A fluidic die is a component of a fluidic system. The fluidic die includes components that manipulate fluid flowing through the system. For example, a fluidic ejection die, which is an example of a fluidic die, includes a number of nozzles that eject fluid onto a surface. The fluidic die also includes non-ejecting actuators such as micro-recirculation pumps that move fluid through the fluidic die. Through these nozzles and pumps, fluid, such as ink and fusing agent among others, is ejected or moved.
The accompanying drawings illustrate various examples of the principles described herein and are part of the specification. The illustrated examples are given merely for illustration, and do not limit the scope of the claims.
Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements. The figures are not necessarily to scale, and the size of some parts may be exaggerated to more clearly illustrate the example shown. Moreover, the drawings provide examples and/or implementations consistent with the description; however, the description is not limited to the examples and/or implementations provided in the drawings.
Fluidic dies, as used herein, may describe a variety of types of integrated devices with which small volumes of fluid may be pumped, mixed, analyzed, ejected, etc. Such fluidic dies may include ejection dies, such as those found in printers, additive manufacturing distributor components, digital titration components, and/or other such devices with which volumes of fluid may be selectively and controllably ejected.
In a specific example, these fluidic systems are found in any number of printing devices such as inkjet printers, multi-function printers (MFPs), and additive manufacturing apparatuses. The fluidic systems in these devices are used for precisely, and rapidly, dispensing small quantities of fluid. For example, in an additive manufacturing apparatus, the fluid ejection system dispenses fusing agent. The fusing agent is deposited on a build material, which fusing agent facilitates the hardening of build material to form a three-dimensional product.
Other fluid systems dispense ink on a two-dimensional print medium such as paper. For example, during inkjet printing, fluid is directed to a fluid ejection die. Depending on the content to be printed, the device in which the fluid ejection system is disposed determines the time and position at which the ink drops are to be released/ejected onto the print medium. In this way, the fluid ejection die releases multiple ink drops over a predefined area to produce a representation of the image content to be printed. Besides paper, other forms of print media may also be used.
Accordingly, as has been described, the systems and methods described herein may be implemented in a two-dimensional printing, i.e., depositing fluid on a substrate, and in three-dimensional printing, i.e., depositing a fusing agent or other functional agent on a material base to form a three-dimensional printed product.
Each fluidic die includes a fluid actuator to eject/move fluid. In a fluidic ejection die, a fluid actuator may be disposed in an ejection chamber, which chamber has an opening. The fluid actuator in this case may be referred to as an ejector that, upon actuation, causes ejection of a fluid drop via the opening.
Fluid actuators may also be pumps. For example, some fluidic dies include microfluidic channels. A microfluidic channel is a channel of sufficiently small size (e.g., of nanometer sized scale, micrometer sized scale, millimeter sized scale, etc.) to facilitate conveyance of small volumes of fluid (e.g., picoliter scale, nanoliter scale, microliter scale, milliliter scale, etc.). Fluidic actuators may be disposed within these channels which, upon activation, may generate fluid displacement in the microfluidic channel.
Examples of fluid actuators include a piezoelectric membrane based actuator, a thermal resistor based actuator, an electrostatic membrane actuator, a mechanical/impact driven membrane actuator, a magneto-strictive drive actuator, or other such elements that may cause displacement of fluid responsive to electrical actuation. A fluidic die may include a plurality of fluid actuators, which may be referred to as an array of fluid actuators.
While such fluidic systems and dies undoubtedly have advanced the field of precise fluid delivery, some conditions impact their effectiveness. For example, the power delivery regime of a fluidic die may not be able to keep up with other technological changes to the fluidic die. For example, as fluidic dies shrink in size to meet consumer demand or as more circuit elements are added between the power source and the array of fluid actuators, power delivery becomes more difficult as there are fewer thin film layers through which power can be delivered and more components that act as a source of parasitic loss. Each of these circumstances may have a deleterious effect on fluidic performance.
