This application claims the benefit under 35 USC § 119(a) of Korean Patent Application No. 10-2021-0102383, filed on Aug. 4, 2021, in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes.
The following description relates to real wood skin used for automatic wrapping, and a process and apparatus for manufacturing the same.
Real wood skin applied to a vehicle in the related art is made by preforming a real wood sheet on deco-veneer wood and then performing insert-injection molding (back injection).
Thereafter, trimming is performed on an end of the injection-molded real wood sheet, and then curling and coating are sequentially performed on the real wood sheet, thereby manufacturing the real wood skin.
The typical real wood skin product, which is made by applying the back insert-injection molding process, may provide real wood having a visually and tactilely excellent surface. However, because the real wood having high hardness is attached to the injection-molded part, the real wood provides cheeping feeling to a customer when the customer pushes the real wood.
Of course, some customers may think that it is natural for the real wood to have high hardness. However, a customer, who needs soft interior materials, cannot be satisfied with the real wood.
This Summary is provided to introduce a selection of concepts in a simplified form that is further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
In a general aspect, a wood preforming device includes a lower press mold, comprising a debossed portion disposed on a portion of the lower press mold on which a product is to be formed, and a support portion configured to support an upper press mold when the lower press mold and the upper press mold press each other, the support portion configured to have a fixing protrusion to fix a real wood sheet; a movable core disposed on the debossed portion of the lower press mold and configured to guide the real wood sheet by moving in an upward direction from the debossed portion when the upper press mold moves in a downward direction; and a steam module configured to spray steam with a preset capacity to an edge portion of the debossed portion, wherein the upper press mold is configured to have an embossed portion that corresponds to the debossed portion of the lower press mold.
The steam module may be configured to operate when the embossed portion of the upper press mold and the debossed portion of the lower press mold press each other.
The steam module may be configured to implement at least one of a moisture and an aqueous stain.
The steam module may be configured to spray the steam to the real wood sheet mold for a preset heating time when the real wood sheet is seated on the lower press before the embossed portion of the upper press mold and the debossed portion of the lower press mold press each other.
In a general aspect, a wood preforming method includes fixing a real wood sheet to a fixing pin of a lower press mold; moving an upper press mold in a downward direction toward the lower press mold; spraying, by a steam module disposed at an edge of the lower press mold, steam with a preset capacity to a debossed portion of the lower press mold before a compression of the real wood sheet; forming a seating hole in the real wood sheet by moving a hole machining pin disposed on the lower press mold in an upward direction; and detaching a preformed real wood sheet by moving the upper press mold in an upward direction.
In the moving of the upper press mold in the downward direction toward the lower press mold, a movable core disposed on the debossed portion of the lower press mold may be configured to guide the real wood sheet while the movable core moves in the upward direction from the debossed portion, and then moves in the downward direction together with the upper press mold when the upper press mold moves in the downward direction.
In the spraying of the steam, moisture to be sprayed by the steam module may be heated to a temperature that is equal to or greater than a threshold temperature.
In the spraying of the steam, one of a moisture and an aqueous paint may be implemented as moisture sprayed by the steam module.
Other features and aspects will be apparent from the following detailed description, the drawings, and the claims.
Throughout the drawings and the detailed description, the same reference numerals may refer to the same, or like, elements. The drawings may not be to scale, and the relative size, proportions, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience.
The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent after an understanding of the disclosure of this application. For example, the sequences of operations described herein are merely examples, and are not limited to those set forth herein, but may be changed as will be apparent after an understanding of the disclosure of this application, with the exception of operations necessarily occurring in a certain order. Also, descriptions of features that are known, after an understanding of the disclosure of this application, may be omitted for increased clarity and conciseness, noting that omissions of features and their descriptions are also not intended to be admissions of their general knowledge.
The features described herein may be embodied in different forms, and are not to be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways of implementing the methods, apparatuses, and/or systems described herein that will be apparent after an understanding of the disclosure of this application.
