Advanced Interconnect Technology Inc.

Organization

Islip, NY, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Edge connectable metal package
- Patent number 6,300,673
- Issue date Oct 9, 2001
- Advanced Interconnect Technologies, Inc.
- Paul R. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array electronic package
- Patent number 6,262,477
- Issue date Jul 17, 2001
- Advanced Interconnect Technologies
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed heat spreader with seal ring
- Patent number 6,188,130
- Issue date Feb 13, 2001
- Advanced Technology Interconnect Incorporated
- German Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with molded plastic body
- Patent number 5,969,414
- Issue date Oct 19, 1999
- Advanced Technology Interconnect Incorporated
- Arvind Parthasarathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum alloys for electronic components
- Patent number 5,952,083
- Issue date Sep 14, 1999
- Advanced Technology Interconnect, Inc.
- Arvind Parthasarathi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal ball grid electronic package having improved solder joint
- Patent number 5,952,719
- Issue date Sep 14, 1999
- Advanced Interconnect Technologies, Inc.
- Peter W. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance package for integrated circuit chip
- Patent number 5,939,214
- Issue date Aug 17, 1999
- Advanced Technology Interconnect, Incorporated
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the manufacture of straw tube drift chambers
- Patent number 5,071,381
- Issue date Dec 10, 1991
- Advanced Interconnect Technology Inc.
- Leonard Schieber
- H01 - BASIC ELECTRIC ELEMENTS

Advanced Interconnect Technology Inc.

Organization

Patents Grantslast 30 patents

Edge connectable metal package

Ball grid array electronic package

Exposed heat spreader with seal ring

Semiconductor package with molded plastic body

Aluminum alloys for electronic components

Metal ball grid electronic package having improved solder joint

Thermal performance package for integrated circuit chip

Process for the manufacture of straw tube drift chambers