For example, the energy a fluid actuator uses to effectuate fluid manipulation is related to the voltage difference across it. Accordingly, a drop in electrical power may affect the fluid actuator's ability to perform an operation such as fluidic ejection or fluidic movement. As a specific numeric example, an actuator array may be optimized to operate when coupled to a 32 V supply signal and a ground signal. However, due to parasitic losses, which may be more prevalent with reduced size components, the supply voltage that is actually seen by an actuator in the array may be 28 V and the power return node at that same actuator may be 3V instead of 0 on ground, due to parasitic rise. Consequently, instead of 32 V across the fluid actuator, there would be 25 V across the fluid actuator. This reduced voltage may result in an actuation of the fluid actuator that is not full strength and thus affects ejection/movement of the fluid, or may not result in any ejection/movement at all. Such losses may be more prevalent at those positions along the array furthest from a power supply or a return, for example, a middle region of a column array.
Accordingly, the present specification is directed to a fluidic die that includes multiple arrays of fluid actuators, each of the arrays being divided into zones of fluid actuators. Components within each zone monitor power delivery to fluid actuators in that zone. If a supply voltage level drops below a threshold value or if a return voltage level rises above a threshold value, a fault signal is sent to global circuitry that informs the printer. The printer could then make any variety of adjustments including adjusting print masks, power settings, or other parameters to bring the power delivery to each zone back to a desired level. Specifically, a controller could increase the supply voltage, reduce the number of nozzles that are fired at the same time, slow down the print speed so that the amount of fluid per area remains the same as before, and increase a pulse width of power delivered to the fluid actuators. As such, a device in which the fluidic die is included, can optimize printing based on actual power delivery to the fluidic die and that is specific to that fluidic die.
Specifically, the present specification describes a fluidic die. The fluidic die includes an array of fluid actuators grouped into zones. Each zone includes a number of fluid actuators and at least one fault detection device. The fault detection device includes 1) a comparator to compare at least one of a representation of a supply voltage and a return voltage supplied to the zone against a voltage threshold and 2) a fault capture device to store an output of the comparator.
The present specification also describes a fluidic die that includes the array of fluid actuators grouped into zones, each zone having a number of fluid actuators. In this example, the fluidic die includes a first fault detection device and a second fault detection device. The first fault detection device includes 1) a first comparator to compare a representation of a supply voltage against a supply voltage threshold and 2) a first fault capture device to store the output of the first comparator. The second fault detection device includes 1) a second comparator to compare a return voltage against a return voltage threshold and 2) a second fault capture device to store the output of the second comparator. The fluidic die includes detection chain logic to combine outputs of each fault capture device such that the contents of all fault capture devices in the array are conveyed in a collective fashion to a controller.
The present specification also describes a method. According to the method, during an evaluation mode 1) a representation of a supply voltage supplied to a zone of fluid actuators is compared against a supply voltage threshold and 2) a return voltage from the zone of fluid actuators is compared against a return voltage threshold. A fault is determined to have occurred in the zone when either 1) the supply voltage is less than the supply voltage threshold or 2) the return voltage is greater than the return voltage threshold. In either case, a signal indicative of a fault in any of the zones is then propagated to a controller of the fluidic die.
In one example, using such a fluidic die 1) allows for immediate detection of power faults at a zone level; 2) reports such faults such that remedial action may be taken; 3) allows for a controller to adjust print masks, power distribution, or other parameters, on the fly to optimize for the actual power delivery limitations of the system; and 4) may leverage circuitry used for other zonal sensing systems such as drive bubble detection systems.
As used in the present specification and in the appended claims, the term “actuator” refers to an ejecting actuator and/or a non-ejecting actuator. For example, an ejecting actuator operates to eject fluid from the fluid ejection die. A recirculation pump, which is an example of a non-ejecting actuator, moves fluid through the fluid slots, channels, and pathways within the fluidic die.
Accordingly, as used in the present specification and in the appended claims, the term “nozzle” refers to an individual component of a fluid ejection die that dispenses fluid onto a surface. The nozzle includes at least an ejection chamber, an ejector actuator, and an opening.
Further, as used in the present specification and in the appended claims, the term “fluidic die” refers to a component of a fluid ejection system that includes a number of fluid actuators. A fluidic die includes fluidic ejection dies and non-ejecting fluidic dies.
Still further, as used in the present specification and in the appended claims, the term “array” refers to a grouping of fluid actuators. A fluidic die may include multiple “arrays.” For example, a fluidic die may include multiple columns, each column forming an array.
Even further, as used in the present specification and in the appended claims, the term “zone” refers to a sub-division of an array. For example, a column of fluid actuators may include multiple zones.
Even further, as used in the present specification and in the appended claims, the term “fault capture device,” refers to an electrical component that can store a signal, such as a logic value. Examples of capture devices include flip-flops such as a set-reset flop, a D flip-flop, and others.
Yet further, as used in the present specification and in the appended claims, the term “fault-indicating output” refers to an output of a comparator that indicates a particular fault. For example, a comparator may generate an output indicating that the supply voltage seen at a zone of fluid actuators is less than a threshold amount, which is indicative of a fault. The comparator may then generate an output indicating this fault.
Even further, as used in the present specification and in the appended claims, the term “fault detection device” refers to hardware components within a zone to determine a fault within that zone. There may be multiple fault detection devices within a zone. For example a first fault detection device may detect and store a supply fault and a second fault detection device may detect and store a return fault.
Finally, as used in the present specification and in the appended claims, the term “a number of” or similar language is meant to be understood broadly as any positive number including 1 to infinity.
Turning now to the figures,
Each array (102) is divided into different zones (104), a zone (104) referring to a sub-grouping of the fluid actuators (106) within a particular array (102). For example, in one column, i.e., array (102), of fluid actuators (106), multiple zones (104) of eight fluid actuators (106) may be present.
The fluidic die (100) includes a number of fluid chambers to hold a volume of the fluid to be move or ejected. The fluid chamber may take many forms. A specific example of such a fluid chamber is an ejection chamber where fluid is held prior to ejection from the fluidic die (100). In another example, the fluid chamber (100) may be a channel, or conduit through which the fluid travels. In yet another example, the fluid chamber (100) may be a reservoir where a fluid is held.
The fluid chambers (100) formed in the fluidic die (100) include fluid actuators (106) disposed therein, which fluid actuators (106) work to eject fluid from, or move fluid throughout, the fluidic die (100). The fluid chambers and fluid actuators (106) may be of varying types. For example, the fluid chamber may be an ejection chamber wherein fluid is expelled from the fluidic die (100) onto a surface for example such as paper or a 3D build bed. In this example, the fluid actuator (106) may be an ejector that ejects fluid through an opening of the fluid chamber.
In another example, the fluid chamber is a channel through which fluid flows. That is, the fluidic die (100) may include an array of microfluidic channels. Each microfluidic channel includes a fluid actuator (106) that is a fluid pump. In this example, the fluid pump, when activated, displaces fluid within the microfluidic channel. While the present specification may make reference to particular types of fluid actuators (106), the fluidic die (100) may include any number and type of fluid actuators (106).
These fluid actuators (106) may rely on various mechanisms to eject/move fluid. For example, an ejector may be a firing resistor. The firing resistor heats up in response to an applied voltage. As the firing resistor heats up, a portion of the fluid in an ejection chamber vaporizes to generate a bubble. This bubble pushes fluid out an opening of the fluid chamber and onto a print medium. As the vaporized fluid bubble collapses, fluid is drawn into the ejection chamber from a passage that connects the fluid chamber to a fluid feed slot in the fluidic die (100), and the process repeats. In this example, the fluidic die (100) may be a thermal inkjet (TIJ) fluidic die (100).
