ADL Engineering Inc.

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Hukou Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package having a supporting board and package carrier th...
- Patent number 9,865,561
- Issue date Jan 9, 2018
- ADL ENGINEERING INC.
- En-Min Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, package carrier, and method of manufacturing pa...
- Patent number 9,603,246
- Issue date Mar 21, 2017
- ADL ENGINEERING INC.
- En-Min Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 8,749,048
- Issue date Jun 10, 2014
- ADL Engineering Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line structure and the method of forming the same
- Patent number 8,637,402
- Issue date Jan 28, 2014
- ADL Engineering Inc.
- Yu-Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional system-in-package package-on-package structure
- Patent number 8,619,431
- Issue date Dec 31, 2013
- ADL Engineering Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure
- Patent number 8,304,923
- Issue date Nov 6, 2012
- ADL Engineering Inc.
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molding system and method of chip package
- Patent number 8,293,572
- Issue date Oct 23, 2012
- ADL Engineering Inc.
- Wen-Chuan Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND PACKAGE CARRIER
- Publication number 20170170138
- Publication date Jun 15, 2017
- ADL ENGINEERING INC.
- EN-MIN JOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGE CARRIER, AND METHODS OF MANUFACTURING E...
- Publication number 20150262927
- Publication date Sep 17, 2015
- ADL ENGINEERING INC.
- CHENG-YU KANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC PACKAGE, PACKAGE CARRIER, AND METHOD OF MANUFACTURING PA...
- Publication number 20150162275
- Publication date Jun 11, 2015
- ADL ENGINEERING INC.
- EN-MIN JOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding in a Package Module
- Publication number 20120188727
- Publication date Jul 26, 2012
- ADL Engineering Inc.
- Nan-Chun LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDING SYSTEM AND METHOD OF CHIP PACKAGE
- Publication number 20120187582
- Publication date Jul 26, 2012
- ADL Engineering Inc.
- Wen-Chuan Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
THREE-DIMENSIONAL SYSTEM-IN-PACKAGE PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20120161315
- Publication date Jun 28, 2012
- ADL Engineering Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks