Claims
- 1. A wiring method for a resin mold product, comprising the steps of:providing a resin mold product having side walls facing each other; receiving wires at wire receiving portions formed between said side walls, said side walls having discrete protrusions which protrude from said side walls and are situated higher than said wires; and melting said discrete protrusions towards said wires to weld and secure said wires to the resin mold product.
- 2. A wiring method according to claim 1, whereinsaid resin mold product is a pillar trim mounted to a front pillar, and said wires have the same length as the front pillar, and said wires connect circuits mounted on an instrument panel and roof.
- 3. A wiring method according to claim 1, whereinsaid protrusions are formed on a bottom surface of said wire receiving portion.
- 4. A wiring method according to claim 3, whereinsaid resin mold product is a pillar trim mounted to a front pillar, and said wires have the same length as the front pillar, and said wires connect circuits mounted on an instrument panel and roof.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8-351490 |
Dec 1996 |
JP |
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Parent Case Info
This application is a division of prior, application Ser. No. 08/995,558 filed Dec. 22, 1997 now U.S. Pat. No. 6,033,745, filed on Mar. 7, 2000.
US Referenced Citations (9)
Foreign Referenced Citations (2)
Number |
Date |
Country |
8-37719 |
Feb 1996 |
JP |
8-45570 |
Feb 1996 |
JP |