In another example, the fluid actuator (106) may be a piezoelectric device. As a voltage is applied, the piezoelectric device changes shape which generates a pressure pulse in the fluid chamber that pushes the fluid through the chamber. In this example, the fluidic die (100) may be a piezoelectric inkjet (PIJ) fluidic die (100).
As described above, such fluid actuators (106) rely on energy to actuate. The energy seen by fluid actuators (106) is based on a voltage potential across the fluid actuator (106). Accordingly, each zone (104) is coupled to a supply and a return. If 1) the supply voltage seen by a zone (104) is less than a predetermined threshold, 2) the return voltage from the zone (104) is greater than a predetermined threshold, or 3) combinations thereof, the voltage potential across the zone (104) may be less than sufficient to facilitate fluid actuation. Accordingly, the fluid actuators (106) in that zone (104) may underperform, or may not perform at all. Accordingly, each zone (104) includes fault detection devices (108) that detect either kind of fault, i.e., a fault in the supply side or a fault in the return side.
Specifically, a fault detection device (108) determines a fault on a supply side or a return side and includes a comparator (110) and a fault capture device (112). For example, the comparator (110) may compare a representation of a supply voltage supplied to the zone (104) against a supply voltage threshold or may compare a return voltage supplied to the zone (104) against a return voltage threshold. In some examples as depicted in
In another example, additional fault detection devices (108) can be added to analyze different values of voltage differentials. For example, a fluidic die (100) may be supplied with a high voltage, i.e., 32 V, and a low voltage, i.e., 5 V, each with their own returns. In this example, the multiple fault detection devices (108) may analyze the returns corresponding to each supply. Each zone (104), based on its position within the array (102) and based on the fluidic die (100) position, among other fluidic die on a printing system, may see a different supply voltage due to different sources of loss along the path between the source and the zone (104).
Accordingly, as a specific example, the comparator (110) receives as input, a representation of the supply voltage at this zone (104) and also a supply voltage threshold, which threshold is a cutoff for sending an indication of a supply fault to a controller of the fluidic die (100). For example, if the array (102) is supplied with a supply voltage of 32 V, the supply voltage threshold may be set at 28 V. In this example, the comparator (110) compares the supply voltage seen at the zone (104), which may be less than 32 V, against the supply voltage threshold of 28 V. If the supply voltage drops below the threshold value, a fault-indicating output is passed to the fault capture device (112). Similarly, if the supply voltage seen at the zone (104) does not drop below the threshold value, a non-fault indicating output is passed to the fault capture device (112).
In another example, the fault detection device (108) determines a fault by analyzing a return side of the voltage differential. In this example, the comparator (110) compares a return voltage from the zone (104) against a return voltage threshold. That is, the comparator (110) receives as input, the return voltage leaving this zone (104) and also a return voltage threshold, which threshold is a cutoff for sending an indication of a return fault to a controller of the fluidic die (100). For example, if the array (102) is grounded to 0 V, the return voltage threshold may be set at 3 V. In this example, the comparator (110) compares the return voltage seen at the zone (104), which may be greater than 0 V due to parasitic losses on the return supply line, and compares it against the return voltage threshold of 3 V. If the return voltage rises above the threshold value, a fault indicating output is passed to the capture device (112). Similarly, if the return voltage seen at the zone (104) does not rise above the threshold value, a non-fault indicating output is passed to the capture device (112).
In other words, the fault detection device (108) outputs a signal indicating a fault based on a fault-indicating output of the comparator (110) or that the corresponding zone (104) is in a non-fault state. In this case, the fault-indicating output indicates either 1) that the supply voltage at the zone (104) is less than the supply voltage threshold or 2) that the return voltage at the zone (104) is greater than the return voltage threshold. In one example, the representation of the supply voltage may be the supply voltage, unaltered. In another example, the supply voltage may be scaled, or reduced. An example of a reduced representation of the supply voltage is provided in connection with
Note that in this example, the fault detection device (108) can determine a fault either based on a supply voltage or a return voltage within the zone (104). Making such a determination based on just one side of the voltage differential is beneficial in that it reduces the circuitry on a fluidic die (100). Moreover, as the voltage differential between supply and threshold and return and threshold are mirrors, an overall drop in voltage differential based on the supply voltage and return voltage can be determined.
