The present disclosure relates to an X-ray source, and more particularly, to an X-ray tube having a stable characteristic at a high voltage.
An X-ray tube generates electrons at the inside of a vacuum container, accelerates the electrons at an anode direction, in which a high voltage is applied, and makes the electrons collide with a metal target the anode to generate an X-ray. In this case, a voltage difference between the anode and a cathode is defined as an accelerating voltage, which accelerates the electrons, and accelerates the electrons at the accelerating voltage of several to several hundreds of kV depending on a usage of an X-ray tube. A gate electrode, a focusing electrode, and the like are present between the anode and the cathode.
The present disclosure has been made in an effort to solve the above-described problems associated with the prior art, and provides an X-ray source having a stable characteristic when a high voltage is applied.
An exemplary embodiment of the present disclosure provides an X-ray source, including: a cathode; an anode positioned on the cathode so as to face the cathode; emitters formed on the cathode; a gate electrode positioned between the cathode and the anode and including openings at positions corresponding to those of the emitters; an insulating spacer formed between the gate and the anode; and a coating layer formed on an internal wall of the insulating spacer, and including a material having a lower secondary electron emission coefficient than that of the insulating spacer.
An exemplary embodiment of the present disclosure provides an X-ray source, including: a cathode; an anode positioned on the cathode so as to face the cathode; emitters formed on the cathode; a gate electrode positioned between the cathode and the anode and including openings at positions corresponding to those of the emitters; an insulating spacer positioned under the cathode; and a coating layer formed on an upper surface of the insulating spacer, and including a material having a lower secondary electron emission coefficient than that of the insulating spacer.
The coating layer, which has a lower secondary electron emission coefficient than that of the insulating spacer, is formed on the insulating spacer. Accordingly, it is possible to decrease the generation of the secondary electrons, so that it is possible to manufacture the X-ray source having a stable characteristic at a high voltage.
Example embodiments will now be described more fully hereinafter with reference to the accompanying drawings; however, they may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the example embodiments to those skilled in the art.
In the drawing figures, dimensions may be exaggerated for clarity of illustration. It will be understood that when an element is referred to as being “between” two elements, it can be the only element between the two elements, or one or more intervening elements may also be present. Like reference numerals refer to like elements throughout.
Hereinafter, the exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings in detail so that those skilled in the art may easily carry out the present disclosure.
Referring to
The cathode 11 may be positioned so as to face the anode 14, and the anode 14 may be positioned on the cathode 11 while being spaced apart from the cathode 11 at a predetermined distance. A lower surface of the anode 14, that is, a surface of the anode facing the cathode 11, may be inclined at a predetermined angle.
The emitters 12 are formed on the cathode 11. For example, the emitters 12 may be carbon nano tube emitters, and may be arranged in a dot array form. The gate electrode 13 may be positioned on the cathode 11, and may include openings at positions corresponding to those of the emitters 12. When a plurality of emitters 12 is formed on the cathode 12, the gate electrode 13 includes a plurality of openings. For example, the gate electrode 13 may have a mesh form.
The insulating spacer 15 may be formed between the gate 13 and the anode 14, and may have a tube form. An E-beam is generated and accelerated in a vacuum atmosphere, so that an X-ray source needs to be completely sealed or continuously maintain a degree of inside vacuum through a vacuum pump. Accordingly, the insulating spacer 15 may be formed of a material, such as ceramic, an aluminum oxide, an aluminum nitride, and glass, having an excellent high voltage characteristic.
The coating layer 16 is formed on the insulating spacer 15. The coating layer 16 is for the purpose of preventing the insulating spacer 15 and the electrons from colliding with each other and secondary electrons from being generated, and includes a material having a lower secondary electron emission coefficient than that of the insulating spacer 15, for example, a material having a secondary electron emission coefficient of 1 or less. For example, the coating layer 16 includes a chromic oxide (Cr2O3), a titanium oxide (TiO2).
According to the aforementioned structure, the E-beam emitted from the emitters 12 passes through the opening of the gate electrode 13 and is focused at the anode 14, and the E-beam collides with the anode 14 to generate an X-ray.
However, when the accelerating voltage is increased, a triple junction, at which three materials, that is, vacuum, a metal, and a dielectric substance (the insulating spacer), meet, is generated in a region of the insulating spacer 15, in which the voltage is relatively low. Further, an electric field is concentrated at the triple junction, so that an abnormal emission of the electrons and the like may be caused. Particularly, since the material used as the insulating spacer 15 has a high secondary electron generation coefficient, a lot of secondary electrons may be generated by the electrons generated at the triple junction or the electrons emitted from the emitters 12. In this case, an internal wall of the insulating spacer 15 may be electrified with positive (+) charges, and thus an operation of the X-ray source may become unstable. Otherwise, the electrified charges may be discharged, so that the X-ray source may be damaged.
Accordingly, in the X-ray source according to the exemplary embodiment of the present disclosure, the coating layer 16 is formed on the insulating spacer 15. If the coating layer 16 is coated on the internal wall of the insulating spacer 15, it is possible to prevent the charges from being accumulated on the internal wall of the insulating spacer 15 by the abnormal electrons generated at the triple junction, the electrons generated in the emitters 12, and the like. Here, the coating layer 16 may be formed on the entirety or a part of the internal wall of the insulating spacer 15. Further, the coating layer 16 may be formed of a single material, or may be formed of a plurality of materials having different secondary electron generation coefficients.
Referring to
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For reference, in a case of a structure, in which the E-beam does not pass through a space having a vacuum atmosphere, it is possible to obtain a high withstand voltage characteristic by forming the coating layer 16. However, when the E-beam passes through the space having the vacuum atmosphere and reaches the anode 14, a surrounding region of the anode 14 may be electrified with a lower potential than the voltage of the anode by the coating layer 16 and may become unstable. Accordingly, it is possible to promote the stability by locating the material having a relatively high secondary electron emission coefficient in the surrounding region of the anode 14 by exposing the insulating spacer 15 in the surrounding region of the anode 14 by controlling the region, in which the coating layer 16 is formed. Further, the coating layer 16 may generally have a uniform thickness (W1=W2) or may have a decreasing thickness (W1<W2) while being closer to the anode 14.
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In the meantime, the form of the coating layer 16 described with reference to
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Further, in the present drawing, the case where the X-ray source includes the coating layer 16 described with reference to
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Here, the insulating spacer 25 may be positioned under the cathode 21, and may have a plate form. The coating layer 26 is formed on an upper surface of the insulating spacer 25, and is positioned in a surrounding region of the cathode 21. For example, the coating layer 26 may be interposed between the spacer 28 and the insulating spacer 25, and may be positioned under the cathode 21. Further, the coating layer 26 may be formed with a larger area than that of the cathode 21. Accordingly, it is possible to efficiently prevent an electric field from being concentrated at a triple junction.
Referring to
The cathode 31 and the anode 32 are positioned while facing each other, and the anode 32 is positioned on the cathode 31. The cathode sheet 39 may be attached onto an upper surface of the cathode 31, and the carbon nano tube emitters 38 may be formed on the cathode sheet 39 in a dot array form. The anode target 33 may be attached onto a lower surface of the anode 32.
The insulating spacer 34 having a tube form is positioned between the cathode 31 and the anode 32. The coating layer 43 may be formed on an internal wall of the insulating spacer 34. Here, the coating layer 43 is formed of a material having a lower secondary electron emission coefficient than that of the insulating spacer 34, and may have various forms described with reference to
The gate electrode 36 may be positioned between the cathode 31 and the anode 32, and the gate spacer 40 may be positioned between the gate electrode 36 and the cathode 31. The gate electrode 36 may be positioned between the cathode 31 and the anode 32, and may include the gate mesh 37. The gate mesh 37 may include gate holes formed at a position corresponding to the array of the carbon nano tube emitters 38. A thickness of the gate mesh may be about 0.1 mm.
The gate electrode 36 may have a cylindrical structure inserted into the insulating spacer 34, and for example, the gate electrode 36 may be inserted into the insulating spacer in about 10 mm. As described above, when the gate electrode 36 is formed in the cylindrical structure inserted into the insulating spacer 34, the electrons which pass through the gate mesh 37 may be easily focused to the anode target 33. That is, it is not necessary to form a separate focusing electrode for focusing the E-beam.
