008/050945, mailed on May 1, 2008.
Kato et al.: “Article Having Electromagnetic Coupling Module Attached Thereto”; U.S. Appl. No. 12/401,767, filed Mar. 11, 2009.
Taniguchi et al.: “Antenna Device and Radio Frequency IC Device”; U.S. Appl. No. 12/326,117, filed Dec. 2, 2008.
Ofifice Communication issed in International Patent Application No. PCT/JP2008/061442, mailed on Jul. 22, 2008.
Kato et al.: “Container With Electromagnetic Coupling Module”; U.S. Appl. No. 12/426,369, filed Apr. 20, 2009.
Kato: “Wireless IC Device”, U.S. Appl. No. 12/429,346, filed Apr. 24, 2009.
Official Communication issued in International Patent Application No. PCT/JP2009/056934, mailed on Jun. 30, 2009.
Kato et al.: “Wireless IC Device”; U.S. Appl. No. 12/903,242, filed Oct. 13, 2010.
Kato et al.: “Wireless IC Device”; U.S. Appl. No. 12/940,103, filed Nov. 5, 2010.
Kato et al.: “Wireless IC Device System and Method of Determining Authenticity of Wireless IC Device”; U.S. Appl. No. 12/940,105, filed Nov. 5, 2010.
Official Communication issued in International Patent Application No. PCT/JP2009/059669, mailed on Aug. 25, 2009.
Official Communication issued in International Patent Application No. PCT/JP2009/062181, mailed on Oct. 13, 2009.
Official Communication issued in corresponding Japanese Application No. 2010-501323, mailed on Apr. 6, 2010.
Kato et al.: “Component of Wireless IC Device and Wireless IC Device”; U.S. Appl. No. 12/944,099 filed Nov. 11, 2010.
Kato et al.: “Wireless IC Device and Manufacturing Method Thereof”; U.S. Appl. No. 12/961,599, filed Dec. 7, 2010.
Kataya et al.: “Radio Frequency IC Device and Electronic Apparatus”; U.S. Appl. No. 12/959,454, filed Dec. 3, 2010.
Ikemoto et al.: “Radio IC Device”; U.S. Appl. No. 12/981,582, filed Dec. 30, 2010.
Official Communication issued in International Patent Application No. PCT/JP2009/062801, mailed on Oct. 27, 2009.
Ikemoto et al.: “Wireless IC Device and Electronic Apparatus”; U.S. Appl. No. 13/022,695, filed Feb. 8, 2011.
Official Communication issued in International Patent Application No. PCT/JP2009/067778, mailed on Jan. 26, 2010.
Kato: “Wireless IC Device and Method for Manufacturing Same”; U.S. Appl. No. 13/022,693, filed Feb. 8, 2011.
Kato: “Wireless IC Device”, U.S. Appl. No. 13/080,781, filed Apr. 6, 2011.
Official communication issued in counterpart European Application No. 08 77 7758, dated on Jun. 30, 2009.
Official communication issued in counterpart Japanese Application No. 2008-103741, mailed on May 26, 2009.
Official communication issued in counterpart Japanese Application No. 2008-103742, mailed on May 26, 2009.
Official communication issued in International Application No. PCT/JP2008/050358, mailed on Mar. 25, 2008.
Official communication issed in International Application No. PCT/JP2008/050356, mailed on Mar. 25, 2008.
Osamura et al.: “Packaging Material With Electromagnetic Coupling Module,” U.S. Appl. No. 12/536,663, filed Aug. 6, 2009.
Osamura et al.: “Packaging Material With Electromagnetic Coupling Module,” U.S. Appl. No. 12/536,669, filed Aug. 6, 2009.
Dokai et al.: “Wireless IC Device and Component for Wireless IC Device,” U.S. Appl. No. 12/543,553, filed Aug. 19, 2009.
Shioya et al.: “Wireless IC Device,” U.S. Appl. No. 12/551,037, filed Aug. 31, 2009.
Ikemoto: “Wireless IC Device and Manufacturing Method Thereof,” U.S. Appl. No. 12/579,672, filed Oct. 15, 2009.
Official communication issued in International Application No. PCT/JP2008/058614, mailed on Jun. 10, 2008.
Related Publications (1)
Number Date Country
20120176223 A1 Jul 2012 US
Continuations (1)
Number Date Country
Parent PCT/JP2010/066714 Sep 2010 US
Child 13421889 US