The fault capture device (112) is a component of the fault detection device (108) that receives the output of the comparator (110). The fault capture device (112) in some examples may be coupled to logic on the fluidic die (100) that aggregates data stored in other fault capture devices (112) such that an output of a detection chain indicates whether a fault is present on any of the zones (104) within the array (102).
Such a fluidic die (100) accounts for drops of power by providing an indication when power levels along the fluidic die (100) are insufficient to effectuate proper fluid actuation. For example, when, due to any number of circumstances, a particular zone (104) does not have sufficient voltage potential between its supply and return terminals to actuate fluid as configured, the fault detection device (108) is triggered and an output passed to a controller of the fluidic die (100) such that a remedial action, such as adjusting the print mask, power distribution, print speed, or firing parameters can be carried out.
Moreover, as described above, each zone (104) includes a number of fluid actuators (106). For simplicity, in
As described above, in some examples, the fluidic die (
Accordingly, in a first fault detection device (108-1), the supply voltage, Vpp, and a supply voltage threshold, Vpp threshold, are passed to a first comparator (110-1). Note that the same voltage supply threshold, Vpp threshold, is passed to each zone (104) in an array (
The fluidic die (100) also includes a detection chain (214) that has an output that indicates a fault in any of the zones (104) on the fluidic die (
As noted the representation of the supply voltage, Vpp, may include the actual supply voltage itself or a scaled version. The scaled version may be desirable for example, when the first comparator (
Still during this evaluation period, the return voltage, Vreturn, from a particular zone (
With these comparisons (block 301, 302) made, the system can determine (block 303) a fault in the zone (
A signal indicative of a fault in any of the zones (
An example of the operation of this example is now provided. Prior to any fault detection, an output of each comparator (110-1, 110-2) may indicate expected operation, in this example represented by logic “0.” This value is passed to the “S” terminal of the S-R flops (416-1, 416-2) and set on the output terminal “Q.” As described above, each fault detection device (
In this example, the first comparator (110-1) has its “+” terminal connected to the supply threshold voltage, Vpp threshold, which is provided globally to all zones (104). The“−” terminal of the first comparator (110-1) is connected to the representation of the supply voltage, Vpp. Note that in some examples, each fault detection device (
During operation, the first comparator (110-1) maintains a “0” logic, indicating expected operation, i.e., that the supply voltage, Vpp, at the zone (104) is greater than or equal to the supply voltage threshold, Vpp threshold. In the event that the supply voltage, Vpp, falls below the threshold, Vpp threshold, the output of the first comparator (110-1) will transition from a “O” to a “1” causing the S-R flop (416-1) to be set to a “1” and output that “1” along the “Q” terminal to be processed at the OR gate (418). This “1” indicating a supply fault will be communicated to the global die logic, and possibly to the printer, via a communication signal line that combines the fault signals from the S-R flops (416) of each zone (104). This “1” will remain on the first S-R flop (416-1) until the first S-R flop (416-1) is reset. That is, each fault detection device (
In this example, the second comparator (110-2) has its “−” terminal connected to the return threshold voltage, Vreturn threshold, which is provided globally to all zones (104). The “+” terminal of the second comparator (110-2) is connected to the return voltage, Vreturn, which may first pass through a low pass filter (420-2).
During operation, the second comparator (110-2) maintains a “0” logic, indicating expected operation, i.e., that the return voltage, Vreturn, from the zone (104) is less than or equal to the return voltage threshold, Vreturn threshold. In the event that the return voltage, Vreturn, rises above the threshold, Vreturn threshold, the output of the second comparator (110-2) will transition from a “0” to a “1” causing the second S-R flop (416-2) to be set to a “1” and output that “1” along the “Q” terminal to be processed at the OR gate (418). This “1” indicating a return fault will be communicated to the global die logic, and possibly to the printer, via a communication signal line that combines the fault signals from the S-R flops (416) of each zone (104). This “1” will remain on the second S-R flop (416-2) until the second S-R flop (416-2) is reset.
