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ADVANCED SEMICONDUCOR ENGINEERING, INC.
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Kaohsiung, TW
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Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,062,994
Issue date
Jul 13, 2021
ADVANCED SEMICONDUCOR ENGINEERING, INC.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package device and method of manufacturing the same
Patent number
11,024,569
Issue date
Jun 1, 2021
ADVANCED SEMICONDUCOR ENGINEERING, INC.
Jen-Kuang Fang
H01 - BASIC ELECTRIC ELEMENTS
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Substrate for packaging IC device and method for manufacturing the...
Publication number
20050167804
Publication date
Aug 4, 2005
ADVANCED SEMICONDUCOR ENGINEERING, INC.
Yung Teng Pan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR