AaltoSemi Inc.

Organization

Nanjing City, CN

Organizations

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Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250022723
- Publication date Jan 16, 2025
- AaltoSemi Inc.
- Min-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20250014989
- Publication date Jan 9, 2025
- AaltoSemi Inc.
- Jiun-Hua CHIUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282683
- Publication date Aug 22, 2024
- AaltoSemi Inc.
- Yin-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20240282590
- Publication date Aug 22, 2024
- AaltoSemi Inc.
- Min-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240243048
- Publication date Jul 18, 2024
- AaltoSemi Inc.
- Andrew C. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20240213137
- Publication date Jun 27, 2024
- AaltoSemi Inc.
- Andrew C. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20240096776
- Publication date Mar 21, 2024
- AaltoSemi Inc.
- Andrew C. CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096721
- Publication date Mar 21, 2024
- AaltoSemi Inc.
- Chien-Kuang LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE SUBSTRATE
- Publication number 20240021438
- Publication date Jan 18, 2024
- AaltoSemi Inc.
- Andrew C. CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230298986
- Publication date Sep 21, 2023
- AaltoSemi Inc.
- Min-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230290744
- Publication date Sep 14, 2023
- AaltoSemi Inc.
- Min-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20230282556
- Publication date Sep 7, 2023
- AaltoSemi Inc.
- Min-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS

AaltoSemi Inc.

Organization

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

PACKAGE SUBSTRATE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGE SUBSTRATE

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE