ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

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SAN JOSE, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Electrical redundancy for bonded structures
- Patent number 12,218,107
- Issue date Feb 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with conductive feature and method of forming same
- Patent number 12,211,809
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier collar for interconnects
- Patent number 12,198,981
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 12,199,069
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
- Patent number 12,191,233
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies including signal redistribution and m...
- Patent number 12,191,235
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,191,234
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
- Patent number 12,183,659
- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manifold designs for embedded liquid cooling in a package
- Patent number 12,176,264
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assembly including coolant channel on the backsi...
- Patent number 12,176,263
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level bonding of obstructive elements
- Patent number 12,176,303
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure with interconnect structure
- Patent number 12,176,294
- Issue date Dec 24, 2024
- Adeia Semiconductor Bonding Technologies, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Security circuitry for bonded structures
- Patent number 12,174,246
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for low temperature device bonding
- Patent number 12,154,880
- Issue date Nov 26, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded optical devices
- Patent number 12,153,222
- Issue date Nov 26, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structures for making direct metal-to-metal bonds at low temp...
- Patent number 12,136,605
- Issue date Nov 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,132,020
- Issue date Oct 29, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 12,125,784
- Issue date Oct 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,113,056
- Issue date Oct 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,100,676
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Direct gang bonding methods including directly bonding first elemen...
- Patent number 12,080,672
- Issue date Sep 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 12,068,278
- Issue date Aug 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 12,051,621
- Issue date Jul 30, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical redundancy for bonded structures
- Patent number 12,046,583
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,046,482
- Issue date Jul 23, 2024
- Adeia Semiconductor Bonding Technologies, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device packages with integrated device die and dummy ele...
- Patent number 12,046,569
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAVILY DOPED SEMICONDUCTOR DEVICES FOR POWER DISTRIBUTION
- Publication number 20250054854
- Publication date Feb 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COOLING STRUCTURES
- Publication number 20250054837
- Publication date Feb 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Thomas WORKMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED OPTICAL DEVICES
- Publication number 20250044598
- Publication date Feb 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250046625
- Publication date Feb 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERALLY UNCONFINED STRUCTURE
- Publication number 20250029919
- Publication date Jan 23, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET-TO-CHIPLET PROTOCOL SWITCH
- Publication number 20250006642
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING METHODS AND DEVICE ASSEMBLIES FORMED USING THE SAME
- Publication number 20250006672
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR BONDING DIES
- Publication number 20250006689
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250006617
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Xu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY BONDED OPTICAL COMPONENTS
- Publication number 20250004197
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- G02 - OPTICS
Information Patent Application
EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250006632
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Xu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MATERIALS FOR DIRECT BONDING
- Publication number 20250006679
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...
- Publication number 20250006520
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER FOR INTERCONNECTS
- Publication number 20240429094
- Publication date Dec 26, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20240404990
- Publication date Dec 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387324
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387323
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT GANG BONDING METHODS AND STRUCTURES
- Publication number 20240387439
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20240379539
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20240371850
- Publication date Nov 7, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR DEVICE PACKAGES AND METHODS OF COOLING...
- Publication number 20240332128
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BONDING IN TOPOGRAPHIC PACKAGES
- Publication number 20240332231
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BONDING IN TOPOGRAPHIC PACKAGES
- Publication number 20240332248
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING ON BURIED POWER RAILS
- Publication number 20240332183
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING BACKSIDE POWER/GROUND DELIV...
- Publication number 20240332129
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

Organization

Patents Grantslast 30 patents

Electrical redundancy for bonded structures

Structure with conductive feature and method of forming same

TSV as pad

Diffusion barrier collar for interconnects

Heterogeneous annealing method and device

Embedded liquid cooling

Embedded cooling systems and methods of manufacturing embedded cool...

Integrated cooling assemblies including signal redistribution and m...

Integrated cooling assemblies for advanced device packaging and met...

Embedded cooling assemblies for advanced device packaging and metho...

Manifold designs for embedded liquid cooling in a package

Integrated cooling assembly including coolant channel on the backsi...

Wafer-level bonding of obstructive elements

Bonded structure with interconnect structure

Security circuitry for bonded structures

Method and structures for low temperature device bonding

Bonded optical devices

Layer structures for making direct metal-to-metal bonds at low temp...

Low temperature bonded structures

Interconnect structures

Stacked dies and methods for forming bonded structures

Low temperature bonded structures

Bonded structures

Direct gang bonding methods including directly bonding first elemen...

Processed stacked dies

Bonded structures with integrated passive component

Microelectronic assembly from processed substrate

Electrical redundancy for bonded structures

Microelectronic assemblies

Integrated device packages with integrated device die and dummy ele...

Patents Applicationslast 30 patents

HEAVILY DOPED SEMICONDUCTOR DEVICES FOR POWER DISTRIBUTION

ELECTRONIC DEVICE COOLING STRUCTURES

BONDED OPTICAL DEVICES

MICROELECTRONIC ASSEMBLIES

INTEGRATED CIRCUITS WITH CAPACITORS

LATERALLY UNCONFINED STRUCTURE

CHIPLET-TO-CHIPLET PROTOCOL SWITCH

HYBRID BONDING METHODS AND DEVICE ASSEMBLIES FORMED USING THE SAME

STRUCTURES AND METHODS FOR BONDING DIES

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK

DIRECTLY BONDED OPTICAL COMPONENTS

EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK

CONDUCTIVE MATERIALS FOR DIRECT BONDING

APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...

DIFFUSION BARRIER FOR INTERCONNECTS

PROCESSED STACKED DIES

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

DIRECT GANG BONDING METHODS AND STRUCTURES

INTERCONNECT STRUCTURES

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

TECHNIQUES FOR PROCESSING DEVICES

EMBEDDED COOLING SYSTEMS FOR DEVICE PACKAGES AND METHODS OF COOLING...

DIRECT HYBRID BONDING IN TOPOGRAPHIC PACKAGES

DIRECT HYBRID BONDING IN TOPOGRAPHIC PACKAGES

DIRECT BONDING ON BURIED POWER RAILS

INTEGRATED COOLING ASSEMBLIES INCLUDING BACKSIDE POWER/GROUND DELIV...

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