An example of the operation of this example is now provided. Prior to any fault detection, an output of each comparator (110-1, 110-2) may indicate expected operation, in this example represented by logic “0.” This output of the comparator (110) is coupled to the clock signal of the D-flops (522-1, 522-2). Note that in this example, the low pass filters (420-1, 420-2) are coupled to the output of the comparators (110-1, 110-2), but having the same effect of filtering out noise and preventing false indications of fault.
As described above, each fault detection device (
In this example, the first comparator (110-1) has its “+” terminal connected to the VPP threshold voltage, Vpp threshold, which is provided globally to all zones (104). The“−” terminal of the first comparator (110-1) is connected to the representation of the supply voltage, Vpp.
During operation, the first comparator (110-1) maintains a “0” logic, indicating expected operation, i.e., that the supply voltage, Vpp, at the zone (104) is greater than or equal to the supply voltage threshold, Vpp threshold. In the event that the supply voltage, Vpp, falls below the threshold, Vpp threshold, the output of the first comparator (110-1) will transition from a “0” to a “1” causing the first D-flop (522-1) to clock in a “1” which will then appear on the output “Q” terminal of the first D-flop (522-1). This “1” indicating a supply fault will be communicated to the global die logic, and possibly to the printer, via a communication signal line that combines the fault signals from the D-flops (522) of each zone (104). This “1” will remain on the first D-flop (522-1) until the first D-flop (522-1) is reset. That is, each fault detection device (
In this example, the second comparator (110-2) has its “−” terminal connected to the Vreturn threshold voltage, Vreturn threshold, which is provided globally to all zones (104). The “+” terminal of the second comparator (110-2) is connected to the return voltage, Vreturn.
During operation, the second comparator (110-2) maintains a “0” logic, indicating expected operation, i.e., that the return voltage, Vreturn, from the zone (104) is less than or equal to the return voltage threshold, Vreturn threshold. In the event that the return voltage, Vreturn, rises above the threshold, Vreturn threshold, the output of the second comparator (110-2) will transition from a “0” to a “1” causing the second D-flop (522-2) to clock in a “1” which will then appear on the output “Q” terminal of the second D-flop (522-2) and output that “1” along the “Q” terminal to be processed at the OR gate (418). This “1” indicating a return fault will be communicated to the global die logic, and possibly to the printer, via a communication signal line that combines the fault signals from the D flops (522) of each zone (104). This “1” will remain on the second D flop (522-2) until the second D-flop (522-2) is reset.
In some examples, the fire pulse may provide power such that multiple fluid actuators (
Power delivery system specifications are most likely to be violated, i.e. Vpp drops or Vreturn rises may exceed a threshold, when the maximum number of fluid actuators (
Accordingly, in some examples, the comparison of the supply voltage and return voltage at the zone (
Once initialized, the fault detection devices (
In some examples, each fault detection device (
Such a method (600) of performing actuator evaluation during a predetermined, worst case, period of time provides power savings as the fault detection device (
Corrective actions may then be executed (block 607) based on an indication of the fault. For example, print masks, power settings, print speeds, firing parameters, and other parameters may be adjusted. In one example, the corrective action includes providing a notification to a printer or a user such that manual corrective actions such as maintenance or replacement may occur. Following such corrective action, the fault capture devices (
Turning to
Turning to
In one example, using such a fluidic die 1) allows for immediate detection of power faults at a zone level; 2) reports such faults such that remedial action may be taken; 3) allows for a controller to adjust print masks, power distribution, or other parameters, on the fly to optimize for the actual power delivery limitations of the system; and 4) may leverage circuitry used for other zonal sensing systems such as drive bubble detection systems.
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/US2018/020876 | 3/5/2018 | WO | 00 |