The terminology used herein is for the purpose of describing particular examples only, and is not to be used to limit the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the term “and/or” includes any one and any combination of any two or more of the associated listed items. As used herein, the terms “include,” “comprise,” and “have” specify the presence of stated features, numbers, operations, elements, components, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, elements, components, and/or combinations thereof. The use of the term “may” herein with respect to an example or embodiment (for example, as to what an example or embodiment may include or implement) means that at least one example or embodiment exists where such a feature is included or implemented, while all examples are not limited thereto.
Although terms such as “first,” “second,” and “third” may be used herein to describe various members, components, regions, layers, or sections, these members, components, regions, layers, or sections are not to be limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or section from another member, component, region, layer, or section. Thus, a first member, component, region, layer, or section referred to in examples described herein may also be referred to as a second member, component, region, layer, or section without departing from the teachings of the examples.
Throughout the specification, when an element, such as a layer, region, or substrate, is described as being “on,” “connected to,” or “coupled to” another element, it may be directly “on,” “connected to,” or “coupled to” the other element, or there may be one or more other elements intervening therebetween. In contrast, when an element is described as being “directly on,” “directly connected to,” or “directly coupled to” another element, there can be no other elements intervening therebetween. Likewise, expressions, for example, “between” and “immediately between” and “adjacent to” and “immediately adjacent to” may also be construed as described in the foregoing.
Unless otherwise defined, all terms, including technical and scientific terms, used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains consistent with and after an understanding of the present disclosure. Terms, such as those defined in commonly used dictionaries, are to be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and are not to be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The one or more examples may provide a real wood sheet that visually provides a real wood feeling, a crash pad for a vehicle that provides flexibility by implementing the real wood sheet, and a press device that manufactures a crash pad for a vehicle.
The one or more examples provide a real wood sheet that is implemented for wrapping during a process of manufacturing a crash pad for a vehicle, and a press device that manufactures crash pad for a vehicle implementing the real wood sheet.
As illustrated in
The wood layer 101 is a layer that may provide the same visual feeling or appearance of a wooden material. The wood layer 101 may have a thickness of 0.1 t to 0.2 t and may have a grain of wood made by a shading machine.
Further, the mesh layer 102 is a layer stacked on a lower portion of the wood layer 101 and configured to reinforce a sheet. The mesh layer 102 may have a thickness of 0.2 t.
In addition, the flexible layer 103 is a layer stacked on a lower portion of the mesh layer 102 and configured to provide flexibility. The flexible layer 103 may be made of one of polypropylene (PP) foam and thermoplastic polyolefin (TPO) foam. Further, the flexible layer 103 may have a thickness of 1 t to 2 t.
In addition, according to the first embodiment of the present disclosure, the real wood skin may further include a protective film 104 stacked on an upper portion of the wood layer 101 and configured to protect the wood layer. The protective film 104 may have a thickness of 0.1 t.
As illustrated in
A method of manufacturing a real wood sheet to wrap a crash pad, in accordance with one or more embodiments, will be described with reference to
To this end, a real wood sheet 100 manufactured by the above-mentioned method of manufacturing a real wood sheet may be formed to have the same shape as a real wood product, as illustrated in
Thereafter, a plurality of wood sheet compression fixing rib portions 120 and a plurality of wrapping fixing rib portions 130 are formed at an outer periphery of the real wood sheet main body part 110 in order to fixing the real wood sheet 100 to a preforming press or compression press during the process (operation S120). The plurality of wood sheet compression fixing rib portions 120 may be formed on the raw real wood sheet by using a forming device (cutter).
First fixing holes 121 are formed in the compressing fixing rib portions 120 so as to be fixed to fixing pins of the preforming press during the preforming process (operation S130).
The first fixing holes 121, which are formed as described above, are fixed to the fixing pins of the press during the preforming process. Meanwhile, as illustrated in
Therefore, when the upper press mold and the lower press mold press each other for preforming, the fixing pin of the preforming press may move along the slit groove 122 in the first fixing hole 121, as illustrated in
That is, when the preforming process is performed on the real wood sheet 100 in the state in which the first fixing holes 121 of the real wood sheet 100 are fixed to the fixing pins of the preforming press, the first fixing holes 121 may be expanded, as illustrated in
Thereafter, during the wood press process, a hole machining pin of a preforming press is used to form second fixing holes 131 in the plurality of wrapping fixing rib portions 130 during a preforming fixing process in order to fix the real wood sheet to pins of a press forming device (S140).
