Alpine Microsystems, Inc.

Organization

Campbell, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Thin film capacitor having multi-layer dielectric film including si...
- Patent number 6,620,673
- Issue date Sep 16, 2003
- Alpine Microsystems, Inc.
- Mike LaFleur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an integrated circuit having reduced thermal st...
- Patent number 6,436,735
- Issue date Aug 20, 2002
- Alpine Microsystems, Inc.
- Martin P. Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits packaging system and method
- Patent number 6,400,575
- Issue date Jun 4, 2002
- Alpine Microsystems, LLC
- Sammy K. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level burn-in
- Patent number 6,337,576
- Issue date Jan 8, 2002
- Alpine Microsystems, Inc.
- Andrew K. Wiggin
- G01 - MEASURING TESTING
Information Patent Grant
Module and method for interconnecting integrated circuits that faci...
- Patent number 6,300,161
- Issue date Oct 9, 2001
- Alpine Microsystems, Inc.
- Martin P. Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for packaging integrated circuits
- Patent number 6,175,161
- Issue date Jan 16, 2001
- Alpine Microsystems, Inc.
- Martin P. Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional mounting assembly for integrated circuits
- Patent number 6,128,201
- Issue date Oct 3, 2000
- Alpine Microsystems, Inc.
- Sammy K. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for routing connections of integrated circuits
- Patent number 6,075,711
- Issue date Jun 13, 2000
- Alpine Microsystems, Inc.
- Sammy K. Brown
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thin film capacitor having multi-layer dielectric film including si...
- Publication number 20040113194
- Publication date Jun 17, 2004
- Alpine Microsystems, Inc.
- Mike LaFleur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR HAVING MULTI-LAYER DIELECTRIC FILM INCLUDING SI...
- Publication number 20030170950
- Publication date Sep 11, 2003
- Alpine Microsystems, Inc.
- Mike LaFleur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-ported memory
- Publication number 20030056061
- Publication date Mar 20, 2003
- Alpine Microsystems, Inc.
- David L. Sherman
- G11 - INFORMATION STORAGE

Trademarklast 30 trademarks

Information Trademark
75902014 - DIRECTACCESS
- Serial number 75902014
- Filing date Jan 24, 2000
- Alpine Microsystems, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75902034 - DIRECTATTACH
- Serial number 75902034
- Filing date Jan 24, 2000
- Alpine Microsystems, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75188748 - MICROPALLET
- Serial number 75188748
- Filing date Oct 28, 1996
- Alpine Microsystems, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75188745 - MICROBOARD
- Serial number 75188745
- Registration number 2552857
- Filing date Oct 28, 1996
- Alpine Microsystems, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Alpine Microsystems, Inc.

Organization

Patents Grantslast 30 patents

Thin film capacitor having multi-layer dielectric film including si...

Method for mounting an integrated circuit having reduced thermal st...

Integrated circuits packaging system and method

Wafer-level burn-in

Module and method for interconnecting integrated circuits that faci...

System and method for packaging integrated circuits

Three dimensional mounting assembly for integrated circuits

System and method for routing connections of integrated circuits

Patents Applicationslast 30 patents

Thin film capacitor having multi-layer dielectric film including si...

THIN FILM CAPACITOR HAVING MULTI-LAYER DIELECTRIC FILM INCLUDING SI...

Multi-ported memory

Trademarklast 30 trademarks

75902014 - DIRECTACCESS

75902034 - DIRECTATTACH

75188748 - MICROPALLET

75188745 - MICROBOARD