ADVENTIVE IPBANK

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Luxembourg, LU

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Patents Grantslast 30 patents

Information Patent Grant
Universal surface-mount semiconductor package
- Patent number 10,615,146
- Issue date Apr 7, 2020
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating low-profile footed power package
- Patent number 10,312,111
- Issue date Jun 4, 2019
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D bendable printed circuit board with redundant interconnections
- Patent number 10,064,276
- Issue date Aug 28, 2018
- ADVENTIVE IPBANK
- Richard K. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal surface-mount semiconductor package
- Patent number 10,032,744
- Issue date Jul 24, 2018
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating low-profile footed power package
- Patent number 10,032,649
- Issue date Jul 24, 2018
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile leaded semiconductor package and method of fabricating...
- Patent number 10,008,438
- Issue date Jun 26, 2018
- ADVENTIVE IPBANK
- Richard K Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile footed power package
- Patent number 9,620,439
- Issue date Apr 11, 2017
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile leaded semiconductor package
- Patent number 9,576,884
- Issue date Feb 21, 2017
- ADVENTIVE IPBANK
- Richard K Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal surface-mount semiconductor package
- Patent number 9,576,932
- Issue date Feb 21, 2017
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS

ADVENTIVE IPBANK

Organization

Patents Grantslast 30 patents

Universal surface-mount semiconductor package

Method of fabricating low-profile footed power package

3D bendable printed circuit board with redundant interconnections

Universal surface-mount semiconductor package

Method of fabricating low-profile footed power package

Low profile leaded semiconductor package and method of fabricating...

Low-profile footed power package

Low profile leaded semiconductor package

Universal surface-mount semiconductor package

Patents Applicationslast 30 patents

Trademarklast 30 trademarks