Meanwhile, positions at which the first fixing holes 121 are formed in the compressing fixing rib portion 120 may be defined depending on an elongation percentage of the real wood.
As illustrated in
The lower press mold 210 includes: a debossed portion 211 formed in a portion on which a real wood sheet product is mounted and formed; and a support portion 212 configured to support the upper press mold 220 when the upper press mold and the lower press mold press each other. The lower press mold 210 includes fixing pins 213 configured to fix the real wood sheet 100 to the support portion 212.
The upper press mold 220 includes an embossed portion 221 corresponding to the debossed portion 211 of the lower press mold 210.
The movable core 230 is provided on the debossed portion 211 of the lower press mold 210. The movable core 230 guides the real wood sheet 100 while moving upward from the debossed portion 211 and then moving downward when the upper press mold 220 moves downward.
Meanwhile, the fixing pins 213 may be provided at positions set depending on an elongation percentage of the sheet calculated in respect to an edge portion of the real wood sheet 100 when the real wood sheet 100 is compressed.
Further, the lower press mold 210 may further include hole machining pins 214 configured to form the fixing holes in the wrapping fixing rib portions 130 of the real wood sheet 100 by protruding when the embossed portion 221 of the upper press mold 220 and the debossed portion 211 of the lower press mold 210 press each other.
The hole machining pins 214 may also form the second fixing holes 131 in the wrapping fixing rib portions 130 of the real wood sheet 100 by protruding when the fixing pins 213 provided on the lower press mold 210 are pressed by the upper press mold 220.
As illustrated in
Thereafter, as illustrated in
In this state, the upper press mold 100 moves downward. In this case, as illustrated in
Thereafter, as illustrated in
Meanwhile, as illustrated in
As described above, according to the fourth embodiment, the fixing holes desired for the step of forming the real wood sheet may be automatically formed during the preforming process. Therefore, it is possible to reduce the total number of additional processes while preventing the positions of the fixing holes from being changed by the preforming process.
That is, it is possible to solve the problem in that the positions of the fixing holes are changed as the real wood sheet is compressed by the press device in the preforming process step when the fixing holes required for the compression process are formed during an initial preforming process.
As illustrated in
The lower press mold 210 includes: a debossed portion 211 formed in a portion on which a real wood sheet product is mounted and formed; and a support portion 212 configured to support the upper press mold 220 when the upper press mold and the lower press mold press each other. The lower press mold 210 includes fixing pins 213 configured to fix the real wood sheet 100 to the support portion 212.
The upper press mold 220 includes an embossed portion 221 corresponding to the debossed portion 211 of the lower press mold 210.
The movable core 230 is provided on the debossed portion 211 of the lower press mold 210. The movable core 230 may guide the real wood sheet 100 while moving upward from the debossed portion 211 and then moving downward when the upper press mold 220 moves downward.
The steam module 240 sprays steam with a preset capacity to an edge portion of the debossed portion of the lower press mold 210. As illustrated in
Meanwhile, the steam module 240 may spray the steam with a preset capacity to the edge of the debossed portion 211 of the lower press mold 210 when the embossed portion 221 of the upper press mold 220 and the debossed portion 211 of the lower press mold 210 press each other. That is, as illustrated in
Meanwhile, the steam module 240 according to the present embodiment may heat moisture to a predetermined temperature or higher and then spray heated steam. The steam module 240 may use aqueous stain which is aqueous paint.
Thereafter, as illustrated in
According to the fourth embodiment, it is possible to prevent the real wood sheet from being damaged by the press which is pressed during the process of compressing the real wood sheet 100 or the preforming process.
Meanwhile, in the fourth embodiment, the steam module may first perform the process of heating the real wood sheet by spraying heated steam to the real wood sheet before the upper press mold and the lower press mold press each other.
According to the fourth embodiment, it is possible to reduce damage to the real wood sheet caused by the preforming process while performing the preforming process on the real wood sheet.
Hereinafter, a wood preforming method of manufacturing a crash pad for a vehicle including a real wood sheet according to the fourth embodiment will be described with reference to
First, the real wood sheet 100 is fixed to the fixing pins 213 of the lower press mold 210 (operation S1401).
