Patent Application
20070285819
The present invention, as illustrated in
Still further, the wireless inductive coupling assembly 10 comprises a receiving coil 17 and a sending coil 18. The receiving coil 17 is disposed in the panel frame 12, where the receiving coil 17 is in electrical communication with the metal oxide coating 11 on the dielectric panel 20, via the bus bars 26. On the other hand, the sending coil 18 is disposed in the opening frame 14, where the sending coil 18 is in wireless inductive electrical communication with the receiving coil 17, and where the sending coil 18 is further in electrical communication 22 (that includes wires, conduit, and the like) with an electrical power source 24.
In order to control and to supply power to the coils 17,18 and the dielectric panel 20, the electrical power source 24 may comprise a solid-state controller (as used herein, the solid-state controller is an electronic device that comprises a microprocessor), a power supply, sensors, a triac circuit, and input/output circuitry as that contained in U.S. Application Publication No. 2003/0127452 to Gerhardinger et al., which is incorporated herein by reference in its entirety. See, for example,
Thus, when electrical power from the electrical power source 24 is communicated to the sending coil 18, an electrical current is induced in the receiving coil 17, which in turn causes electrical current I (as shown in
Hence, in the present invention, heating is not directly provided by an inductive flux from the coils 17,18. Instead, heating is provided by the panel 20, which utilizes electrical current I from the receiving coil 17.
In the present invention, the coating 11 may be a chemical vapor deposited metal oxide, like tin oxide, where the metal oxide is rendered electrically conductive by the inclusion of a dopant, such as fluorine, indium, and antimony. As such, the conductive thin-film coating 11 may be precisely and uniformly disposed on a suitable substrate 20a at a thickness of one micron or less.
The metal oxide may also possess low emissivity (low-E) thermal properties, such that much of the heat energy generated by the conductive coating is radiated into the dielectric sheet and then such heat energy is radiated away from the dielectric sheet, which may be transparent, opaque, or translucent.
Subsequently, objects and/or people are beneficially heated by way of heat radiation of such heat energy from the heated dielectric material or by way of convection of heated air. These processes result in little heat being wasted (see U.S. Pat. Nos. 7,039,304 and 7,041,942 to Gerhardinger et al., which are incorporated herein by reference in their entirety).
Although
Also, the above described dielectric panel 20 may be embodied, for example, as an architectural panel, a commercial panel assembly (for example, a commercial refrigerator or freezer door), an automotive panel assembly, or an appliance panel assembly, to name just a few. Therefore, depending on the embodiment of the present invention, the reference item 25 might be a building member when the heated dielectric panel assembly 15 is an architectural panel with a sash (panel frame) and a jamb (opening frame), might be a food freezer when the heated dielectric panel assembly 15 is a commercial panel, might be a vehicle body member when the heated dielectric panel assembly 15 is an automotive panel (e.g., a rear window or a mirror), or might be a cooktop when the heated dielectric panel assembly 15 is an appliance panel (as in U.S. Pat. Nos. '304 and '942).
Another example of an appliance panel assembly is a food item holding bin in a restaurant, where dielectric panels 20 could be utilized as heated glass doors to keep, for example, hamburger buns warm prior to utilizing the buns in hamburger sandwiches. Also, the various embodiments of the present invention may be in the form of laminated structures and/or insulating glass structures.
It has been found, while operating the electrical power source 24 at typical power line AC frequencies (i.e., 50/60 Hz) to heat the dielectric panel 20, that an efficiency power coupling of only 50% or less is obtained. In addition, when large ferromagnetic cores are utilized, the coils 17,18 undesirably vibrate and magnetically couple together when the coils 17,18 are energized.
However, while operating the electrical power source 24 at an AC frequency in the range of 20-40 kilohertz (i.e., nominally at 30 KHz) to power the dielectric panel 20, it has been found in the instant invention that an efficiency power coupling of 92% or higher is obtained. This is achieved by the wireless inductive coupling assembly 10, when the coils 17,18 are separated by the combined outside thicknesses of the panel frame 12 and the opening frame 14.
Although the present invention is not limited to any particular output, the following example is given as an insight to providing a 500 watt wireless inductive coupling assembly. A glass panel 20 with a coating 11 that is rated at a maximum of 25 watts per square foot, may be utilized in a typical heated slider door that measures seven feet by three feet (i.e., 21 square feet). Therefore, 25 watts per square foot times 21 square feet would provide approximately 500 watts for heating the sliding door. Of course, higher power applications would simply use a larger power supply and would cost more.
In contrast to the efficiency power coupling of 92% or higher that is obtained in the present invention, Sasaki, who was mentioned earlier, utilizes three coils (i.e., a first work coil, an induction coil, and a second work coil) to directly inductively heat a metal pan by way of inductive flux “eddy current losses.”
Also, due to the inducement of current flow (i.e., between the coils 17,18) in the present invention, electrical shock hazard is virtually eliminated and the wiring to the heated dielectric panel assembly 15 is simplified, thus electrically isolating the electrical power source 24 from the dielectric panel 20. Since there are no wires and electrical contacts between the panel frame 12 and the opening frame 14, electrical reliability of the heated dielectric panel assembly 15 is greatly improved over existing heated glass assemblies and NEC and UL standards are met or exceeded.
Using the above-stated structure of the present invention, it is preferable that a non-iron core 27 (i.e., non-magnetic) be utilized to couple the coils 17,18, where the core 27 may comprise, for example, a ferrite (which also minimizes the size of the coils 17,18) or where an air core 27 may be utilized. Further, one or more of the coils 17,18 may be wound with Litz wire (which is known to be comprised of very fine multi-strand copper that basically eliminates magnetic coupling), and the panel frame 12 and the opening frame 14 are not comprised of iron/steel (i.e., not comprised of magnetic material).
Hence, as illustrated in
The electrical power source 24, when embodied as a microprocessor utilizing software, may incorporate features to detect proper current draw by the dielectric panel 20 and, therefore, “know” when the coils 17,18 are aligned. For example, if a window/door 15 is opened/closed, then the electrical power source 24 would not attempt to power up the sending coil 18 unless the receiving coil 17 is in the proximity of the sending coil 18. Furthermore, the electrical power source 24 may regulate the power output to respond to faults (such as sensing broken glass or bad connectors), act as a fail-safe feature so as to insure safe operation under varying conditions, and to regulate heated dielectric panel assembly temperatures similar to that described in U.S. Application Publication '452 and as illustrated in
As discussed above, the arrangement of the coils 17,18 of the present invention may not be applicable in ferrous (e.g., steel) frames 12,14. However, frames 12,14 of aluminum, wood, polyvinylchloride (PVC), and the like would be applicable.
Thus, the present invention provides an indirect electrical connectivity means to communicate electrical energy to a heated glass panel assembly 15 that is reliable, electrically safe, and energy efficient.
In accordance with the provisions of the patent statutes, the principles and modes of operation of this invention have been described and illustrated in its preferred embodiments. However, it must be understood that the invention may be practiced otherwise than specifically explained and illustrated without departing from its spirit or scope.
