Accretech USA, Inc.

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Oakland, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for shaping thin films in the near-edge regions of in-pro...
- Patent number 6,936,546
- Issue date Aug 30, 2005
- Accretech USA, Inc.
- Michael D. Robbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for polishing the edge of a bonded wafer
- Patent number 6,641,464
- Issue date Nov 4, 2003
- Accretech USA, Inc.
- Robert E. Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Machine for grinding-polishing of a water edge
- Patent number 6,629,875
- Issue date Oct 7, 2003
- Accretech USA, Inc.
- Robert E. Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Method for measuring wafer thickness
- Patent number 6,473,987
- Issue date Nov 5, 2002
- Accretech USA, Inc.
- Robert E. Steere
- G01 - MEASURING TESTING