Next, the upper press mold 220 moves downward toward the lower press mold 210 (operation S1402). In this case, the movable core 230 may be provided on the debossed portion 211 of the lower press mold 210 and may guide the real wood sheet 100 while moving upward from the debossed portion 211 and then moving downward when the upper press mold 220 moves downward.
In this case, the steam module 240 sprays steam with a preset capacity to the debossed portion of the lower press mold 210 before the upper press mold 220 and the lower press mold 210 are used to compress the real wood sheet 100 (S1403). That is, the steam module supplies moisture to the real wood sheet by spraying steam to corner portions before the upper press mold 220 and the lower press mold 210 completely press each other, thereby applying a pressure for forming. In this case, the moisture may be heated to a predetermined temperature or higher and then sprayed by the steam module 240. Aqueous stain, which is aqueous paint, may be used.
Thereafter, the hole machining pins provided on the lower press mold move upward and form the holes in the real wood sheet, i.e., form seating hole
s used when the press molds press each other (operation S1404).
Next, the preformed real wood sheet is detached by moving the upper press mold 220 upward (operation S1405).
Each step included in the method described above may be implemented as a software module, a hardware module, or a combination thereof, which is executed by a computing device.
Also, an element for performing each step may be respectively implemented as first to two operational logics of a processor.
The devices, apparatuses, units, modules, and components described herein with respect to
The methods that perform the operations described in this application, and illustrated in
Instructions or software to control computing hardware, for example, one or more processors or computers, to implement the hardware components and perform the methods as described above may be written as computer programs, code segments, instructions or any combination thereof, for individually or collectively instructing or configuring the one or more processors or computers to operate as a machine or special-purpose computer to perform the operations that be performed by the hardware components and the methods as described above. In one example, the instructions or software include machine code that is directly executed by the one or more processors or computers, such as machine code produced by a compiler. In another example, the instructions or software include higher-level code that is executed by the one or more processors or computers using an interpreter. The instructions or software may be written using any programming language based on the block diagrams and the flow charts illustrated in the drawings and the corresponding descriptions in the specification, which disclose algorithms for performing the operations that are performed by the hardware components and the methods as described above.
The instructions or software to control computing hardware, for example, one or more processors or computers, to implement the hardware components and perform the methods as described above, and any associated data, data files, and data structures, may be recorded, stored, or fixed in or on one or more non-transitory computer-readable storage media. Examples of a non-transitory computer-readable storage medium include read-only memory (ROM), random-access programmable read only memory (PROM), EEPROM, RAM, DRAM, SRAM, flash memory, non-volatile memory, CD-ROMs, CD-Rs, CD+Rs, CD-RWs, CD+RWs, DVD-ROMs, DVD-Rs, DVD+Rs, DVD-RWs, DVD+RWs, DVD-RAMs, BD-ROMs, BD-Rs, BD-R LTHs, BD-REs, blue-ray or optical disk storage, hard disk drive (HDD), solid state drive (SSD), flash memory, a card type memory such as multimedia card micro or a card (for example, secure digital (SD) or extreme digital (XD)), magnetic tapes, floppy disks, magneto-optical data storage devices, optical data storage devices, hard disks, solid-state disks, and any other device that is configured to store the instructions or software and any associated data, data files, and data structures in a non-transitory manner and provide the instructions or software and any associated data, data files, and data structures to one or more processors and computers so that the one or more processors and computers can execute the instructions. In one example, the instructions or software and any associated data, data files, and data structures are distributed over network-coupled computer systems so that the instructions and software and any associated data, data files, and data structures are stored, accessed, and executed in a distributed fashion by the one or more processors or computers.
While this disclosure includes specific examples, it will be apparent to one of ordinary skill in the art, after an understanding of the disclosure of this application, that various changes in form and details may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only, and not for purposes of limitation. Descriptions of features or aspects in each example are to be considered as being applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed in a different order, and/or if components in a described system, architecture, device, or circuit are combined in a different manner, and/or replaced or supplemented by other components or their equivalents.
Therefore, the scope of the disclosure is defined not by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are to be construed as being included in the disclosure.
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10-2021-0102383 | Aug 2021 | KR | national |
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