Further, the screw tap 41 may be formed on an exterior surface of the anode 32, that is, an exterior surface of the cathode 31 and an exterior surface of the gate electrode 36, and the braising adapter 44 may be formed between the insulating spacer 34 and the anode 32. The non-volatile getter 42 may be located between the cathode 31 and the gate spacer 40, and an alignment recess may be formed on exterior surfaces of the anode 32, the braising adapter 44, the gate electrode 36, the cathode 31, and the like. Further, the gate electrode 36 may include an alignment protrusion 47 in an exterior surface thereof which is in contact with the internal wall of the insulating spacer 34.
A filler overflow preventing recess 46 may be formed around the anode target 33. Accordingly, even though a braising filler made of a metal is diffused to a surface of the anode target during a process of bonding the anode target to the anode electrode by a vacuum braising process, it is possible to prevent a contamination by the filler overflow preventing recess 46.
Referring to
When the coating layer 43 is formed, it is difficult to perform the sputtering process at a heating atmosphere due to a volume of the insulating spacer 34, a phase of a chrome oxide (Cr2O3) may not be properly formed. Accordingly, a post heat treatment process was performed after the sputtering process. For reference, if it is possible to perform the sputtering on the insulating spacer 34, which is formed of an aluminum oxide, at a heating atmosphere at 500° C. or higher, the post heat treatment process may be omitted.
The gate electrode 36 was inserted into the insulating spacer 34 by 10 mm. Further, the alignment protrusion 47 was formed on the exterior surface of the gate electrode 36 so that a distance between the gate electrode 36 and the internal wall of the insulating spacer 34 is 0.5 mm. In the present exemplary embodiment, the X-ray tube was manufactured so that the insertion distance is 10 mm and the spaced distance is 0.5 mm, but the insertion distance and the spaced distance may be changed depending on a tube condition.
The braising adapter 44 was formed of a Kovar alloy. When the insulating spacer 34 is formed of an aluminum oxide and the anode 32 is formed of copper having excellent thermal conductivity, a braising bonding property between the aluminum oxide and the copper is not good. Accordingly, the braising bonding property between the insulating spacer 34 and the anode 32 was improved by forming the braising adapter 44 with the Kovar alloy.
The braising adapter 44 was formed in a structure surrounding a surrounding region of the anode target 33 so as to seal a gap between the anode target 33 and the internal wall of the insulating spacer 34. Accordingly, the electrons, which were emitted from the carbon nano tube emitters 38 and accelerated, or the back scattered electrons were prevented from escaping through the gap between the anode target 33 and the internal wall of the insulating spacer 34.
The electrodes, such as the cathode 31, the gate electrode 36, and the anode 32, and the insulating spacer 34 were bonded by the vacuum braising process. Further, the anode 32 and the anode target 33, and the cathode sheet 39 and the cathode 31 were bonded by the vacuum braising process. The braising filler made of the metal may be diffused to the surface of the anode target 33 and a contamination may be generated during the process of bonding the anode target 33 and the anode 32 by the vacuum braising process, but the contamination was prevented by the filler overflow preventing recess 46.
Referring to
The technical spirit of the present disclosure have been described according to the exemplary embodiment in detail, but the exemplary embodiment has described herein for purposes of illustration and does not limit the present disclosure. Further, those skilled in the art will appreciate that various modifications may be made without departing from the scope and spirit of the present disclosure.
Number | Date | Country | Kind |
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10-2015-0118213 | Aug 2015 | KR | national |
10-2016-0041149 | Apr 2016 | KR | national |
The present application is a divisional of U.S. application Ser. No. 15/230,276, filed Aug. 5, 2016, which claims priority to Korean Patent Application Numbers 10-2015-0118213 filed on Aug. 21, 2015 and 10-2016-0041149 filed on Apr. 4, 2016, in the Korean Intellectual Property Office, the entire disclosure of which is incorporated by reference herein.
Number | Date | Country | |
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Parent | 15230276 | Aug 2016 | US |
Child | 16358370 | US |