Adv. Chip Eng. Tech., Inc.

Follow

Organization

Organizations

Please log in for detailed analytics

Patents Applicationslast 30 patents

Information Patent Application
Under bump metallurgy structure of a package and method of making same
- Publication number 20080169539
- Publication date Jul 17, 2008
- Silicon Storage Tech., Inc.
- Sychyi Fang
- H01 - BASIC ELECTRIC ELEMENTS